Method for polishing a substrate surface
    68.
    发明授权
    Method for polishing a substrate surface 有权
    抛光基材表面的方法

    公开(公告)号:US07323414B2

    公开(公告)日:2008-01-29

    申请号:US11363816

    申请日:2006-02-28

    IPC分类号: H01L21/461 H01L21/302

    摘要: According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AlN substrate surfaces.

    摘要翻译: 根据本发明的一个方面,提供了一种用于制备衬底表面的改进方法,其中衬底的表面准备用于化学机械抛光(CMP)工艺,在衬底的表面上进行CMP工艺,以及 完成基材的表面以从CMP工艺中清除任何活性成分的基材表面。 此外,提供了通过该方法制备的改进的基板。 根据本发明的一个方面,可以使用允许增加AlN衬底表面质量的特定抛光材料和程序。