摘要:
A method and apparatus for calibrating the coordinate systems of photomask processing machines improves processing efficiency and the quality of resulting photomasks. A test pattern is printed on an unproductive area of the photomask. The test pattern is used to calibrate the coordinate system of each processing machine on which the photomask is mounted. Using the test pattern as a common reference point enables points located using one processing machine to be quickly and accurately found on a second processing machine. The test pattern is also used as a reference for other metrology measurements.
摘要:
A semiconductor wafer having a first layer and overlying insulating layer receives a photoresist layer. A first photoresist area is exposed to light having a first dosage, while a second, adjacent photoresist area is concurrently exposed to light having a second dosage. The first area and second area then are concurrently developed to partially expose the photoresist layer. The partial exposure removes photoresist within the first area to one depth and within the second area to a second depth. The second depth differs from the first depth. In one embodiment, the second depth extends through the photoresist down to the insulating layer. After subsequently performing a contact and/or trench etch through the exposed insulating layer and removing excess photoresist above the insulating layer, conductive material is deposited in the contact/trench opening and over the insulating layer. The result is an upper conductive layer coupled to the first layer via a contact or other conductive connection.
摘要:
Methods of reducing proximity effects in lithographic processes wherein an integrated circuitry pattern is transferred from a mask onto a semiconductor substrate are described. In one embodiment, a desired spacing is defined between a main feature which is to reside on a mask and which is to be transferred onto the substrate, and an adjacent proximity effects-correcting feature. After the spacing definition, the dimensions of the main feature are adjusted relative to the proximity effects-correcting feature to achieve a desired transferred main feature dimension. In another embodiment, a desired spacing is defined between a main feature having an edge and an adjacent sub-resolution feature. The edge of the main feature is moved relative to the sub-resolution feature to achieve a desired transferred main feature dimension.
摘要:
An improved photolithographic method employs a pattern of subresolution openings to enhance the printability of clear-field patterns. Incorporating a subresolution opening along the edges of the transmission areas prevents the printing of side lobe light and enables incorporation of a positive bias in the clear-field pattern. This is turn increases the lithographic process latitudes. The photomask must be significantly overexposed as a result of using a positive bias. To compensate for the impact of increased exposure on large transmission areas and avoid degradation of the corresponding resist, a pattern of subresolution openings is incorporated in the large transmission areas. The size and orientation of the subresolution areas creates a diffraction grating effect, reducing the exposure of the area under each transmission area.
摘要:
This invention teaches methods and apparatus for forming self-aligned photosensitive material spacers about protruding structures in semiconductor devices. One embodiment of the invention is a method for forming a lightly doped drain (LDD) structure, utilizing disposable photosensitive material spacers. A second embodiment of the invention comprises a method for forming a transistor, having salicided source/drain regions, utilizing photosensitive polyimide spacers for forming the salicided source/drain regions, without disposing of the spacers. A third embodiment of the invention comprises a method for creating an offset from a protruding structure on a semiconductor substrate, using disposable photosensitive material spacers.
摘要:
A subresolution grating composed of approximately circular contacts is fabricated around the border of the primary pattern of a photomask. As a result, resolution at the edges of the photomask pattern is improved when the pattern is printed on a wafer surface. In addition, the reduced leakage enables a more efficient use of the glass plate on which the photomask is fabricated as well as a more efficient use of the wafer surface as a result of being able to place patterns closer together.
摘要:
An application specific field emission display includes one or more extended emitters. The emitters are patterned according to a selected image where the selected image depends upon the application. In one embodiment, an emitter is patterned in a serpentine pattern to provide a single block of illumination. In another application, emitters are grouped in threes and the emitters are driven respectively by the red, green, and blue components of an image signal to produce a multicolor display. In a display assembly according to the invention, application specific emitters are incorporated in subdisplays on a common substrate with a conventional matrix addressable array. The array provides video, graphical or textual information and the subdisplays provide textual, fixed-shaped graphical, numerical or colorized information.
摘要:
A layer applied over the reticle used in a lithographic system can improve the image quality of the system. The applied layer may have a thickness of approximately the wavelength of incident light divided by four times its index of refraction.
摘要:
A process for forming patterns in resist material on a semiconductor wafer that uses two masks to define a pattern instead of a single conventional mask to define the pattern. The present invention realizes better process latitude and resolution for a given feature size than did the prior art.
摘要:
A process for designing and checking a mask layout is provided. A mask layout is generated from a binary mask layout design. An aerial image of the mask layout is then calculated using simulation software. The simulated aerial image is then compared to the binary mask layout design and modifications are made to the mask layout if necessary.