公开(公告)号：US07015070B2

公开(公告)日：2006-03-21

申请号：US10790057

申请日：2004-03-02

申请人： Shigeru Nakamura

发明人： Shigeru Nakamura

IPC分类号： H01L21/44

CPC分类号： H05K3/341 ,  H01L24/27 ,  H01L2224/27001 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K3/328 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

摘要： A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a thermo-compression bonding tool with an adhesive resin interposed between a first area of the one main surface of the wiring board and the first electronic component, and a second electronic component mounted on a second area different from the first area of the one main surface of the wiring board by melting a soldering paste material and higher than the first electronic component in post-mounting height, and wherein the first electronic component is mounted before the mounting of the second electronic component.

公开(公告)号：US06951774B2

公开(公告)日：2005-10-04

申请号：US10086717

申请日：2002-03-04

申请人： Shigeru Nakamura ,  Masakatsu Gotou

发明人： Shigeru Nakamura ,  Masakatsu Gotou

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device having a stack structure comprises: a single-piece substrate having a chip support surface serving as a main surface, a back surface, a plurality of connection terminals provided on the chip support surface and a plurality of solder balls provided on the back surface; a first semiconductor chip having a main surface, aback surface, a plurality of semiconductor devices on the main surface of the first semiconductor chip and a plurality of pads provided on the main surface of the first semiconductor chip; a second semiconductor chip having a main surface, a back surface, a plurality of semiconductor devices provided on the main surface of the second semiconductor chip and a plurality of pads provided on the main surface of the second semiconductor chip; and a resin sealing body formed on the chip support surface of the single-piece substrate and used for sealing the first semiconductor chip and the second semiconductor chip; and a plurality of wires for connecting the pads of the second semiconductor chip to the respective connection terminals provided on the single-piece substrate.In the stack structure, the second semiconductor chip is made thinner than the first semiconductor chip. As a result, the structure package of the semiconductor device can be made thin.

摘要翻译： 具有堆叠结构的半导体器件包括：具有用作主表面的芯片支撑表面的单片衬底，背面，设置在芯片支撑表面上的多个连接端子和设置在背面的多个焊球 表面; 第一半导体芯片，其具有主表面，粗糙表面，在第一半导体芯片的主表面上的多个半导体器件和设置在第一半导体芯片的主表面上的多个焊盘; 具有主表面，后表面，设置在第二半导体芯片的主表面上的多个半导体器件和设置在第二半导体芯片的主表面上的多个焊盘的第二半导体芯片; 以及树脂密封体，其形成在所述单件基板的所述芯片支撑面上，用于密封所述第一半导体芯片和所述第二半导体芯片; 以及用于将第二半导体芯片的焊盘连接到设置在单片基板上的各个连接端子的多条导线。 在堆叠结构中，第二半导体芯片比第一半导体芯片薄。 结果，可以使半导体器件的结构封装变薄。

公开(公告)号：US06721242B2

公开(公告)日：2004-04-13

申请号：US10142896

申请日：2002-05-13

申请人： Kunikazu Ohnishi ,  Takeshi Shimano ,  Shigeru Nakamura ,  Masayuki Inoue ,  Yukio Fukui ,  Yasuyuki Sugi ,  Shinji Fujita ,  Mitsuhiko Ota

发明人： Kunikazu Ohnishi ,  Takeshi Shimano ,  Shigeru Nakamura ,  Masayuki Inoue ,  Yukio Fukui ,  Yasuyuki Sugi ,  Shinji Fujita ,  Mitsuhiko Ota

IPC分类号： G11B7095

CPC分类号： G11B7/131 ,  G11B7/00718 ,  G11B7/0901 ,  G11B7/0903 ,  G11B7/0909 ,  G11B7/094 ,  G11B7/0943

摘要： An optical detector for detecting at least three optical beams reflected by an optical information recording medium and outputting an electric signal, the optical detector having three light receiving areas each of which receives a respective one of the three optical beams and each of which has four light receiving surfaces, twelve signal lines to transmit an electric signal obtained on respective ones of the four light receiving surfaces of the three light receiving areas, selected ones of the twelve signal lines connected to the four light receiving surfaces of different ones of the three light receiving areas being joined together within the optical detector, and less than nine signal output lines formed by joining the selected ones of the twelve signal lines extend from the optical detector to a signal processing circuit.

