MATERIAL FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND

    公开(公告)号:US20230121798A1

    公开(公告)日:2023-04-20

    申请号:US17960015

    申请日:2022-10-04

    摘要: A material for forming an organic film, containing: a compound shown by formula (1); and an organic solvent. In formula (1), R1 represents one of the following formulae (2), R2 represents a nitro group, a halogen atom, a hydroxy group, an alkyloxy group, an alkynyloxy group, an alkenyloxy group, a linear, branched, or cyclic alkyl group, a trifluoromethyl group, or a trifluoromethyloxy group, “n” represents 0 or 1, “m” represents an integer of 1 to 3, “p” represents 0 or 1, “1” represents an integer of 0 to 2, and W represents a divalent organic group having 2 to 40 carbon atoms. The objective: a compound which allows the formation of an organic underlayer film having excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, favorable film-formability and adhesiveness to a substrate; and a material for forming an organic film containing the compound.