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231 条记录 (耗时 0.042 秒)

    Organosilicon compound
    63.
    发明申请
    Organosilicon compound 有权
    有机硅化合物

    公开(公告)号：US20060175684A1

    公开(公告)日：2006-08-10

    申请号：US11316847

    申请日：2005-12-27

    申请人： Hisao Oikawa ,  Mikio Yamahiro ,  Koji Ohguma ,  Nobumasa Ootake ,  Kenichi Watanabe ,  Kohji Ohno ,  Yoshinobu Tsujii ,  Takeshi Fukuda

    发明人： Hisao Oikawa ,  Mikio Yamahiro ,  Koji Ohguma ,  Nobumasa Ootake ,  Kenichi Watanabe ,  Kohji Ohno ,  Yoshinobu Tsujii ,  Takeshi Fukuda

    IPC分类号： H01L23/58 ,  H01L21/31

    CPC分类号： C07F7/21

    摘要： Since the majority of conventional organic/inorganic composite materials are obtained by mechanical blending of a silsesquioxane and an organic polymer or other means, it was extremely difficult to control the structure of the composite as a molecular agglomerate. In order to solve such a problem, the invention is to provide a silicon compound represented by Formula (1). This novel silicon compound has a living radical polymerization initiating ability for addition polymerizable monomers of a wide range. In Formula (1), R1 is hydrogen, an alkyl, an aryl, or an arylalkyl; R2 is an alkyl, phenyl, or cyclohexyl; and A is a group having a polymerization initiating ability for addition polymerizable monomers.

    摘要翻译： 由于大多数常规有机/无机复合材料是通过机械共混倍半硅氧烷和有机聚合物或其它方法获得的，所以非常难以控制复合材料的结构作为分子聚集体。 为了解决这个问题，本发明提供一种由式（1）表示的硅化合物。 该新型硅化合物具有广泛范围的可加聚单体的活性自由基聚合引发能力。 在式（1）中，R 1是氢，烷基，芳基或芳基烷基; R 2是烷基，苯基或环己基; A是具有加成聚合性单体的聚合引发能力的基团。

    Electro-rheological composition
    64.
    发明授权
    Electro-rheological composition 失效

    公开(公告)号：US07001532B2

    公开(公告)日：2006-02-21

    申请号：US10299898

    申请日：2002-11-20

    申请人： Akira Ishibashi ,  Takeshi Fukuda ,  Ryoichi Hanaoka ,  Shinzo Takata

    发明人： Akira Ishibashi ,  Takeshi Fukuda ,  Ryoichi Hanaoka ,  Shinzo Takata

    IPC分类号： C10M171/00 ,  C10M169/04

    CPC分类号： C10M169/04 ,  C10M171/001 ,  C10M2201/062 ,  C10M2229/0515 ,  C10N2210/03 ,  C10N2210/04 ,  C10N2220/082

    摘要： In an electro-rheological composition comprising an electrical insulating medium and solid particles dispersed therein, insulating solid particles possessed of morphological anisotropy are used as the solid particles. In a preferred embodiment, the insulating solid particles mentioned above are plate-like insulating solid particles, preferably plate-like insulating solid particles having a diameter (particle diameter) not less than 1 μm, more preferably plate-like aluminum oxide particles having a diameter not less than 1 μm. In another preferred embodiment, the insulating solid particles which have undergone a surface treatment with organic molecules or a semiconducting inorganic material, particularly the insulating solid particles having a metal oxide such as tin oxide and titanium oxide adhered to the surfaces thereof are used as the particles. Still another preferred embodiment is the ER composition of which electrical insulating medium is gelled.

    Multibeam exposure device
    66.
    发明申请
    Multibeam exposure device 有权
    多光束曝光装置

    公开(公告)号：US20050157161A1

    公开(公告)日：2005-07-21

    申请号：US11037056

    申请日：2005-01-19

    申请人： Takeshi Fukuda

    发明人： Takeshi Fukuda

    IPC分类号： B41J2/46 ,  B41J2/465 ,  G03F7/20 ,  H01L21/027 ,  B41J2/47

    CPC分类号： B41J2/465

    摘要： A multibeam exposure device carrying out exposure processing by irradiating, onto an exposure surface of a photosensitive material, an exposure beam obtained by modulating a light beam, by a spatial light modulator and in accordance with an image to be exposed and formed, the multibeam exposure device having: an opening plate having an opening disposed on the exposure surface and blocking light which is other than an object of measurement of light quantity data at the spatial light modulator, the opening allowing passage of the exposure beam which corresponds to a pixel which is an object of measurement of light quantity data at the spatial light modulator; a feeding operation mechanism moving the opening plate such that the opening is moved in a direction intersecting a scanning direction at a time of scan-exposure; and a light-receiving element measuring a light quantity of the exposure beam which passes through the opening.