摘要翻译： 一种用于检测由光学信息记录介质反射并输出电信号的至少三个光束的光学检测器，该光学检测器具有三个光接收区域，每个光接收区域接收三个光束中的相应一个，并且每个光接收区域具有四个光 接收表面，用于传输在三个光接收区域的四个光接收表面中的相应一个上获得的电信号的十二条信号线，连接到三个光接收区中的不同光接收表面的四个光接收表面的十二个信号线中的选定的一个 区域在光学检测器内连接在一起，并且通过连接十二条信号线中所选择的信号线形成的少于九条信号输出线从光学检测器延伸到信号处理电路。

公开(公告)号：US06577573B2

公开(公告)日：2003-06-10

申请号：US10145041

申请日：2002-05-15

申请人： Shigeru Nakamura ,  Takeshi Maeda ,  Koichiro Wakabayashi

发明人： Shigeru Nakamura ,  Takeshi Maeda ,  Koichiro Wakabayashi

IPC分类号： G11B576

CPC分类号： G11B20/10009 ,  G11B7/005

摘要： An optical information reproducing method for reproducing information recorded at at least one mark on an optical information medium. The method includes irradiating a laser to the optical information medium, detecting a reflected beam reflected from the optical information medium, and reproducing information recorded on the optical information medium from an output signal of a detector which detects the reflected beam. The step of reproducing information is changed in dependence upon a length of the mark of the optical information medium.

摘要翻译： 一种用于再现记录在光信息介质上的至少一个标记上的信息的光信息再现方法。 该方法包括：向光学信息介质照射激光，检测从光学信息介质反射的反射光束，以及从检测反射光束的检测器的输出信号再现记录在光学信息介质上的信息。 再现信息的步骤根据光信息介质的标记的长度而改变。

公开(公告)号：US06430131B1

公开(公告)日：2002-08-06

申请号：US09763866

申请日：2001-06-25

申请人： Shigeru Nakamura ,  Takeshi Maeda ,  Koichiro Wakabayashi

发明人： Shigeru Nakamura ,  Takeshi Maeda ,  Koichiro Wakabayashi

IPC分类号： G11B576

CPC分类号： G11B7/005

摘要： Information recorded on an optical disk in accordance with a mark edge recording scheme is detected by a center detection circuit which includes a bisected beam detector to obtain a mark center position signal. In succession, the mark center position signal is converted to a mark edge position signal by an edge signal generating circuit. An information reproducing device is implemented which is capable of performing reproducing operation on an information medium conforming to a high-density mark edge recording scheme and which is stable against changes of recording paper, recording sensitivity and reflectivity.

摘要翻译： 根据标记边缘记录方案记录在光盘上的信息由包括二等分光束检测器的中心检测电路检测，以获得标记中心位置信号。 接着，由边缘信号发生电路将标记中心位置信号转换为标记边缘位置信号。 实现了能够对符合高密度标记边缘记录方案的信息介质执行再现操作并且对记录纸的变化，记录灵敏度和反射率稳定的信息再现装置。

公开(公告)号：US06298028B1

公开(公告)日：2001-10-02

申请号：US09520722

申请日：2000-03-08

申请人： Kouji Arikawa ,  Shigeru Nakamura ,  Kazuo Shigematsu

发明人： Kouji Arikawa ,  Shigeru Nakamura ,  Kazuo Shigematsu

IPC分类号： G11B712

CPC分类号： G11B7/127 ,  G11B7/0916 ,  G11B7/123 ,  G11B7/131 ,  G11B7/1356 ,  G11B7/1362 ,  G11B19/12

摘要： In an optical head for recording on or reproducing from a plurality of kinds of optical information recording media corresponding to a plurality of kinds of different wavelengths, coma aberration is prevented, and low price and high reliability are realized. To that end, in an optical head constituted by laser light sources of three wavelengths and photodetectors corresponding to the laser light sources of the three wavelengths, a two-laser module including laser light sources of two adjacent wavelengths and photodetectors corresponding to the laser light sources, a laser module including a laser light source of the rest one wavelength and a photodetector corresponding to the laser light source, and a dichroic mirror bonded with a rising mirror are combined.

