公开(公告)号：US20010003966A1

公开(公告)日：2001-06-21

申请号：US09735902

申请日：2000-12-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takahiro Kitano ,  Masateru Morikawa ,  Yukihiko Esaki ,  Nobukazu Ishizaka ,  Norihisa Koga ,  Kazuhiro Takeshita ,  Hirofumi Ookuma ,  Masami Akimoto

IPC: B05C011/00 ,  B05C013/00 ,  B05C013/02

CPC classification number: H01L21/6715

Abstract: A discharge nozzle in a film forming apparatus of the present invention includes a substantially cylindrical support member and a thin plate or a thin plate portion supported on a face on a substrate side of the support member and closing the face on the substrate side, and a discharge port for discharging a coating solution is provided in the thin plate or the thin plate portion. It is possible to form a smaller discharge port in the thin plate or the thin plate portion by laser processing, punching, or the like than that obtainable by conventional injection molding processing. An amount of discharge and a discharge area on the substrate of the coating solution can be controlled more precisely. The film forming apparatus of the present invention includes a cleaning device for cleaning the discharge nozzle which includes a cleaning solution jet port for jetting a cleaning solution for cleaning to the discharge port of the discharge nozzle and a suction port for sucking an atmosphere in the vicinity of the discharge port. Contaminants adhering to the discharge port are removed more completely than before. Accordingly, the cleaning can be conducted effectively even if the diameter of the discharge port is very small. The suction port can suck and drain properly the cleaning solution jetted to the discharge port, preventing scatter of the cleaning solution and contamination around the discharge port.

Abstract translation: 本发明的成膜装置中的排出喷嘴包括基本上圆柱形的支撑构件和支撑在支撑构件的基板侧的面上的薄板或薄板部分，并且封闭基板侧的面，并且 用于排出涂布溶液的排出口设置在薄板或薄板部分中。 通过激光加工，冲孔等可以在薄板或薄板部分中形成比通过常规注塑加工可获得的更小的排出口。 可以更精确地控制涂布液的基板上的排出量和排出面积。 本发明的成膜装置包括一个用于清洗排放喷嘴的清洁装置，该清洗装置包括一个用于将清洗用清洗液喷射到排出喷嘴的排出口的清洗液喷射口和吸附附近的气氛的吸入口 的排放口。 附着在排出口的污染物比以前更完全地去除。 因此，即使排出口的直径非常小，也可以有效地进行清洗。 吸入口可以正确地吸入和排出喷射到排出口的清洁溶液，防止清洁溶液的散射和排出口周围的污染。

公开(公告)号：US20040226506A1

公开(公告)日：2004-11-18

申请号：US10438552

申请日：2003-05-14

Inventor： David Mark Lynn

IPC: B05C013/00 ,  B05C013/02

CPC classification number: H01L21/67316 ,  H01L21/67057 ,  H01L21/67086

Abstract: The present invention comprises a wafer boat, bath, or related components that are covered with a fluoropolymer coating. In a preferred form, the components have standard quartz structures that are covered with a protective fluoropolymer coating. In alternate embodiments, glass, plastic, or even metal is used for the structure of the boat or related components, then covered with a protective layer of fluoropolymer. In accordance with another preferred aspect, the coating is clear. In alternate embodiments, however, the coating includes a pigment. In some preferred embodiments, the coating comprises multiple layers with different colors for each layer so that wear will be readily apparent.

Abstract translation: 本发明包括用氟聚合物涂层覆盖的晶片舟，浴槽或相关部件。 在优选形式中，组分具有被保护性氟聚合物涂层覆盖的标准石英结构。 在替代实施例中，玻璃，塑料或甚至金属用于船或相关部件的结构，然后用氟聚合物的保护层覆盖。 根据另一个优选的方面，涂层是透明的。 然而，在替代实施例中，涂层包括颜料。 在一些优选的实施方案中，涂层包括用于每层的不同颜色的多层，使得磨损将容易明显。

公开(公告)号：US20040216664A1

公开(公告)日：2004-11-04

申请号：US10628598

申请日：2003-07-28

Inventor： Joseph W. Daggett ,  Daniel J. Williams ,  Kevin G. Kemp ,  Joseph W. Cayton

IPC: B05C013/00

CPC classification number: H01L21/67253 ,  B05C9/14 ,  B05C11/08 ,  B05C11/1042

Abstract: A liquid coating device and method for coating a coatable composition on a workpiece to form a coating, wherein a parameter indicative of barometric pressure is measured and at least one thickness-affecting process parameter is adjusted in order to compensate for the effects of variations in barometric pressure on coating thickness uniformity.