    摘要翻译： 一种多光束曝光装置，其通过在感光材料的曝光表面上照射通过调制光束而获得的曝光光束，通过空间光调制器并根据要曝光和形成的图像，进行曝光处理，所述多光束曝光 具有：开口板，其具有设置在所述曝光表面上的开口，并且阻挡除了在所述空间光调制器处的光量数据的测量对象之外的光，所述开口允许通过与所述曝光光束相对应的像素 空间光调制器的光量数据的测量对象; 进给操作机构，其使得所述开口在扫描曝光时沿与扫描方向相交的方向移动; 以及测量穿过开口的曝光光束的光量的光接收元件。

    Methacrylate-based polymer and process for producing the same
    67.
    发明授权
    Methacrylate-based polymer and process for producing the same 有权
    基于甲基丙烯酸酯的聚合物及其制备方法

    公开(公告)号：US06716918B2

    公开(公告)日：2004-04-06

    申请号：US10023220

    申请日：2001-12-20

    申请人： Takahiro Saito ,  Osamu Nishizawa ,  Takeshi Fukuda

    发明人： Takahiro Saito ,  Osamu Nishizawa ,  Takeshi Fukuda

    IPC分类号： C08F238

    CPC分类号： C08F20/12 ,  C08F293/005 ,  C08F2438/01 ,  C08L53/00 ,  C09D153/00 ,  C09J153/00

    摘要： In accordance with the present invention, there is provided a process for producing a polymer by a living radical polymerization method which is also applicable to the polymerization of a methacrylate monomer, and a methacrylate-based polymer having a narrow molecular weight distribution which is produced by the above process. Specifically, the present invention relates to a process for producing a methacrylate-based polymer by a atom transfer radical polymerization method in which a polymerizable monomer containing at least one methacrylate monomer is polymerized in the presence of a redox catalyst comprising a metal complex containing at least one transition metal as a central metal selected from the group consisting of elements of Groups 7 to 11 of the Periodic Table, using an organohalogen compound or a halogenated sulfonyl compound as a polymerization initiator.

    摘要翻译： 根据本发明，提供了一种通过活性自由基聚合法制备聚合物的方法，该方法也可应用于甲基丙烯酸酯单体的聚合和具有窄分子量分布的甲基丙烯酸酯聚合物，其由 上述过程。 具体地说，本发明涉及一种通过原子转移自由基聚合法生产甲基丙烯酸酯类聚合物的方法，其中含有至少一种甲基丙烯酸酯单体的可聚合单体在包含至少含有至少一种甲基丙烯酸酯的金属络合物的氧化还原催化剂的存在下聚合 一种过渡金属作为中心金属，使用有机卤素化合物或卤代磺酰化合物作为聚合引发剂，所述过渡金属选自元素周期表第7至11族的元素。

    Integrated circuit device that can suppress undesired inter-device effects
    68.
    发明授权
    Integrated circuit device that can suppress undesired inter-device effects 有权

    公开(公告)号：US06593601B2

    公开(公告)日：2003-07-15

    申请号：US10136930

    申请日：2002-04-30

    申请人： Takeshi Fukuda ,  Junji Itoh

    发明人： Takeshi Fukuda ,  Junji Itoh

    IPC分类号： H01L2974

    CPC分类号： H01L21/763 ,  H01L21/765

    摘要： When forming first and second circuits on a semiconductor substrate, an isolation region is provided between the first and second circuits by embedding a conductor in the semiconductor substrate. Also, an output node of a low impedance voltage output circuit that provides a fixed voltage at low impedance is connected to the isolation region. In this way, a noise current caused by high-frequency noise generated from the first or second circuit flows into the low impedance voltage output circuit. Hence leakage of noise signals between the circuits can be suppressed.

