公开(公告)号：US09833922B2

公开(公告)日：2017-12-05

申请号：US14993420

申请日：2016-01-12

申请人： DISCO CORPORATION

发明人： Shuji Nitta

IPC分类号： B26D7/26 ,  B28D5/02 ,  B23B31/30

CPC分类号： B26D7/2621 ,  B23B31/307 ,  B26D7/26 ,  B28D5/022 ,  Y10T279/11

摘要： A mount flange for mounting a cutting blade on a spindle is provided. The cutting blade has a central engaging hole and a peripheral cutting edge. The mount flange includes a cylindrical boss portion having a front portion adapted to be inserted into the engaging hole of the cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with the spindle, and a flange portion projecting radially outward from the rear portion of the boss portion and having a front surface functioning as a mounting surface adapted to come into abutment against one side surface of the cutting blade. An annular space is formed in the mount flange so as to surround the spindle and open to the inner circumferential surface of the boss portion, thereby suppressing rearward warpage of the outer circumference of the flange portion due to the rotation of the spindle.

公开(公告)号：US20170338100A1

公开(公告)日：2017-11-23

申请号：US15527619

申请日：2015-10-07

申请人： Sumitomo Electric Industries, Ltd.

发明人： Mitsuhiko Sakai ,  Hiroyuki Kitabayashi

IPC分类号： H01L21/02 ,  H01L21/683 ,  H01L21/04 ,  H01L21/67 ,  H01L29/16 ,  H01L21/768

CPC分类号： H01L21/02035 ,  B28D5/0064 ,  B28D5/022 ,  H01L21/0445 ,  H01L21/3043 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/76865 ,  H01L21/78 ,  H01L29/1608 ,  H01L2221/68327 ,  H01L2221/68381

摘要： In accordance with the following step of a method of manufacturing a MOSFET, a first cutting step of cutting a silicon carbide wafer along a plane substantially parallel to a {11-20} plane is performed. After the first cutting step, a second cutting step of cutting the silicon carbide wafer along a plane substantially perpendicular to the {11-20} plane and substantially perpendicular to the first main surface is performed.

公开(公告)号：US09676114B2

公开(公告)日：2017-06-13

申请号：US13408327

申请日：2012-02-29

申请人： Chun-Ting Kuo ,  Kei-Wei Chen ,  Ying-Lang Wang ,  Kuo-Hsiu Wei

发明人： Chun-Ting Kuo ,  Kei-Wei Chen ,  Ying-Lang Wang ,  Kuo-Hsiu Wei

IPC分类号： B26D1/143 ,  B28D5/02 ,  B24D5/02 ,  B24D5/12 ,  B23D61/02 ,  B28D1/04 ,  B26D7/18 ,  B28D1/12

CPC分类号： B26D7/18 ,  B23D61/02 ,  B23D61/021 ,  B24D5/02 ,  B24D5/12 ,  B26D1/143 ,  B28D1/04 ,  B28D1/121 ,  B28D5/022 ,  Y10T83/0448 ,  Y10T83/9372

摘要： A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

公开(公告)号：US09636844B2

公开(公告)日：2017-05-02

申请号：US14333016

申请日：2014-07-16

申请人： DISCO CORPORATION

发明人： Nobuhiko Wakita

IPC分类号： B26D7/26 ,  B28D5/02 ,  B23B31/30 ,  B28D5/00 ,  B24B45/00 ,  B27B5/30 ,  B27B5/32 ,  B24B27/06

CPC分类号： B28D5/02 ,  B23B31/307 ,  B24B27/06 ,  B24B45/00 ,  B26D7/2621 ,  B27B5/30 ,  B27B5/32 ,  B28D5/0082 ,  B28D5/022 ,  Y10T83/647 ,  Y10T83/9379

