公开(公告)号：US10720552B2

公开(公告)日：2020-07-21

申请号：US15608791

申请日：2017-05-30

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/44 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/20 ,  H01L33/26 ,  H01L33/40 ,  H01L33/60

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.

公开(公告)号：US10569487B2

公开(公告)日：2020-02-25

申请号：US16393926

申请日：2019-04-24

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Masakazu Kotani ,  Tetsuji Seino ,  Shinsaku Ikuta

IPC: B29D11/00 ,  H01L33/54 ,  H01L33/00 ,  B29K83/00 ,  B29K105/04 ,  B29L31/34 ,  H01L33/50

Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.

公开(公告)号：US10553763B2

公开(公告)日：2020-02-04

申请号：US16111239

申请日：2018-08-24

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

公开(公告)号：US10381520B2

公开(公告)日：2019-08-13

申请号：US15701857

申请日：2017-09-12

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H05K1/18 ,  H05K3/00 ,  F21V21/08 ,  F21S4/24 ,  H01L33/08 ,  H01L33/56 ,  H01L33/54 ,  F21Y103/10 ,  F21Y115/10 ,  F21Y101/02 ,  F21Y103/00

Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin, an adhesion layer and a support member. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the at least one light emitting element. The adhesion layer and the support member are arranged in this order on a second surface of the flexible substrate different from the first surface of the flexible substrate. The support member has a recess in a region corresponding at least to a region on the first surface where the at least one light emitting element is arranged.

公开(公告)号：US10274168B2

公开(公告)日：2019-04-30

申请号：US15648729

申请日：2017-07-13

Applicant: NICHIA CORPORATION

Inventor： Takeshi Tamura ,  Hiroshi Fujimori ,  Motokazu Yamada

IPC: F21V3/02 ,  F21V7/00 ,  F21V9/08 ,  F21V13/08 ,  H01L33/60 ,  F21Y115/10 ,  G02F1/1335 ,  H01L25/075

Abstract: A light emitting device includes a mounting board on which a plurality of light sources are disposed; a partitioning member surrounding the light sources and including a plurality of walls that include top parts and form a plurality of areas; a diffuser sheet that is provided above the partitioning member and is supported directly or indirectly by at least one of the top parts of the partitioning member; a plurality of first reflectors that are provided directly above the light sources and are positioned on one of an upper surface and a lower surface of the diffuser sheet; and a second reflector that is provided directly above the top parts and is positioned on one of the upper surface and the lower surface of the diffuser sheet.

公开(公告)号：US09865773B2

公开(公告)日：2018-01-09

申请号：US15175281

申请日：2016-06-07

Applicant: Nichia Corporation

Inventor： Isamu Niki ,  Motokazu Yamada ,  Masahiko Sano ,  Shuji Shioji

IPC: H01L33/00 ,  H01L33/16 ,  H01L33/20 ,  H01L33/22 ,  H01L33/26 ,  H01L33/32 ,  H01L21/02 ,  H01L33/24

CPC classification number: H01L33/16 ,  H01L21/02378 ,  H01L21/0254 ,  H01L21/02647 ,  H01L33/007 ,  H01L33/20 ,  H01L33/22 ,  H01L33/24 ,  H01L33/26 ,  H01L33/32 ,  H01L2933/0083 ,  Y10T428/24355 ,  Y10T428/24479

Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

公开(公告)号：US11906156B2

公开(公告)日：2024-02-20

申请号：US18157217

申请日：2023-01-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: G02F1/13357 ,  F21V7/22 ,  F21V9/30 ,  F21V7/00 ,  F21V13/08 ,  G02F1/1335 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

CPC classification number: F21V7/22 ,  F21V7/0083 ,  F21V9/30 ,  F21V13/08 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F1/133611 ,  F21Y2105/16 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02F1/133557 ,  G02F1/133614

Abstract: A light emitting device includes: a mounting board; a light source positioned on the mounting board; a light diffusion plate; a diffuse reflector positioned between the mounting board and the light diffusion plate, and above at least part of an emission face of the light source; and a wavelength conversion layer positioned on or above the diffuse reflector.

公开(公告)号：US11365851B2

公开(公告)日：2022-06-21

申请号：US16567580

申请日：2019-09-11

Applicant: NICHIA CORPORATION

Inventor： Tomonori Ozaki ,  Motokazu Yamada

IPC: F21K9/60 ,  F21V23/00 ,  F21Y113/13 ,  F21Y105/18 ,  F21Y105/16 ,  F21Y115/10 ,  F21V3/06

Abstract: A lighting module includes a mounting board; a plurality of first light sources located on the mounting board; and one or more second light sources located on the mounting board. A wavelength range and/or a correlated color temperature of the plurality of first light sources is different from a wavelength range and/or a correlated color temperature of the one or more second light sources. A quantity of the first light sources is greater than a quantity of the one or more second light sources. A light distribution angle of each of the one or more second light sources is greater than a light distribution angle of each of the plurality of first light sources.

公开(公告)号：US11171261B2

公开(公告)日：2021-11-09

申请号：US16897435

申请日：2020-06-10

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/44 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/20 ,  H01L33/26 ,  H01L33/40 ,  H01L33/60

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.

公开(公告)号：US11139418B2

公开(公告)日：2021-10-05

申请号：US16727923

申请日：2019-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.