LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE
    78.
    发明申请
    LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE 有权
    无铅焊枪和无铅焊膏

    公开(公告)号:US20130276937A1

    公开(公告)日:2013-10-24

    申请号:US13989917

    申请日:2011-12-16

    IPC分类号: B23K35/02 B23K35/362

    摘要: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).

    摘要翻译: 本发明的主要目的是提供可用于生产粘度稳定性优异且在大气中甚至在焊接时具有优异润湿性的无铅焊膏的焊剂。 焊剂是基于0.1g焊剂的溴原子浓度为400〜20000ppm的无铅焊剂,含有0.01〜0.7重量%的通式(1)表示的胺化合物(a): H2N-(CH2)nX-(CH2)n-NH2(其中n表示1〜6的整数,X表示-NH-CH2CH2-NH-或哌嗪残基)。

    CLEANING AGENT FOR REMOVAL OF, REMOVAL METHOD FOR, AND CLEANING METHOD FOR WATER-SOLUBLE, LEAD-FREE SOLDER FLUX
    80.
    发明申请
    CLEANING AGENT FOR REMOVAL OF, REMOVAL METHOD FOR, AND CLEANING METHOD FOR WATER-SOLUBLE, LEAD-FREE SOLDER FLUX 有权
    用于清洗,清洁方法和清洁方法的清洁剂,用于水溶性,无铅焊剂通量

    公开(公告)号:US20120090646A1

    公开(公告)日:2012-04-19

    申请号:US13380331

    申请日:2010-08-20

    IPC分类号: B08B3/08 C11D7/60

    摘要: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

    摘要翻译: 本发明的目的是提供一种用于去除水溶性无铅焊剂的清洁剂,能够在短时间内清除能够在无铅焊接期间产生的水溶性助焊剂残留物的清洁剂 焊剂使用水溶性助焊剂,清洁剂还具有优异的溶解性能以及优异的窄间隙清洁性能。 用于除去本发明的水溶性,无铅助焊剂的清洁剂每100重量份水包含5至100重量份的二醇醚化合物(A)。