公开(公告)号：US20040081756A1

公开(公告)日：2004-04-29

申请号：US10433497

申请日：2003-11-24

Inventor： Timothy D. Coots ,  Will Stephau

IPC: B05D003/02 ,  B05D003/12 ,  B05C013/00

CPC classification number: B05D7/574 ,  B05B13/0221 ,  B05B16/20 ,  B05D3/002 ,  B05D3/0254 ,  B05D7/534 ,  B05D7/544

Abstract: A workpiece coating apparatus (12) for applying a coating to each of a plurality of workpieces (11). A coating system (14) includes a coating chamber (18) that receives the workpieces (11) for coating. A curing system (16) includes a curing chamber (20) that receives workpieces (11) for curing. A conveyor system (22) rotates the workpieces (11) about horizontal axes (38) while serially transporting them first through the coating chamber (18) for coating and then through the curing chamber (20) for curing. The coating chamber (18) and curing chamber (20) are stacked to minimize floor space requirements.

Abstract translation: 一种用于对多个工件（11）中的每一个施加涂层的工件涂覆装置（12）。 涂覆系统（14）包括接收用于涂覆的工件（11）的涂覆室（18）。 固化系统（16）包括固化室（20），其固化用于固化的工件（11）。 输送机系统（22）围绕水平轴线（38）旋转工件（11），同时首先通过涂覆室（18）串联输送它们，然后通过固化室（20）固化。 堆叠涂层室（18）和固化室（20）以最小化占地空间要求。

公开(公告)号：US20040062852A1

公开(公告)日：2004-04-01

申请号：US10260659

申请日：2002-09-30

Applicant: Medtronic, Inc.

Inventor： Peter T. Schroeder ,  Kimberly A. Chaffin

IPC: A61L002/00 ,  B05D003/02 ,  B05C013/00

CPC classification number: A61N1/0568 ,  A61N1/0575 ,  A61N1/375

Abstract: A method for coating a medical device with a drug is provided. Energy, preferably thermal energy, is applied to a crystalline deposit of a drug on the surface of a medical device to increase the molecular mobility and form a conformable drug coating with a low density of micro-cracks and other mechanical defects that can degrade the coating toughness and effective adhesion to the device surface. In a preferred embodiment, solution evaporation methods are used to deposit a crystalline coating of an anti-inflammatory steroid on a medical electrode. Heat applied at a controlled temperature, for a predetermined amount of time, induces a solid-state phase change of the drug coating providing a smooth, uniform, well-attached, conformable coating to form a layer that will elute from the electrode over time when implanted in a patient's body.

Abstract translation: 提供了一种用药物涂覆医疗器械的方法。 将能量，优选热能施加到医疗装置表面上的药物的结晶沉积物以增加分子迁移率并形成具有低密度的微裂纹和其它可能降解涂层的机械缺陷的适形药物涂层 韧性和对装置表面的有效粘附。 在优选的实施方案中，使用溶液蒸发方法将抗炎类固醇的结晶涂层沉积在医用电极上。 在受控温度下施加的热量达预定时间量，引起药物涂层的固态相变，提供平滑，均匀，良好附着的贴合涂层，以形成随时间从电极洗脱的层 植入患者的身体。

公开(公告)号：US20040020427A1

公开(公告)日：2004-02-05

申请号：US10632962

申请日：2003-08-04

Applicant: SEZ AG

Inventor： Kurt Langen

IPC: B05C013/00

CPC classification number: H01L21/68735 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  Y10S134/902

Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.

Abstract translation: 将液体施加到第一表面的边缘附近的晶片状物品，特别是晶片的限定区域液体处理的装置基本上沿径向流动到外部的外围边缘 晶片状制品，并且在该边缘周围的第二表面上，液体润湿在第二表面上的边缘附近的限定部分，随后从晶片状制品上移除。

公开(公告)号：US20030217693A1

公开(公告)日：2003-11-27

申请号：US10267987

申请日：2002-10-08

Applicant: Applied Materials, Inc.

Inventor： Michael B. Rattner ,  Rolf A. Guenther ,  Jeffrey D. Chinn

IPC: B05C013/00 ,  B05C021/00

CPC classification number: H01L21/68721 ,  H01L21/67075 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

Abstract: A substrate support assembly for processing a substrate in a processing chamber comprises a substrate carrier having a bottom surface positioned in contact with a substrate support. The substrate carrier has a recess formed into a top surface. The recess has a support surface and a support region between the bottom surface and the support surface. A shadow ring is positioned proximate the substrate carrier to partially shield the support surface of the substrate carrier.

Abstract translation: 用于处理处理室中的衬底的衬底支撑组件包括具有与衬底支撑件接触的底表面的衬底载体。 衬底载体具有形成为顶表面的凹部。 凹部具有支撑表面和底表面与支撑表面之间的支撑区域。 阴影环定位成靠近衬底载体以部分地屏蔽衬底载体的支撑表面。

公开(公告)号：US20030183340A1

公开(公告)日：2003-10-02

申请号：US10395536

申请日：2003-03-24

Applicant: NGK Insulators, Ltd.