摘要翻译： 在用于在与多种不同波长对应的多种光学信息记录媒体中进行记录或再现的光学头中，防止了彗形像差，实现了低价格和高可靠性。 为此，在由三个波长的激光光源构成的光头和对应于三个波长的激光光源的光电检测器中，包括两个相邻波长的激光光源和对应于激光光源的光电检测器的双激光模块 包括其余一个波长的激光光源和对应于激光光源的光电检测器的激光模块和与上升反射镜结合的二向色镜组合。

公开(公告)号：US06295402B1

公开(公告)日：2001-09-25

申请号：US09440164

申请日：1999-11-15

申请人： Shigeru Nakamura ,  Kazuhito Tajima

发明人： Shigeru Nakamura ,  Kazuhito Tajima

IPC分类号： G02B600

CPC分类号： G02F1/3515

摘要： An optical switch is provided that utilizes a signal light frequency shift due to the resonance excitation non-linear optical effect in a semiconductor material so that a high extinction ratio optical switching operation can be realized with low energy controlling light pulses. The non-linear optical waveguide 1 receives a signal light pulse of a frequency of &ohgr;1 and a controlling light pulse of a frequency of &ohgr;0 and sets the pulse width of the controlling light pulse to a value smaller than that of the signal light pulse. The optical waveguide portion of the non-linear optical waveguide 1 is formed of a non-linear optical medium of which the non-linear refractive index changes due to absorption or amplification of the controlling light. The frequency &ohgr;1 of the signal light is set to the transparent region of the non-linear optical waveguide 1. When the frequency &ohgr;0 of the controlling light is set to the absorption region of the non-linear optical waveguide 1, some of signal light pulses incident together with the controlling lights partially frequency-shift toward the high-frequency area. The optical frequency filter 2 outputs only the frequency-shifted components. This allows the optical switching operation to be realized by controlling light pulses with low energies.

摘要翻译： 提供了一种光学开关，其利用由于半导体材料中的共振激励非线性光学效应引起的信号光频移，使得可以以低能量控制光脉冲实现高消光比光开关操作。 非线性光波导1接收ω1的频率的信号光脉冲和ω0的频率的控制光脉冲，并将控制光脉冲的脉冲宽度设定为小于信号光脉冲的脉冲宽度。 非线性光波导1的光波导部分由非线性光学介质形成，其非线性折射率由于控制光的吸收或放大而改变。 将信号光的频率ω1设定为非线性光波导1的透明区域。当将控制光的频率ω0设定为非线性光波导1的吸收区域时，一些信号光脉冲 事件与控制灯一起部分地频移到高频区域。 光频滤波器2仅输出频移分量。 这允许通过以低能量控制光脉冲来实现光开关操作。

公开(公告)号：US06291763B1

公开(公告)日：2001-09-18

申请号：US09543339

申请日：2000-04-05

申请人： Shigeru Nakamura

发明人： Shigeru Nakamura

IPC分类号： H01L3104

CPC分类号： H01G9/2077 ,  C09B23/0066 ,  C09B47/00 ,  C09B57/007 ,  C09B57/10 ,  H01G9/2009 ,  H01G9/2022 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/445 ,  Y02E10/542

摘要： A photoelectric conversion device comprising an electrically conductive substrate, a photosensitive semiconductor layer, a charge transporting layer, and a counter electrode (preferably a counter electrode having a porous electron-conducting layer), wherein an electrically insulating spacing layer is provided between the semiconductor layer and the counter electrode, and a photo cell having the device. High conversion efficiency is obtained without causing an internal shortage.

