MAGNETIC FLOORING SYSTEM ADHESIVE COMPOSITION

    公开(公告)号:US20190055440A1

    公开(公告)日:2019-02-21

    申请号:US15681168

    申请日:2017-08-18

    申请人: !OBAC Ltd

    发明人: Peter Roosen

    摘要: A liquid adhesive coating composition that cures into a solid form, used to non-permanently adhere interior floor or wall coverings to substrate floor or wall surfaces respectively, includes a polymer incorporating iron or other paramagnetic, superparamagnetic, ferromagnetic, or ferrimagnetic ingredients, that becomes permanently adhered to the substrate as it cures, and thereafter provides a low-tack adhesive surface that is also magnetically attractive, upon which magnetized floor or wall coverings including certain types of carpet, linoleum, vinyl, wallpaper, and other types of magnetically-backed coverings can be subsequently installed. The combined low-tack adhesive and magnetic adhesion qualities of the cured composition of the invention allow for the magnetically-backed floor or wall coverings to be sufficiently well adhered to the surface of the cured adhesive composition to remain in place during normal usage while retaining the ability for the coverings to be subsequently removed, repositioned or replaced without damaging the respective coverings, adhesive coating composition layer, or substrate.

    NOVEL HIGH-DENSITY MAGNETIC COMPOSITE MATERIAL FOR INDUCTOR

    公开(公告)号:US20170330662A1

    公开(公告)日:2017-11-16

    申请号:US15525287

    申请日:2015-06-04

    摘要: Disclosed is a novel high-density magnetic composite material for an inductor. The material is composed of 6-12% of high-temperature resin glue and 88-94% of magnetic powder body in percentage by weight. An integrated inductor magnetic core is simply prepared by means of the magnetic composite material of the disclosure without a large press, thus saving the device investment. The mold loss in a pressing process is reduced, and the production cost is reduced. The operation is simple, a magnet of a complex shape can be produced, and an oversized magnet can be produced. A closed magnetic circuit is formed, and the EMI effect is good. The magnetic composite material of the disclosure enables the density of a solidified magnet to be high under the action of special high-temperature resin glue, it can be guaranteed that the density is 5.5-6.2 g/cm3, the sensitive quality value for preparing an inductor is high, and the initial permeability can be 14μ or above. The magnetic composite material of the disclosure can bear a higher temperature, and can work at the temperature of 180° C. The magnetic composite material of the disclosure is high in utilization rate, low in scrap rate and low in dust rate, and meets the requirement for environmental protection.

    MANUFACTURING METHOD OF MAGNETIC ELEMENT
    67.
    发明申请

    公开(公告)号:US20170287631A1

    公开(公告)日:2017-10-05

    申请号:US15464269

    申请日:2017-03-20

    发明人: Kuo-Fan Lin Fu-Kai Tu

    摘要: A manufacturing method of a magnetic element includes the following steps: forming a block including a central post and at least one lateral post with magneto-conductive materials; cutting the block along a first plane passing through the central and lateral posts to form a first half body and a second half body; combining the first half body with the second half body to form a first air gap between the central post of the first half body and the central post of the second half body and a second air gap between the lateral post of the first half body and the lateral post of the second half body; and cutting or grinding the combined first half body and second half body along a second plane passing through the central post and the lateral post to form a third half body including the first and second air gaps.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    69.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    电子设备及其制造方法

    公开(公告)号:US20170025216A1

    公开(公告)日:2017-01-26

    申请号:US15283451

    申请日:2016-10-03

    申请人: CYNTEC CO., LTD.

    摘要: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

    摘要翻译: 一种电子设备的制造方法,所述方法包括:提供导线; 与埋入其中的导线形成混合物,其中所述混合物包括:第一磁粉和第二磁粉,其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径, 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理,其中,通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差,将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。