公开(公告)号：US20100025480A1

公开(公告)日：2010-02-04

申请号：US12442968

申请日：2007-03-30

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Hironori Iwasaki ,  Hideo Koike ,  Tamaki Wada ,  Takashi Totsuka

IPC分类号： G06K19/067 ,  H01R13/62

CPC分类号： G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.

摘要翻译： 提供了一种能够根据用户要求实现存储容量的大的可扩展性，存储容量和成本负担的IC技术。 本发明的IC卡是安装有闪存的闪存卡306，其特征在于，闪存卡306可以被插入到插入式SIM适配器305a和/或迷你UICC适配器305b中， 安全IC，将闪存卡306插入到插入式SIM适配器305a或迷你UICC适配器305b中，从而作为附接有扩展存储器的SIM卡或附带有扩展存储器的迷你UICC操作闪存卡 306可以从插件SIM适配器305a或迷你UICC适配器305b物理地移除。

公开(公告)号：US20100267419A1

公开(公告)日：2010-10-21

申请号：US12746918

申请日：2007-12-10

申请人： Hirotaka Nishizawa ,  Hironori Iwasaki ,  Hideo Koike ,  Junichiro Osako ,  Tamaki Wada ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Hironori Iwasaki ,  Hideo Koike ,  Junichiro Osako ,  Tamaki Wada ,  Takashi Totsuka

IPC分类号： H04W88/02

CPC分类号： G06K7/0021 ,  G06K7/10237 ,  G06K19/07 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01R31/06 ,  H05K5/0282 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In an IC card, there is provided a technique capable of large expandability of a memory volume, and a memory volume and a cost matched with a user's requirement. A SIM adapter 101 has a top panel 104 for covering a recess portion. In the top panel 104, when a memory card 103 is not inserted, the top panel 104 is positioned at a first height, and, when the memory card 103 is inserted, a part of the top panel 104 is engaged with a part of the SIM adapter 101 so that the top panel is latched at a second height higher than the first height. Also, into a SIM adapter, a top panel for fixing a memory card when the memory card is inserted is inserted, and a part of the top panel is engaged with a part of the SIM adapter so that the top panel is latched when the memory card is inserted. Further, into a SIM adapter, a top panel for fixing a memory card when the memory card is inserted is inserted, and the top panel has a terminal strip contacting with both of a terminal of the SIM adapter and a terminal of the memory card so that the terminal strip electrically connects between both of them.

摘要翻译： 在IC卡中，提供了一种能够大容量地扩展存储器容量以及与用户需求相匹配的存储器容量和成本的技术。 SIM适配器101具有用于覆盖凹部的顶板104。 在顶板104中，当没有插入存储卡103时，顶板104位于第一高度，并且当插入存储卡103时，顶板104的一部分与一部分 SIM适配器101，使得顶板在比第一高度高的第二高度处被闩锁。 另外，在SIM卡适配器中，插入存储卡时用于固定存储卡的顶板被插入，并且顶板的一部分与SIM适配器的一部分接合，使得顶板在存储器 插入卡。 此外，在SIM适配器中，插入存储卡时用于固定存储卡的顶板，并且顶板具有与SIM适配器的端子和存储卡的端子两者接触的端子排，因此 端子条在它们之间电连接。

公开(公告)号：US20080300020A1

公开(公告)日：2008-12-04

申请号：US12116956

申请日：2008-05-08

申请人： Hirotaka Nishizawa ,  Hideo Koike ,  Hironori Iwasaki ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Hideo Koike ,  Hironori Iwasaki ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada

IPC分类号： H04M1/00

CPC分类号： H04W8/20 ,  H04L63/0853 ,  H04W12/06

摘要： The loss of data stored in a secure memory card, such as a SIM card, due to the physical destruction thereof is prevented. A host unit performs card authentication of a memory card, and transmits update data for the memory card by security communication to update data when the result of the authentication is OK. Then, the host unit outputs a request for mirror-updating the card data to a base station server. When an access is permitted, the card data is transmitted to the base station server via the host unit to mirror-update the card data. When the mirror-updating of the card data is completed, the base station server returns a completion confirmation to the host unit, so that a data backup process is completed. By thus causing the base station server to mirror-update the data in the memory card, the loss of the stored data is prevented.

