摘要:
This disclosure concerns a semiconductor integrated circuit that includes a semiconductor substrate, a plurality of well regions formed on one surface of the semiconductor substrate and electrically isolated from each other, a plurality of MOS transistors formed in the well regions and a substrate bias generator that applies substrate biases to the individual well regions based on actually measured process-derived variance of the MOS transistors in threshold voltage to bring the threshold voltages of the respective MOS transistors into conformity with a normal threshold voltage.
摘要:
A transfer base substrate comprises: a substrate; a plurality of transfer thin film circuits formed on the substrate via removing layer; a test circuit formed on the substrate for checking circuit operation; and a wiring coupling each of transfer thin film circuits with a test circuit.
摘要:
A semiconductor integrated circuit comprising: a power controller which outputs a voltage select signal for selecting one of at least two types of voltages; a power supply voltage controller which generates and outputs a power supply voltage at an arbitrary voltage change rate on the basis of the voltage select signal; and a circuit portion which receives the power supply voltage and performs processing, wherein said circuit portion keeps operating while said power supply voltage controller is outputting the power supply voltage generated at the arbitrary voltage change rate.
摘要:
In a semiconductor device made by forming functional elements on a first substrate, transferring the element chip onto a second substrate, and connecting first pads on the element chip to second pads on the second substrate, the area or the width of the first is increased. The first pads can be securely connected to the second pads even when misalignment occurs during the separating and transferring processes. Only the first pads are formed on a surface of the element chip at the second-substrate-side. The functional elements are formed to be farther from the second substrate than the first pads. Alternatively, only the first pads are formed on a surface of the element chip remote from the second substrate, and the functional elements are formed to be closer to the second substrate than the first pads. Alternatively, the first pads are formed on both the surface of the element chip at the second-substrate-side and the surface of the element chip remote from the second substrate.
摘要:
A method that enables an image forming device of efficient memory sharing between processes and a kernel in a simple multiple-process-configuration. The image forming device has a real address space including a DMA buffer area and a shared memory area, a virtual address spaces, and job page assurance (JPA) programs. The virtual address spaces of the executing processes are mapped onto the real address space. The DMA buffer area can be accessed by the kernel. The shared memory area stores a job list and a job management list. The processes in the virtual address spaces include identical JPA libraries. Each of the JPA libraries requests the kernel to allocate of one page non-compressed data memory size for the job in the DMA buffer area, and upon completion of the job output, requests the kernel to release the allocated area and alters the contents in the job management list accordingly.
摘要:
A remote site managing system for centrally managing computers and peripheral devices of a customer, is provided. In the event that there is trouble with equipment in the office to be serviced, and a customer in the office notifies the maintenance service company of the trouble by telephone (i.e., a center call), the remote site managing system deals with the trouble in an appropriate manner, and dispatches maintenance (either dispatching service personnel or commissioning the maintenance to another service company) in a smooth manner.
摘要:
An electro-optical device includes a plurality of pixels, a plurality of write scan lines including a predetermined number of the plurality of pixels as a unit, and a drive device driving the plurality of write scan lines non-sequentially and adjusting a light-emission period of the plurality of pixels in accordance with a luminance ratio of an image.
摘要:
According to the present invention, there is provided a semiconductor device comprising: a power supply circuit which receives an external power supply voltage supplied, and outputs an internal power supply voltage not higher than the external power supply voltage; a system module which receives the internal power supply voltage, and performs a predetermined operation; and a performance monitor circuit which measures a processing speed of said system module when the internal power supply voltage is applied, and, on the basis of the processing speed, outputs a first control signal which requests to set the external power supply voltage at a first level, and a second control signal which requests said power supply circuit to set the internal power supply voltage at a second level, wherein said power supply circuit outputs the internal power supply voltage having the second level on the basis of the second control signal applied thereto.
摘要:
An organic electro-luminescence (EL) device including at least an emission layer between an anode and a cathode that are opposed to each other, including an anode buffer layer that is composed of an electrically conductive material and is provided between the anode and the emission layer, a cathode buffer layer that is composed of an electrically conductive material and is provided between the cathode and the emission layer, and a drive unit that applies a forward bias voltage and a reverse bias voltage that have opposite polarities to the anode and the cathode with setting application time periods of the forward bias voltage and the reverse bias voltage according to a luminance ratio of an image to be displayed.
摘要:
The present invention aims to manufacture a large size semiconductor device with the inter-substrate transcription technology of thin film circuits. Enlargement is enabled by disposing a plurality of second substrates (21) in a tile shape. As the second substrate (21), a print substrate or flexible print circuit having double-sided wiring or multilayer wiring is employed. The plurality of second substrates (21) is driven independently, and the plurality of second substrates (21) is made to mutually overlap, and a drive circuit (23) is disposed at such overlapping portion. Moreover, the plurality of second substrates (21) is made to mutually overlap, and the mutual circuits are connected at such overlapping portion.