摘要翻译： 一种光电转换装置，包括导电基板，光敏半导体层，电荷输送层和对电极（优选为具有多孔电子传导层的对电极），其中，电绝缘间隔层设置在半导体层 和对电极，以及具有该装置的光电池。 获得高转换效率而不会导致内部短缺。

公开(公告)号：US06272097B1

公开(公告)日：2001-08-07

申请号：US09313211

申请日：1999-05-18

申请人： Takeshi Nakao ,  Shigeru Nakamura ,  Toshiaki Tanaka ,  Takeshi Shimano

发明人： Takeshi Nakao ,  Shigeru Nakamura ,  Toshiaki Tanaka ,  Takeshi Shimano

IPC分类号： G11B725

CPC分类号： G11B7/1365 ,  G11B7/122 ,  G11B7/124 ,  G11B7/1372 ,  G11B7/22 ,  G11B11/1058

摘要： A minute optical head is provided so that a light source and one or more photo detector elements are integrated on the same substrate by a simple manufacturing process and may be applied to an apparatus for recording and reproducing recordable optical information. An apparatus for recording and reproducing optical information is arranged to have a minute optical head. A light waveguide layer composed of column semiconductor crystal is formed on a monocrystalline transparent substrate and an active layer is formed on the side of the light waveguide layer. The light beam source is a semiconductor having a vertical resonator formed of a high-reflection film before and after an emitting surface of the active layer so that a light beam is vertically radiated to the substrate. The photo detector element is integrated on the closer portion of the substrate to the light beam source of the semiconductor laser. Further, on the opposed surface of the substrate to the light beam source are sequentially integrated a first transparent layer, a diffraction grating, a second transparent layer, a phase difference generating element, a third transparent layer, a light beam focusing element, a fourth transparent layer, and a slide-resisting protective layer. The slide-resisting protective layer is located closer to and as opposed to the information recording medium.

摘要翻译： 提供一个微小的光学头，使得光源和一个或多个光电检测器元件通过简单的制造工艺集成在同一基板上，并且可以应用于用于记录和再现可记录光学信息的装置。 用于记录和再现光学信息的设备被布置成具有微小的光学头。 在单晶透明基板上形成由柱半导体晶体构成的光波导层，在光波导层一侧形成有源层。 光束源是在有源层的发射表面之前和之后具有由高反射膜形成的垂直谐振器的半导体，使得光束垂直辐射到衬底。 光检测器元件集成在基板的更靠近部分上的半导体激光器的光束源上。 此外，在与光束源的基板相对的表面上依次地集成有第一透明层，衍射光栅，第二透明层，相位差产生元件，第三透明层，光束聚焦元件，第四透明层 透明层和耐滑动保护层。 防滑保护层位于信息记录介质的更靠近和相对的位置。

公开(公告)号：US6040015A

公开(公告)日：2000-03-21

申请号：US78686

申请日：1998-05-14

申请人： Yasushi Nakao ,  Shigeru Nakamura

发明人： Yasushi Nakao ,  Shigeru Nakamura

IPC分类号： B05D1/36 ,  B05D7/00 ,  B05D7/24 ,  C09C1/62 ,  C09C3/06 ,  C09C3/08 ,  C09D7/12 ,  C09D201/00

CPC分类号： B05D7/532 ,  Y10T428/31504 ,  Y10T428/31551 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： A process for forming a multilayer film, which comprises applying, onto a substrate, (A) a liquid solid-color coating which comprises a thermosetting resin composition and a metal powder coated with a coloring pigment, and (B) a clear coating in this order without substantially curing the resulting films of the coatings (A) and (B) and then heating the two films to crosslink and cure them simultaneously. The process of the present invention provides a multilayer film of smaller thickness, excellent hiding power and improved properties such as surface smoothness, chipping resistance and the like.

摘要翻译： 一种用于形成多层膜的方法，其包括将（A）包含热固性树脂组合物和涂有着色颜料的金属粉末的液体固色涂层施加到基材上，和（B）在其中的透明涂层 （A）和（B）的所得膜基本上不固化，然后加热两个膜以同时交联和固化它们。 本发明的方法提供了一种较薄的多层膜，优异的遮盖力以及诸如表面平滑度，耐崩裂性等改进的性能。