摘要翻译： 防止存储在安全存储卡（例如SIM卡）中的数据由于其物理破坏而丢失。 主机单元执行存储卡的卡认证，并且当认证结果正常时通过安全通信发送存储卡的更新数据以更新数据。 然后，主机单元向基站服务器输出镜像更新卡数据的请求。 当允许访问时，卡数据经由主机单元被发送到基站服务器以镜像更新卡数据。 当卡数据的镜像更新完成时，基站服务器向主机单元返回完成确认，从而完成数据备份处理。 通过使基站服务器对存储卡中的数据进行镜像更新，可以防止存储的数据的丢失。

公开(公告)号：US20070158440A1

公开(公告)日：2007-07-12

申请号：US11566985

申请日：2006-12-05

申请人： Hirotaka Nishizawa ,  Norihisa Yamamoto ,  Jun Miyake ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Norihisa Yamamoto ,  Jun Miyake ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada

IPC分类号： G06K19/06

CPC分类号： G06K19/07745 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07733 ,  G06K19/07739 ,  H01L23/055 ,  H01L23/49838 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device improved in IC card function is disclosed. An external connecting terminal for extended interface not conforming to ISO/IEC7816-3 is disposed on a first main surface of a card chip and in an area sandwiched in between two rows of external connecting terminals for interface conforming to ISO/IEC7816-3 which is for IC card function. With this layout, the memory card function and other electronic circuit functions can be incorporated into the card chip and hence it is possible to improve the function of the card chip.

摘要翻译： 公开了改进了IC卡功能的半导体器件。 用于扩展接口的不符合ISO / IEC7816-3的外部连接端子设置在卡芯片的第一主表面上，并且夹在两排用于符合ISO / IEC7816-3的接口的外部连接端子的区域中 用于IC卡功能。 通过这种布局，存储卡功能和其他电子电路功能可以并入卡片芯片中，因此可以提高卡片芯片的功能。

公开(公告)号：US20100257313A1

公开(公告)日：2010-10-07

申请号：US12303110

申请日：2007-05-16

申请人： Hirotaka Nishizawa ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada ,  Kunihirio Katayama ,  Shigemasa Shiota

发明人： Hirotaka Nishizawa ,  Junichiro Osako ,  Minoru Shinohara ,  Tamaki Wada ,  Kunihirio Katayama ,  Shigemasa Shiota

IPC分类号： G06F12/00 ,  G06F1/32 ,  G06F1/26

CPC分类号： G06K19/077 ,  G06K19/0719 ,  G06K19/072

摘要： A semiconductor device has operation modes selectable through the control by a second microcomputer (113). In a first mode, an operation of a memory controller (105) responding to a memory card command from a memory card interface terminal and an operation of a first microcomputer (106) responding to an IC card command from an IC card interface terminal are separately performed. In a second mode, the first microcomputer operates in response to the IC card command from the IC card interface terminal. In a third mode, the memory controller and the first microcomputer operate in response to an undefined IC card command from the IC card interface terminal. In a fourth mode, the memory controller and the first microcomputer operate in response to the memory card command from the memory card interface terminal. Convenience of the semiconductor device having an IC card function and a memory card function is improved.

摘要翻译： 半导体器件具有通过第二微型计算机（113）的控制可选择的操作模式。 在第一模式中，分别响应来自存储卡接口终端的存储卡命令的存储器控​​制器（105）的操作和来自IC卡接口终端的响应IC卡命令的第一微计算机（106）的操作 执行。 在第二模式中，第一微型计算机响应于来自IC卡接口终端的IC卡命令而工作。 在第三模式中，存储器控制器和第一微型计算机响应于来自IC卡接口终端的未定义的IC卡命令来操作。 在第四模式中，存储器控制器和第一微型计算机响应来自存储卡接口终端的存储卡命令而操作。 提高具有IC卡功能和存储卡功能的半导体器件的便利性。

公开(公告)号：US20060087016A1

公开(公告)日：2006-04-27

申请号：US11251961

申请日：2005-10-18

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Michiaki Sugiyama ,  Junichiro Osako

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Michiaki Sugiyama ,  Junichiro Osako

IPC分类号： H01L23/02

CPC分类号： H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09145 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC card according to the present invention reduces or prevents a deterioration or damage on an electronic device to which the IC card is mounted. A buffer section made of a thermoplastic resin formed by a plastic injection molding is provided at the outer peripheral face of a memory card whose appearance is partly composed of a sealing section made of a thermosetting resin formed by a transfer molding without providing a cap. The buffer section has a taper formed at the outer peripheral corner, and further, the buffer section is softer than the sealing section and has a smooth surface. When the memory card is mounted to an electronic device, the buffer section is brought into contact with connector pins or a guide rail of a connector of the electronic device, thereby being capable of reducing or preventing the deterioration or damage on the connector.