摘要： A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

公开(公告)号：US09627260B2

公开(公告)日：2017-04-18

申请号：US15077423

申请日：2016-03-22

申请人： DISCO CORPORATION

发明人： Kazuma Sekiya

IPC分类号： H01L21/78 ,  H01L21/66 ,  B23Q17/09 ,  H01L21/304 ,  B28D5/00 ,  B28D5/02

CPC分类号： H01L21/78 ,  B23Q17/0952 ,  B28D5/0064 ,  B28D5/022 ,  H01L21/304 ,  H01L21/3043 ,  H01L22/12 ,  H01L22/20

摘要： A workpiece cutting method of cutting a workpiece having a front side on which a plurality of crossing division lines are formed to define a plurality of separate regions where a plurality of devices are each formed is disclosed. The workpiece cutting method includes a workpiece cutting step of cutting the workpiece held on a first chuck table along the division lines by using a cutting blade, a dummy wafer cutting step of cutting a dummy wafer held on a second chuck table by using the cutting blade, a dummy wafer imaging step of imaging a cut groove formed on the dummy wafer in the dummy wafer cutting step, by using an imaging unit to thereby obtain a detected image, and a determining step of determining the condition of the cutting blade from the condition of chippings formed on both sides of the cut groove in the detected image.

公开(公告)号：US20160260626A1

公开(公告)日：2016-09-08

申请号：US15051241

申请日：2016-02-23

申请人： DISCO CORPORATION

发明人： Kenji Takenouchi

IPC分类号： H01L21/67 ,  H01L21/78 ,  B28D5/02

CPC分类号： H01L21/67092 ,  B28D5/022 ,  H01L21/78

摘要： Disclosed herein is a cutting apparatus including a chuck table for holding a workpiece, a cutting unit for cutting the workpiece held on the chuck table, and a feeding mechanism for relatively moving the chuck table and the cutting unit. The cutting unit includes a spindle adapted to be rotationally driven, a rotatable cutting blade mounted on the spindle and having a peripheral cutting edge, a cutting water nozzle for supplying a cutting water to the cutting blade, a photocatalyst member provided so as to come into contact with the cutting water supplied from the cutting water nozzle, and a light applying unit for exciting the photocatalyst member to thereby give an oxidizing power due to hydroxy radicals to the cutting water.

摘要翻译： 本发明公开了一种切割装置，包括用于保持工件的卡盘台，用于切割保持在卡盘台上的工件的切割单元和用于相对移动卡盘台和切割单元的进给机构。 所述切割单元包括适于被旋转地驱动的主轴，安装在所述主轴上并具有周边切割刃的可旋转切割刀片，用于向切割刀片供应切割水的切割水喷嘴，设置成进入 与从切割水喷嘴供应的切割水接触，以及用于激发光催化剂构件的光施加单元，从而由于羟基自由基而向切割水产生氧化力。

公开(公告)号：US20160207216A1

公开(公告)日：2016-07-21

申请号：US14993420

申请日：2016-01-12

申请人： DISCO CORPORATION

发明人： Shuji Nitta

IPC分类号： B26D7/26 ,  B28D5/02 ,  B23B31/30

CPC分类号： B26D7/2621 ,  B23B31/307 ,  B26D7/26 ,  B28D5/022 ,  Y10T279/11

摘要： A mount flange for mounting a cutting blade on a spindle is provided. The cutting blade has a central engaging hole and a peripheral cutting edge. The mount flange includes a cylindrical boss portion having a front portion adapted to be inserted into the engaging hole of the cutting blade and a rear portion whose inner circumferential surface is adapted to be engaged with the spindle, and a flange portion projecting radially outward from the rear portion of the boss portion and having a front surface functioning as a mounting surface adapted to come into abutment against one side surface of the cutting blade. An annular space is formed in the mount flange so as to surround the spindle and open to the inner circumferential surface of the boss portion, thereby suppressing rearward warpage of the outer circumference of the flange portion due to the rotation of the spindle.

