Integrated circuit packaging system with interconnects and method of manufacture thereof
    72.
    发明授权
    Integrated circuit packaging system with interconnects and method of manufacture thereof 有权
    具有互连的集成电路封装系统及其制造方法

    公开(公告)号:US08709932B2

    公开(公告)日:2014-04-29

    申请号:US12966071

    申请日:2010-12-13

    IPC分类号: H01L21/44 H01L21/00 H01L23/02

    摘要: A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.

    摘要翻译: 一种集成电路封装系统的制造方法,包括:提供具有接触焊盘的载体; 在所述载体和所述接触焊盘上形成具有第一抗蚀剂开口的第一抗蚀剂层,所述第一抗蚀剂开口部分地暴露所述第一接触焊盘; 形成第二抗蚀剂层,在所述第一抗蚀剂开口上具有第二抗蚀剂开口,所述第二抗蚀剂开口部分地暴露所述第一抗蚀剂层; 在载体上安装集成电路; 以及在所述集成电路和所述载体之间形成内部互连,所述内部互连件在所述第二抗蚀剂开口中的所述第二抗蚀剂层之间没有空间填充所述第二抗蚀剂开口。

    Semiconductor integrated circuit
    73.
    发明授权
    Semiconductor integrated circuit 有权
    半导体集成电路

    公开(公告)号:US08339150B2

    公开(公告)日:2012-12-25

    申请号:US12648736

    申请日:2009-12-29

    IPC分类号: G01R31/20

    CPC分类号: G01R31/2884

    摘要: A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.

    摘要翻译: 半导体集成电路包括:输出数据的凸块焊盘,具有比凸块焊盘大的探头测试焊盘;第一输出驱动单元,被配置为响应于输出数据以第一驱动能力驱动凸块焊盘;第二输出驱动单元, 输出驱动单元,被配置为响应于所述输出数据以比所述第一驾驶性能高的第二驾驶性能来驱动所述探针测试盘;以及多路复用单元,被配置为将所述输出数据传送到所述第一输出驱动单元或所述第二输出驱动单元 到测试模式信号。

    WIRELESS LOCAL AREA COMMUNICATION METHOD AND TERMINAL SUPPORTING THE SAME
    74.
    发明申请
    WIRELESS LOCAL AREA COMMUNICATION METHOD AND TERMINAL SUPPORTING THE SAME 有权
    无线本地区通信方法和终端支持相同

    公开(公告)号:US20120322379A1

    公开(公告)日:2012-12-20

    申请号:US13368806

    申请日:2012-02-08

    IPC分类号: H04B7/00

    摘要: Provided is a method and terminal for wireless local area communication enabling nearby terminals to be paired by generating an identifier containing identification information of an application and randomly selected channel information; broadcasting the identifier to external terminals; performing a pairing procedure with an external terminal having responded to the broadcast identifier; and communicating data related to the application with the paired external terminal.

    摘要翻译: 提供一种用于无线局域通信的方法和终端,其使得邻近终端能够通过生成包含应用的标识信息和随机选择的信道信息的标识符来配对; 将标识符广播到外部终端; 执行与响应于所述广播标识符的外部终端的配对过程; 以及将与应用相关的数据与配对的外部终端进行通信。

    Data output circuit for semiconductor memory device
    75.
    发明授权
    Data output circuit for semiconductor memory device 失效
    半导体存储器件的数据输出电路

    公开(公告)号:US08320199B2

    公开(公告)日:2012-11-27

    申请号:US12875932

    申请日:2010-09-03

    申请人: Young-Jun Yoon

    发明人: Young-Jun Yoon

    IPC分类号: G11C7/00

    CPC分类号: G11C7/1051 G11C7/1057

    摘要: A data output circuit for a semiconductor memory device includes a first driver configured to output a first drive control signal in response to a data signal, a drive controller configured to compare a voltage level of the first drive control signal with a reference voltage and output a second drive control signal, and a second driver configured to drive an output terminal in response to the first drive control signal and additionally drive the output terminal in response to the second drive control signal.

    摘要翻译: 一种用于半导体存储器件的数据输出电路包括:第一驱动器,被配置为响应于数据信号输出第一驱动控制信号;驱动控制器,被配置为将第一驱动控制信号的电压电平与参考电压进行比较,并输出一个 第二驱动控制信号,以及第二驱动器,被配置为响应于第一驱动控制信号驱动输出端子,并响应于第二驱动控制信号另外驱动输出端子。

    METHOD AND DEVICE FOR PERFORMING SERVICE IN NETWORK
    76.
    发明申请
    METHOD AND DEVICE FOR PERFORMING SERVICE IN NETWORK 审中-公开
    用于在网络中执行服务的方法和设备

    公开(公告)号:US20120297078A1

    公开(公告)日:2012-11-22

    申请号:US13363891

    申请日:2012-02-01

    IPC分类号: G06F15/16

    摘要: Methods and devices are provided for performing a service between devices in a network. A predetermined event for starting the service is recognized in a first device. A pairing is performed between the first device and a second device that is a party of the service. The pairing is ended by setting information for performing the service. The service between the first device and the second device is performed. The pairing is ended before or during performance of the service.