摘要翻译： 根据本发明的IC卡减少或防止安装IC卡的电子设备的劣化或损坏。 由塑料注塑成型的热塑性树脂制成的缓冲部分设置在存储卡的外周面上，该存储卡的外观部分由密封部分组成，该密封部由不需设置帽的传递模塑形成的热固性树脂构成。 缓冲部具有在外周角形成的锥形，此外，缓冲部比密封部更软，并且具有光滑的表面。 当存储卡安装到电子设备时，缓冲部分与电子设备的连接器引脚或导轨接触，从而能够减少或防止连接器的劣化或损坏。

公开(公告)号：US20060194479A1

公开(公告)日：2006-08-31

申请号：US11361957

申请日：2006-02-27

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

IPC分类号： H01R33/90

CPC分类号： G06K19/07739 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01R12/7005 ,  H01R12/714 ,  H01R27/00 ,  H01R31/06 ,  H01R2201/20 ,  H05K1/117 ,  H05K1/142 ,  H05K3/326 ,  H01L2924/00014 ,  H01L2924/00

摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

摘要翻译： 公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧 制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。

公开(公告)号：US07427032B2

公开(公告)日：2008-09-23

申请号：US11361957

申请日：2006-02-27

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike

IPC分类号： G06K19/06

CPC分类号： G06K19/07739 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01R12/7005 ,  H01R12/714 ,  H01R27/00 ,  H01R31/06 ,  H01R2201/20 ,  H05K1/117 ,  H05K1/142 ,  H05K3/326 ,  H01L2924/00014 ,  H01L2924/00

摘要： An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

摘要翻译： 公开了一种用于存储卡的适配器，其执行尺寸的改变，使得与多媒体卡相比，平面尺寸较小但几乎相等的存储卡可用作多媒体卡。 在形成在适配器的背面的多个外部端子之后形成突出部分，由此，当适配器的前侧的厚度保持在多媒体卡的标准厚度时，适配器的后侧 制成厚于前侧，并且用于与存储卡的外部端子接触的内部端子设置在适配器的厚部的内部。 可以提高极小型存储卡的多功能性。

公开(公告)号：US20060202041A1

公开(公告)日：2006-09-14

申请号：US11368454

申请日：2006-03-07

申请人： Hirotaka Hishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Hishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： G06K19/06 ,  H01L23/02

CPC分类号： H01L23/49855 ,  G06K19/072 ,  G06K19/07732 ,  G06K19/07743 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor chip is mounted onto a wiring substrate having external connecting terminals, electrodes on the semiconductor chip and wiring lines on the wiring substrate are connected together electrically through bonding wires, and a sealing portion is formed by resin molding, to form an IC body. Further, a case formed of a thermoplastic resin is provided. The IC body is mounted into a recess of the case through a bonding material. Thereafter, a region near the recess of the case is deformed plastically to fix the IC body to the case and then the bonding material is cured. In this way there is fabricated an IC card comprising the case and the IC body whose stability is improved by being bonded to the case through the bonding material. The production yield of the IC card can be improved.

摘要翻译： 将半导体芯片安装到具有外部连接端子的布线基板上，半导体芯片上的电极和布线基板上的布线通过接合线电连接在一起，并且通过树脂模制形成密封部分，以形成IC体。 此外，提供由热塑性树脂形成的壳体。 IC体通过接合材料安装在壳体的凹部中。 此后，外壳的凹部附近的区域发生塑性变形，以将IC体固定在壳体上，然后使粘接材料固化。 以这种方式，制造了一种IC卡，其包括壳体和IC体，其通过通过接合材料结合到壳体来提高其稳定性。 可以提高IC卡的生产成本。