摘要翻译： 提供了用于将切割刀片安装在主轴上的安装法兰。 切割刀片具有中心接合孔和周边切割刃。 安装凸缘包括具有适于插入切割刀片的接合孔的前部的圆柱形凸台部分和内圆周表面适于与主轴接合的后部，以及从主轴向径向向外突出的凸缘部分 凸台部分的后部，并具有用作与切割刀片的一个侧表面邻接的安装表面的前表面。 在安装凸缘中形成环状空间，以环绕主轴并向凸起部的内周面开口，从而抑制由于主轴的旋转引起的凸缘部的外周的向后翘曲。

公开(公告)号：US09023687B2

公开(公告)日：2015-05-05

申请号：US13947512

申请日：2013-07-22

申请人： Disco Corporation

发明人： Kazuma Sekiya

IPC分类号： H01L21/00 ,  H01L21/78 ,  B28D5/00 ,  B28D5/02 ,  H01L21/304 ,  B24B41/06 ,  B24B7/22

CPC分类号： H01L21/78 ,  B24B7/228 ,  B24B41/061 ,  B28D5/0094 ,  B28D5/022 ,  H01L21/304 ,  H01L2224/97

摘要： A package substrate processing method of dividing a package substrate into a plurality of individual package devices along a plurality of division lines, the package substrate being composed of an electrode plate and a synthetic resin layer formed on the back side of the electrode plate for molding the package devices. The package substrate processing method includes an internal stress relieving step of cutting the electrode plate of the package substrate along a selected one of the division lines to form a relief groove, thereby relieving an internal stress in the package substrate, a resin layer planarizing step of grinding the synthetic resin layer of the package substrate to thereby planarize the synthetic resin layer, and a package substrate dividing step of dividing the package substrate held on a holding table under suction along the division lines.

摘要翻译： 一种封装基板处理方法，其特征在于，沿着多条分割线将封装基板分割为多个单独的封装器件，所述封装基板由电极板和合成树脂层构成，所述合成树脂层形成在所述电极板的背面， 封装器件。 封装基板处理方法包括：沿着选择的分割线切割封装基板的电极板的内部应力消除步骤，以形成溢流槽，从而减轻封装基板中的内部应力;树脂层平坦化步骤 研磨封装基板的合成树脂层，从而使合成树脂层平坦化;以及封装基板分割步骤，沿着分割线将保持在保持台上的封装基板分开吸引。

公开(公告)号：US20150020666A1

公开(公告)日：2015-01-22

申请号：US14333016

申请日：2014-07-16

申请人： DISCO CORPORATION

发明人： Nobuhiko Wakita

IPC分类号： B28D5/02 ,  B28D5/00 ,  B23B31/30

CPC分类号： B28D5/02 ,  B23B31/307 ,  B24B27/06 ,  B24B45/00 ,  B26D7/2621 ,  B27B5/30 ,  B27B5/32 ,  B28D5/0082 ,  B28D5/022 ,  Y10T83/647 ,  Y10T83/9379

摘要： A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

摘要翻译： 切割单元包括主轴，主轴壳体，主轴前部的支撑凸缘，可拆卸地支撑在支撑凸缘上的切割刀片以及用于将切割刀片固定到支撑凸缘的固定凸缘。 支撑凸缘包括适于插入穿过切割刀片的中心开口的凸台部分，用于支撑切割刀片的一个侧面的凸缘部分和用于接合主轴前部的圆柱形部分。 凸缘部具有朝向固定凸缘开口的吸入孔，圆筒部具有与吸入孔连通的连通孔。 连通孔通过固定到主轴壳体的旋转接头连接到真空源，使得连通孔和真空源之间的连通通过开关阀选择性地进行。

公开(公告)号：US08758087B2

公开(公告)日：2014-06-24

申请号：US13114141

申请日：2011-05-24

申请人： Kyohei Koutake ,  Hiromichi Morita ,  Fumiyoshi Kano ,  Tetsuji Yamaguchi ,  Sumitomo Inomata ,  Masatake Nagaya

发明人： Kyohei Koutake ,  Hiromichi Morita ,  Fumiyoshi Kano ,  Tetsuji Yamaguchi ,  Sumitomo Inomata ,  Masatake Nagaya

IPC分类号： B24B1/00 ,  B24B49/16

CPC分类号： B28D5/022 ,  B28D5/0082 ,  H01L21/02008 ,  H01L21/02013

摘要： In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.

摘要翻译： 在晶片处理方法中，将锭切成晶片，通过抛光晶片的表面使晶片平坦化。 当晶片平坦化时，将晶片设置在晶片保持器上并且晶片旋转，将热量施加到晶片的一部分，以在晶片的部分形成重整层，并且抛光工具 在旋转的同时与晶片的该部分接触以抛光晶片的该部分。