    摘要翻译: 提供了用于在网络中的设备之间执行服务的方法和设备。 用于启动服务的预定事件在第一设备中被识别。 在第一设备和作为服务的一方的第二设备之间执行配对。 通过设置执行服务的信息来结束配对。 执行第一设备和第二设备之间的服务。 配对在服务执行之前或期间结束。

    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
    77.
    发明申请
    INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF 有权
    具有互连的集成电路包装系统及其制造方法

    公开(公告)号:US20120146230A1

    公开(公告)日:2012-06-14

    申请号:US12966071

    申请日:2010-12-13

    IPC分类号: H01L23/498 H01L21/50

    摘要: A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a contact pad; forming a first resist layer, having a first resist opening, over the carrier and the contact pad, the first resist opening partially exposing the first contact pad; forming a second resist layer, having a second resist opening over the first resist opening, the second resist opening partially exposing the first resist layer; mounting an integrated circuit over the carrier; and forming an internal interconnect between the integrated circuit and the carrier, the internal interconnect filling the second resist opening with no space between the second resist layer in the second resist opening.

    摘要翻译: 一种集成电路封装系统的制造方法,包括:提供具有接触焊盘的载体; 在所述载体和所述接触焊盘上形成具有第一抗蚀剂开口的第一抗蚀剂层,所述第一抗蚀剂开口部分地暴露所述第一接触焊盘; 形成第二抗蚀剂层,在所述第一抗蚀剂开口上具有第二抗蚀剂开口,所述第二抗蚀剂开口部分地暴露所述第一抗蚀剂层; 在载体上安装集成电路; 以及在所述集成电路和所述载体之间形成内部互连,所述内部互连件在所述第二抗蚀剂开口中的所述第二抗蚀剂层之间没有空间填充所述第二抗蚀剂开口。

    METHOD AND DEVICE FOR LEARNING IN ELECTRONIC BOOK READER
    78.
    发明申请
    METHOD AND DEVICE FOR LEARNING IN ELECTRONIC BOOK READER 有权
    电子书阅读器学习方法与装置

    公开(公告)号:US20120129142A1

    公开(公告)日:2012-05-24

    申请号:US13297583

    申请日:2011-11-16

    申请人: Jun YOON

    发明人: Jun YOON

    IPC分类号: G09B5/00

    CPC分类号: G09B5/06 G09B7/02 G09B19/06

    摘要: Provided is a method and device for learning in an electronic book reader. A method for learning in an electronic book reader includes displaying a mask region covering an object of electronic book contents displayed on a screen, and releasing the displayed mask region to again display the covered object of the electronic book contents.

    摘要翻译: 提供了一种用于在电子书阅读器中学习的方法和装置。 一种用于在电子书阅读器中学习的方法,包括显示覆盖屏幕上显示的电子书内容的对象的掩模区域,并且释放所显示的掩模区域,以再次显示电子书内容的覆盖对象。

    FEMTOCELL ACCESS NODE, FEMTOCELL SYSTEM, AND DATA TRANSMISSION METHOD FOR THE SYSTEM
    79.
    发明申请
    FEMTOCELL ACCESS NODE, FEMTOCELL SYSTEM, AND DATA TRANSMISSION METHOD FOR THE SYSTEM 审中-公开
    FEMTOCELL访问节点,FEMTOCELL系统和数据传输方法

    公开(公告)号:US20120009913A1

    公开(公告)日:2012-01-12

    申请号:US13257497

    申请日:2010-03-24

    IPC分类号: H04W4/18

    摘要: A femto cell connection node, a femto cell system, and a data transmission method of the system are disclosed.In the case where a sending terminal is willing to transmit data to a receiving terminal, a femto cell connection node of the sending side determines a present connection state of the receiving terminal and determines a transmission format of the data to be transmitted from the sending terminal to the receiving terminal according to the determined connection state. In particular, in the present disclosure, in the case where the receiving terminal is in a state of being directly or indirectly connectable to an Internet Protocol (IP) network, the data is transmitted to the receiving terminal after changing a protocol portion L1/L2 so that the data may pass through the IP network.

    摘要翻译: 公开了一种毫微微小区连接节点,毫微微小区系统和该系统的数据传输方法。 在发送终端愿意向接收终端发送数据的情况下,发送方的毫微微小区连接节点确定接收终端的当前连接状态,并确定要从发送终端发送的数据的传输格式 根据确定的连接状态向接收终端发送。 特别地,在本公开中,在接收终端处于直接或间接连接到因特网协议(IP)网络的状态的情况下,在更改协议部分L1 / L2之后将数据发送到接收终端 使数据可以通过IP网络。