Graft copolymer and coating composition by use thereof
    62.
    发明授权
    Graft copolymer and coating composition by use thereof 失效
    接枝共聚物和使用它们的涂料组合物

    公开(公告)号:US5241035A

    公开(公告)日:1993-08-31

    申请号:US762365

    申请日:1991-09-19

    摘要: A graft copolymer, comprising a trunk polymer comprising a vinyl chloride/vinyl alcohol copolymer containing vinyl chloride and vinyl alcohol as the essential constituent monomer units, and a branch polymer comprising an organopolysiloxane grafted onto said trunk polymer, and a coating composition comprising said graft copolymer as the main component. The coating formed from the composition is excellent in slippage, water repellency and mold release properties in addition to good characteristics derived from the vinyl chloride/vinyl alcohol resin.

    摘要翻译: 一种接枝共聚物,其包括含有氯乙烯和乙烯醇作为主要构成单体单元的氯乙烯/乙烯醇共聚物的树干聚合物,以及包含接枝到所述树脂聚合物上的有机聚硅氧烷的支链聚合物,以及包含所述接枝共聚物 作为主要组成部分。 除了由氯乙烯/乙烯醇树脂得到的良好特性之外,由该组合物形成的涂层具有优异的滑动性,防水性和脱模性。

    Process for preparing a silicone resin-modified phenolic resin
    65.
    发明授权
    Process for preparing a silicone resin-modified phenolic resin 失效
    制备硅树脂改性酚醛树脂的方法

    公开(公告)号:US5177157A

    公开(公告)日:1993-01-05

    申请号:US571964

    申请日:1990-08-23

    申请人: Shoji Akamatsu

    发明人: Shoji Akamatsu

    摘要: A two-step process for the preparation of a silicone resin-modified phenolic resin is disclosed wherein an alkoxysilane-modified phenolic resin is first prepared by reacting an alkoxysilane with a phenolic resin. In a subsequent step, the alkoxysilane-modified phenolic resin is hydrolyzed and condensed by heating and stirring it with water. The resulting silicone resin-modified phenolic resin, which is free of diorganopolysiloxane units, has excellent heat resistance and excellent electrical insulating properties.

    Epoxy resin composition for sealing semiconductor
    70.
    发明授权
    Epoxy resin composition for sealing semiconductor 失效
    用于密封半导体的环氧树脂组合物

    公开(公告)号:US5114994A

    公开(公告)日:1992-05-19

    申请号:US670433

    申请日:1991-03-18

    摘要: Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends.In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone.

    摘要翻译: 本文公开了一种用于密封半导体的环氧树脂组合物,其包含增塑剂,环氧树脂,硬化剂,硬化促进剂,填料,脱模剂,着色剂和整理剂。 由具有羟基苯基的变性硅油A,具有环氧基的变性硅油B和/或具有环氧基的双功能环氧树脂的共聚物形成的分子的末端和/或分子的硅氧烷含有羟基苯基制备增容剂 在两端。 除了耐热性,耐湿性,低弹性模量,低热膨胀系数和高玻璃化转变温度之外,根据本发明的环氧树脂组合物具有比常规的更高的韧性,由于 硅胶分散性好。