    Method for producing semiconductor integrated circuit
    69.
    发明授权
    Method for producing semiconductor integrated circuit 有权
    半导体集成电路的制造方法

    公开(公告)号：US06329262B1

    公开(公告)日：2001-12-11

    申请号：US09256738

    申请日：1999-02-24

    申请人： Takeshi Fukuda ,  Hiroshi Takenaka ,  Hidetoshi Furukawa ,  Takeshi Fukui ,  Daisuke Ueda

    发明人： Takeshi Fukuda ,  Hiroshi Takenaka ,  Hidetoshi Furukawa ,  Takeshi Fukui ,  Daisuke Ueda

    IPC分类号： H01L2162

    CPC分类号： H01L27/0658 ,  H01L27/0802

    摘要： A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor. The semiconductor integrated circuit is provided so as to have a predetermined resistance by measuring electric characteristics of the semiconductor integrated circuit; obtaining a difference between the measured electric characteristics and desired electric characteristics to calculate a required adjusting amount of a resistance of the thermal resistor; and adjusting the resistance of the thermal resistor by the adjusting amount through heating of the thermal resistor with electric power.

    摘要翻译： 半导体集成电路包括由包含至少约5重量％的硅的钨硅氮化物制成的热电阻器，并且直接或经由绝缘膜形成在半导体衬底上。 半导体集成电路通过包括以下步骤的方法制造：在半导体衬底上形成硅化钨化硅膜; 以预定图案图案化硅化钨氮化膜以形成热电阻; 并形成一对要连接到热电阻器的电极。 半导体集成电路通过测量半导体集成电路的电特性而具有预定的电阻; 获得所测量的电特性和所需电特性之间的差以计算热敏电阻的电阻的所需调整量; 并且通过用电力加热热敏电阻器来调整热敏电阻的电阻达到调节量。

    Ball mill, a method for preparing fine metal powder, and fine metal powder prepared by the method
    70.
    发明授权
    Ball mill, a method for preparing fine metal powder, and fine metal powder prepared by the method 失效
    球磨机，金属粉末的制备方法以及通过该方法制备的金属微粉末

    公开(公告)号：US06196480B1

    公开(公告)日：2001-03-06

    申请号：US09274020

    申请日：1999-03-22

    申请人： Takeshi Fukuda ,  Kensuke Hidaka ,  Tamiho Mizutani ,  Motonori Nishida ,  Yoshio Kohira

    发明人： Takeshi Fukuda ,  Kensuke Hidaka ,  Tamiho Mizutani ,  Motonori Nishida ,  Yoshio Kohira

    IPC分类号： B02C1718

    CPC分类号： B02C23/32 ,  B02C17/16 ,  B02C17/1815

    摘要： There is provided a ball mill having a milling chamber into which metal powder is fed. The ball mill is also provided with milling means for milling metal powder into fine metal powder having a particle size less than a predetermined size. When the ball mill operates, a quantity of heat (Q0) is generated in the milling chamber. The milling chamber is cooled by liquid cooling means and gas cooling means according to the present invention. The liquid cooling means causes cooling liquid to flow along the outside wall of the milling chamber to remove a quantity of heat (Q1) during the ball mill operation. The gas cooling means causes cooling gas to flow through the milling chamber to remove a quantity of heat (Q2) during the ball mill operation. The generated quantity of heat (Q0) can be counterbalanced with the sum of the removed quantities of heat (Q1) and (Q2) so as to prevent the inside of the milling chamber from overheating, so that the ball mill can operate in the condition of Q0/V≧0.05 kW/l, where V is the inner volume of the milling chamber.

    摘要翻译： 提供了一种具有研磨室的球磨机，金属粉末被供给到该研磨室中。 球磨机还设置有用于将金属粉末研磨成具有小于预定尺寸的粒度的细金属粉末的铣削装置。 当球磨机操作时，在研磨室中产生一定量的热量（Q0）。 研磨室由根据本发明的液体冷却装置和气体冷却装置冷却。 液体冷却装置使冷却液沿研磨室的外壁流动，以在球磨机操作期间去除一定量的热量（Q1）。 气体冷却装置使得冷却气体流过研磨室以在球磨机操作期间去除一定量的热量（Q2）。 所产生的热量（Q0）可以与去除的热量（Q1）和（Q2）的总和平衡，以防止研磨室的内部过热，使得球磨机能够在条件 的Q0 / V> = 0.05kW / l，其中V是研磨室的内部体积。