Inventor： Kazuaki Yamaguchi ,  Yoshinobu Goto

IPC: B05C013/00 ,  H01L021/306 ,  C23C016/00

CPC classification number: H01L21/68792 ,  B32B2315/02 ,  C04B37/005 ,  C04B2237/066 ,  Y10T279/23

Abstract: A supporting structure is provided to reduce thermal stress in the joining portion of a ceramic susceptor and supporting member and to prevent joining defects in the joining face so that fine cracks or gas leakage in the joining portion may be prevented. The supporting structure has a ceramic susceptor 1A to be heated and having mounting face 2a and back face 2b. A supporting member 3 is joined with the back face 2b of the susceptor 1A. The supporting member 3 has an outer wall surface 3h, a joining face joined with the susceptor and an end face opposite to the joining face. A curved part 20 is formed between the outer wall surface 3h and back face 2b, and has a radius of curvature R of not smaller than 4 mm and not larger than 25 mm in the longitudinal direction of the supporting member 3. Furthermore, the width D1 of the joining face 3b at the outer profile thereof is smaller than the width D2 of the end face 3f at the outer profile thereof.

Abstract translation: 提供支撑结构以减少陶瓷基座和支撑构件的接合部分中的热应力并且防止接合面中的接合缺陷，从而可以防止接合部分中的细小裂缝或气体泄漏。 支撑结构具有待加热的陶瓷基座1A，并具有安装面2a和背面2b。 支撑构件3与基座1A的背面2b接合。 支撑构件3具有外壁面3h，与基座接合的接合面和与接合面相反的端面。 在外壁表面3h和背面2b之间形成弯曲部分20，并且在支撑构件3的纵向上具有不小于4mm且不大于25mm的曲率半径R。此外，宽度 接合面3b的外轮廓的D1小于端面3f的外轮廓的宽度D2。

公开(公告)号：US20030134047A1

公开(公告)日：2003-07-17

申请号：US10046218

申请日：2002-01-16

Inventor： Valery M. Dubin ,  Vincent R. Caillouette ,  Christopher D. Thomas ,  Chin-Chang Cheng

IPC: B05C013/00 ,  B05C005/00 ,  B05D001/02

CPC classification number: C23C18/1676 ,  C23C4/123 ,  C23C18/1614 ,  C23C18/1628 ,  C23C18/1692

Abstract: An apparatus for electroless spray deposition of a metal layer on a substrate, e.g., a Co shunt or barrier layer on a Cu layer on a semiconductor wafer, includes a processing chamber to hold the substrate, the processing chamber including at least one section movable between an open position to allow the substrate to be introduced into and removed from the processing chamber and a closed position to seal the processing chamber to allow for pressurization of the processing chamber. The processing chamber has an inlet to provide pressurizing gas, an exhaust line to exhaust pressurizing gas, a pressure regulator to regulate pressure there-within, and a sprayer to spray an electroless plating solution onto the substrate. A method for electroless spray deposition includes providing the in a processing chamber, sealing the processing chamber, pressurizing the processing chamber, regulating the pressure, and spraying an electroless plating solution onto the substrate.

Abstract translation: 一种金属层在衬底上无电喷涂沉积的装置，例如在半导体晶片上的Cu层上的分流或阻挡层，包括一个用于保持衬底的处理室，该处理室包括至少一个可在 打开位置以允许衬底被引入和移出处理室，并且封闭位置以密封处理室以允许处理室的加压。 处理室具有用于提供加压气体的入口，用于排放加压气体的排气管线，用于调节其内部的压力的压力调节器和喷雾器以将化学镀溶液喷射到基板上。 无电喷雾沉积的方法包括在处理室中设置密封处理室，加压处理室，调节压力，以及将化学镀溶液喷涂到基板上。

公开(公告)号：US20030101929A1

公开(公告)日：2003-06-05

申请号：US10345293

申请日：2003-01-16

Inventor： Kousuke Yoshihara ,  Akihiro Fujimoto

IPC: B05C013/00

CPC classification number: H01L21/6715

Abstract: A spin chuck for holding a wafer to the front face of which a resist solution is supplied, a cup for housing the spin chuck and forcibly exhausting an atmosphere around the wafer by exhaust from the bottom thereof, and an air flow control plate, provided in the cup to surround the outer periphery of the wafer, for controlling an air flow in the vicinity of the wafer are provided. Accordingly, a state of special air flow at an outer edge portion of a substrate to be processed can be eliminated, thereby preventing an increase in film thickness at the outer edge portion.

Abstract translation: 用于将晶片保持在供给抗蚀剂溶液的正面的旋转卡盘，用于容纳旋转卡盘的杯，并且从其底部排出强制地排出晶片周围的气氛;以及气流控制板，其设置在 提供围绕晶片的外周的杯，用于控制晶片附近的空气流。 因此，能够消除处理基板的外缘部的特殊气流的状态，防止外缘部的膜厚增大。