摘要:
A nonvolatile semiconductor memory device comprises a memory cell. The memory cell includes a first gate insulating film formed on a semiconductor substrate, a floating gate formed on the first gate insulating film, a second gate insulating film formed on the floating gate, and a control gate formed on the second gate insulating film. The floating gate includes a first semiconductor film which contacts the first gate insulating film, and a metal film stacked on the semiconductor film. An effective tunneling thickness between the semiconductor substrate and the floating gate in a read operation is thicker than an effective tunneling thickness between the semiconductor substrate and the floating in a write operation.
摘要:
In a nonvolatile semiconductor memory device provided with memory cell transistors arranged in a direction and a select transistor to select the memory cell transistors, each of the memory cell transistors of a charge trap type are at least composed of a first insulating layer and a first gate electrode respectively, and the select transistor is at least composed of a second insulating layer and a second gate electrode. The first gate electrode is provided with a first silicide layer of a first width formed on the first insulating layer. The second gate electrode is provided with an impurity-doped silicon layer formed on the second insulating layer and with a second silicide layer of a second width formed on the impurity-doped silicon layer. The second silicide has the same composition as the first silicide. The second width is larger than the first width.
摘要:
A method for manufacturing a semiconductor device is provided, which includes forming a gate insulating film on a semiconductor substrate, forming a first layer on the gate insulating film, the first layer containing a first p-type impurity and, an amorphous or polycrystalline formed of Si1-xGex (0≦x
摘要翻译:提供一种制造半导体器件的方法,其包括在半导体衬底上形成栅极绝缘膜,在栅极绝缘膜上形成第一层,第一层包含第一p型杂质,以及由 Si1-xGex(0 <= x <0.25),对第一层进行第一热处理,其中第一层在高于1100℃的温度下加热1毫秒以下,在第一层上形成第二层 所述第二层包含第二p型杂质并由非晶硅或多晶硅形成,所述第二p型杂质的共价键半径小于所述第一p型杂质的半值,并且使所述第二层经受第二层 热处理以在800℃至1100℃的温度下加热第二层。
摘要:
A semiconductor device according to an embodiment of the present invention includes: a semiconductor substrate; an isolation structure formed in a trench, formed in the semiconductor substrate, through a semiconductor oxide film; a floating gate formed on the semiconductor substrate between the isolation structures through an insulating film; a gate oxidation protection film formed on a side surface, on the isolation structure side, of the floating gate so that each of a part of a side surface and a bottom surface of the gate oxidation protection film contacts the insulating film; and a control gate formed on the floating gate through an inter-gate insulating film.
摘要:
A semiconductor device has a supporting substrate applied with a predetermined potential, an insulating layer formed on the supporting substrate, a semiconductor layer formed on the insulating layer, a FDSOI transistor formed on the semiconductor layer and including a source region, a drain region, and a channel region, the channel region being formed between the source region and the drain region, and a high-concentration impurity region formed in a vicinity of a surface of the supporting substrate at least just below the channel region, in which an average impurity concentration in the vicinity of the surface of the supporting substrate just below the channel region is not lower than an impurity concentration of the channel region.
摘要:
A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a maximum radius of the covalent bond of the semiconductor constituent atom; wherein the first and second impurity atoms are arranged in a nearest neighbor lattice site location and at least one of the first and second impurity atoms is electrically active.
摘要:
A semiconductor device includes a semiconductor substrate; an insulation film provided on the semiconductor substrate; and an electrode provided on the insulation film, and containing boron and a semiconductor material, wherein at least one element of the group V and carbon is introduced into an interface between the insulation film and the electrode.
摘要:
An aspect of the present invention includes; a silicon oxynitride film having an oxynitride layer which is formed on at least the surface of a silicon substrate and in which nitrogen atoms are in a three-coordinate bond state, and a silicon oxide layer which is formed between said oxynitride layer and said silicon substrate.
摘要:
A gate electrode of an n-channel IGFET includes a first region composed of at least a first IV group element and a second IV group element which are different from each other, and a second region composed of the first IV group element. Similarly, a gate electrode of a p-channel IGFET includes first and second regions. For example, the first region is made of SiGe while the second region is made of Si. In both of the n-channel and P-channel IGFET, silicide electrodes are formed on the gate electrodes 4N and 4P through silicidation of at least parts of the second regions.