公开(公告)号：US11793059B2

公开(公告)日：2023-10-17

申请号：US17394769

申请日：2021-08-05

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Jason Paynter ,  Gregory McGraw ,  Matthew King

IPC: H10K71/00 ,  H10K50/842 ,  H10K71/60

CPC classification number: H10K71/00 ,  H10K50/8426 ,  H10K71/611 ,  H10K71/811 ,  H10K71/821

Abstract: Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.

公开(公告)号：US11761076B2

公开(公告)日：2023-09-19

申请号：US17306665

申请日：2021-05-03

Applicant: The Regents of the University of Michigan ,  Universal Display Corporation

Inventor： Stephen Forrest ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Diane L. Peters

IPC: C23C14/12 ,  C23C14/22 ,  C23C14/24

CPC classification number: C23C14/12 ,  C23C14/228 ,  C23C14/243 ,  Y10T137/85938

Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

公开(公告)号：US11751468B2

公开(公告)日：2023-09-05

申请号：US17380169

申请日：2021-07-20

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Siddharth Harikrishna Mohan ,  Gregory McGraw ,  Xin Xu

IPC: H10K71/12 ,  C23C14/24 ,  C23C14/12 ,  C23C14/04 ,  C23C14/54 ,  H10K71/00 ,  H10K71/18 ,  B41J2/14 ,  B41M3/00 ,  H10K50/11 ,  H10K101/30 ,  H10K101/40

CPC classification number: H10K71/12 ,  B41J2/14 ,  B41M3/006 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C23C14/54 ,  H10K71/00 ,  H10K71/18 ,  H10K50/11 ,  H10K2101/30 ,  H10K2101/40

Abstract: Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

公开(公告)号：US11683973B2

公开(公告)日：2023-06-20

申请号：US16778200

申请日：2020-01-31

Applicant: Universal Display Corporation

Inventor： Gregory McGraw ,  William E. Quinn ,  Steven Buswell

IPC: H10K71/13 ,  B05B1/02 ,  C23C16/455 ,  C23C14/22 ,  C23C14/04 ,  C23C16/44 ,  C23C14/12 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L33/62 ,  H10K71/00 ,  H10K71/16

CPC classification number: H10K71/135 ,  B05B1/02 ,  C23C14/04 ,  C23C14/12 ,  C23C14/228 ,  C23C16/4412 ,  C23C16/45563 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49513 ,  H01L24/14 ,  H01L24/89 ,  H01L33/62 ,  H10K71/00 ,  H10K71/16

Abstract: Embodiments of the disclosed subject matter provide a device including a carrier plate, and a die including a mating surface with a patterned thin film of metal or metal oxide surface bonded to the carrier plate using a solder preform with voids that overlay the patterned thin film on the die, where the oxide surface is disposed opposite a moat in a mating surface of the carrier plate, and where the voided regions remain free of solder when the solder is reflowed.

公开(公告)号：US10998531B2

公开(公告)日：2021-05-04

申请号：US16184105

申请日：2018-11-08

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Gregory McGraw

IPC: H01L51/56 ,  H01L51/50 ,  H01L51/00 ,  C23C14/22 ,  B41J2/04 ,  B41J2/155 ,  C23C14/04 ,  C23C14/12 ,  B41J25/316 ,  B41J25/308

Abstract: Implementations of the disclosed subject matter provide a print bar for organic vapor jet (OVJP) deposition is provided that includes a plurality of n print head segments, where each of the plurality of print head segments may have an OVJP print head. The print bar may include a plurality of distance sensors, where each of the plurality of distance sensors may be configured to measure a distance between a substrate disposed below the print bar and a portion of at least one of the print head segments. The print bar may include a plurality of not more than n+1 actuators configured to adjust at least one of a position and an orientation of one or more of the plurality of print head segments based upon one or more distances between the substrate and the print bar measured by one or more of the plurality of distance sensors.

公开(公告)号：US10566534B2

公开(公告)日：2020-02-18

申请号：US15291756

申请日：2016-10-12

Applicant: Universal Display Corporation

Inventor： Matthew King ,  William E. Quinn ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Elliot H. Hartford, Jr. ,  Benjamin Swedlove ,  Gregg Kottas ,  Tomasz Trojacki ,  Julia J. Brown

IPC: C23C14/12 ,  C23C14/24 ,  H01L51/56 ,  H01L51/00 ,  H01L51/50 ,  H01L51/52 ,  C23C14/22

Abstract: Systems and arrangements of OVJP deposition devices are provided, in which one or more organic material crucibles are directly attached to an injection block and a print head without the need for external delivery components such as feedtubes. Each crucible may be hermetically sealed until it is attached to the injection block, allowing for a single device to provide for storage, transport, and deposition of the organic material.

公开(公告)号：US10483498B2

公开(公告)日：2019-11-19

申请号：US15492556

申请日：2017-04-20

Applicant: UNIVERSAL DISPLAY CORPORATION

Inventor： William E. Quinn ,  Gregory McGraw

IPC: H01L51/56 ,  H01L51/00 ,  C23C16/448 ,  C23C16/455

Abstract: A source of material for use in a deposition system includes one or more baffles or equivalent structures within the source. The baffles provide for increased concentration of material entrained in a carrier gas that is passed through and emitted by the source.

公开(公告)号：US10243023B2

公开(公告)日：2019-03-26

申请号：US14698352

申请日：2015-04-28

Applicant: Universal Display Corporation

Inventor： Michael Hack ,  Michael Stuart Weaver ,  Ruiqing Ma ,  William E. Quinn ,  Gregory McGraw

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Full-color pixel arrangements for use in devices such as OLED displays are provided, in which multiple sub-pixels are configured to emit different colors of light, with each sub-pixel having a different optical path length than some or all of the other sub-pixels within the pixel.

公开(公告)号：US09818967B2

公开(公告)日：2017-11-14

申请号：US13930229

申请日：2013-06-28

Applicant: Universal Display Corporation

Inventor： Ruiqing Ma ,  Julia J. Brown ,  Michael Hack ,  Siddharth Harikrishna Mohan ,  Gregory McGraw

IPC: H01L51/52 ,  G02B1/14 ,  H01L51/56 ,  G02B1/10 ,  G02B3/00

CPC classification number: H01L51/52 ,  G02B1/105 ,  G02B1/14 ,  G02B3/0006 ,  G02B3/0056 ,  H01L51/5275 ,  H01L51/56

Abstract: Optical components and devices are provided that include a substrate, a microlens array, and a barrier film system conformally covering the microlens array. An OLED may be optically coupled to the microlens array. The barrier film may provide protection to the microlens array or other components, without having a significant negative impact on outcoupling of light from the coupled OLED by the microlens array.

公开(公告)号：US20170294615A1

公开(公告)日：2017-10-12

申请号：US15475408

申请日：2017-03-31

Applicant: Universal Display Corporation

Inventor： Edwin van den Tillaart ,  Sven Pekelder ,  Mark Meuwese ,  William E. Quinn ,  Gregory McGraw ,  Gregg Kottas

IPC: H01L51/50 ,  H01L51/56 ,  B05B1/00 ,  H01L51/00

CPC classification number: C23C14/24 ,  C23C14/12 ,  H01L51/0005 ,  H01L51/0085

Abstract: A deposition nozzle is provided that includes offset deposition apertures disposed between exhaust apertures on either side of the deposition apertures. The provided nozzle arrangements allow for deposition of material with a deposition profile suitable for use in devices such as OLEDs.