Laser apparatus, laser irradiation method, and manufacturing method of semiconductor device
    61.
    发明申请
    Laser apparatus, laser irradiation method, and manufacturing method of semiconductor device 有权
    激光装置,激光照射方法以及半导体装置的制造方法

    公开(公告)号:US20090016393A1

    公开(公告)日:2009-01-15

    申请号:US12000814

    申请日:2007-12-18

    IPC分类号: H01S3/22 H01S3/00

    CPC分类号: H01S3/131 B23K26/702

    摘要: It is an object to provide a laser apparatus, a laser irradiating method and a manufacturing method of a semiconductor device that make laser energy more stable. To attain the object, a part of laser beam emitted from an oscillator is sampled to generate an electric signal that contains as data energy fluctuation of a laser beam. The electric signal is subjected to signal processing to calculate the frequency, amplitude, and phase of the energy fluctuation of the laser beam. The transmittance of a light amount adjusting means is controlled in order that the transmittance changes in antiphase to the phase of the energy fluctuation of the laser beam and with an amplitude capable of reducing the amplitude of laser beam emitted from the oscillator, the control being made based on the phase difference between the phase of a signal that is in synchronization with oscillation of laser beam emitted from the oscillator and the phase calculated, on the energy ratio of the sampled laser beam to laser beam emitted from the oscillator, and on the frequency and amplitude calculated. In the light amount adjusting means, energy of the laser beam oscillated from the oscillator energy is adjusted.

    摘要翻译: 本发明的目的是提供使激光能更稳定的半导体器件的激光装置,激光照射方法和制造方法。 为了达到该目的,从振荡器发射的激光束的一部分被采样以产生包含作为激光束的数据能量波动的电信号。 对信号进行信号处理,计算激光束的能量波动的频率,振幅和相位。 控制光量调节装置的透射率,以便透射率与激光束的能量波动的相位相反,并且能够减小从振荡器发射的激光束的振幅的振幅,进行控制 基于与从振荡器发射的激光束的振荡同步的信号的相位与计算的相位之间的相位差相对于从采样的激光束到从振荡器发射的激光束的能量比,以及频率 并计算振幅。 在光量调节装置中,调整从振荡器能量振荡的激光束的能量。

    Laser beam irradiation method
    65.
    发明授权
    Laser beam irradiation method 有权
    激光束照射法

    公开(公告)号:US06767799B2

    公开(公告)日:2004-07-27

    申请号:US10324051

    申请日:2002-12-20

    IPC分类号: H01L2100

    摘要: A laser beam irradiation method that achieves uniform crystallization, even if a film thickness of an a-Si film or the like fluctuates, is provided. The present invention provides a laser beam irradiation method in which a non-single crystal semiconductor film is formed on a substrate having an insulating surface and a laser beam having a wavelength longer than 350 nm is irradiated to the non-single crystal semiconductor film, thus crystallizing the non-single crystal silicon film. The non-single crystal semiconductor film has a film thickness distribution within the surface of the substrate, and a differential coefficient of a laser beam absorptivity with respect to the film thickness of the non-single crystal semiconductor film is positive.

    摘要翻译: 即使a-Si膜的膜厚等发生波动,也能够实现均匀结晶化的激光束照射方法。 本发明提供一种激光束照射方法,其中在具有绝缘面的基板上形成非单晶半导体膜,并且将具有波长超过350nm的激光束照射到非单晶半导体膜上,因此 使非单晶硅膜结晶。 非单晶半导体膜在基板的表面内具有膜厚分布,并且相对于非单晶半导体膜的膜厚度的激光束吸收率的微分系数为正。

    Method of manufacturing semiconductor device
    67.
    发明授权
    Method of manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07989316B2

    公开(公告)日:2011-08-02

    申请号:US12824775

    申请日:2010-06-28

    IPC分类号: H01L21/30

    摘要: To provide a method of manufacturing a semiconductor device in which the space between semiconductor films transferred at plural locations is narrowed. A first bonding substrate having first projections is attached to a base substrate. Then, the first bonding substrate is separated at the first projections so that first semiconductor films are formed over the base substrate. Next, a second bonding substrate having second projections is attached to the base substrate so that the second projections are placed in regions different from regions where the first semiconductor films are formed. Subsequently, the second bonding substrate is separated at the second projections so that second semiconductor films are formed over the base substrate. In the second bonding substrate, the width of each second projection in a direction (a depth direction) perpendicular to the second bonding substrate is larger than the film thickness of each first semiconductor film formed first.

    摘要翻译: 提供一种制造半导体器件的方法,其中在多个位置处转移的半导体膜之间的空间变窄。 具有第一突起的第一接合衬底附接到基底衬底。 然后,第一接合基板在第一突起处分离,使得第一半导体膜形成在基底基板上。 接下来,具有第二突起的第二接合基板被附接到基底基板,使得第二突起被放置在与形成第一半导体膜的区域不同的区域中。 随后,第二接合基板在第二突起处分离,使得第二半导体膜形成在基底基板上。 在第二接合基板中,与第二接合基板垂直的方向(深度方向)上的每个第二突起的宽度大于首先形成的第一半导体膜的膜厚。