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71.发明授权Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor 有权具有直接电镀外部端子电极的层压陶瓷电子部件及其制造方法公开(公告)号：US08547683B2
公开(公告)日：2013-10-01
申请号：US12821305
申请日：2010-06-23
申请人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
发明人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。
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公开(公告)号：US08520362B2
公开(公告)日：2013-08-27
申请号：US13359519
申请日：2012-01-27
IPC分类号： H01G4/228
摘要： In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 μm or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.
摘要翻译： 在通过在组件主体中的多个内部电极的露出端上生长镀覆形成外部电极的方法中，抛光组件主体以增加内部电极的曝光。 为了防止外部电极固定强度的降低，在通过离子铣削抛光时，在形成于部件主体的脊部的R倒角部分的曲率半径减小到约0.01mm以下，内部电极的露出端凹入 从组件主体的具有大约1um或更小的凹槽长度的端表面。 形成为用作外部电极的电镀膜，从组件主体的端面延伸穿过R倒角部分，并且包括位于至少一个主表面和侧表面上的端边缘。
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公开(公告)号：US08484815B2
公开(公告)日：2013-07-16
申请号：US13295151
申请日：2011-11-14
IPC分类号： H01G7/00
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 μm on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.
摘要翻译： 一种层叠电子部件的制造方法，其包括具有层叠功能层的电子部件主体，配置在所述电子部件主体内部的一部分的内部导体，其一部分露出在所述电子部件主体的外表面的露出部，以及 设置在电子部件主体的外表面上以连接到内部导体并覆盖内部导体的暴露部分的外部端子电极包括以下步骤：形成具有金属颗粒的平均粒径的基板镀膜 通过直接电镀在电子部件主体的外表面上至少约1.0μm，以便在电子部件主体上形成外部端子电极时覆盖内部导体的露出部分。
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74.发明授权公开(公告)号：US08482899B2
公开(公告)日：2013-07-09
申请号：US13072932
申请日：2011-03-28
CPC分类号： H01G4/30 , H01G4/232 , Y10T29/435
摘要： A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.
摘要翻译： 层压体包括彼此层叠的陶瓷层。 内部导体嵌入在层压体中，并且包括在层压体的下表面和上表面处暴露在陶瓷层之间的暴露部分。 外部电极被直接电镀在下表面和上表面上以覆盖相应的暴露部分。 设置有暴露部分的下表面的区域被布置成从下表面的其它区域突出，并且设置暴露部分的上表面的区域布置成从上表面的其它区域突出 。
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75.发明授权公开(公告)号：US08456796B2
公开(公告)日：2013-06-04
申请号：US12546779
申请日：2009-08-25
申请人： Akihiro Motoki , Akihiro Yoshida , Makoto Ogawa
发明人： Akihiro Motoki , Akihiro Yoshida , Makoto Ogawa
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , C23C18/405 , C23C28/023 , C23C28/028 , C25D5/10 , C25D5/12 , C25D17/20 , H01G4/2325 , Y10T428/24917
摘要： A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.
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公开(公告)号：US20130095233A1
公开(公告)日：2013-04-18
申请号：US13439916
申请日：2012-04-05
IPC分类号： B05D5/12
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。
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公开(公告)号：US08400754B2
公开(公告)日：2013-03-19
申请号：US12631924
申请日：2009-12-07
CPC分类号： H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
摘要翻译： 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。
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公开(公告)号：US08308191B2
公开(公告)日：2012-11-13
申请号：US12926191
申请日：2010-11-01
申请人： Teruhiko Hiruta , Makoto Ogawa
发明人： Teruhiko Hiruta , Makoto Ogawa
IPC分类号： B60R21/26
CPC分类号： B60R21/239 , B60R21/203 , B60R21/2346 , B60R2021/23382 , B60R2021/2395
摘要： An airbag apparatus includes a gas generator that generates gas, and an airbag inflated and deployed by the gas supplied from the gas generator. The airbag restrains an occupant in a first state in which the occupant's chin is positioned on the airbag apparatus or the occupant in a second state in which the occupant's chin is positioned on a steering wheel. The airbag includes one main exhaust port, a vent cover provided to cover the one main exhaust port, and at least one sub exhaust port without a vent cover. The sub exhaust port exhausts the gas without using the main exhaust port in a state in which the vent cover blocks the main exhaust port due to a folded state of the airbag in an initial stage of an inflating and deploying operation performed to restrain the occupant in the first state or in the second state.
摘要翻译： 气囊装置包括产生气体的气体发生器，以及由气体发生器供给的气体充气展开的气囊。 所述安全气囊将所述乘客的下巴位于所述乘客的下巴位于所述乘客的方向盘上的第二状态下的所述第一状态下进行限制。 安全气囊包括一个主排气口，设置成覆盖一个主排气口的通气盖和至少一个没有排气盖的副排气口。 副排气口在不进行主排气口排气的状态下，在通气盖堵塞主排气口的状态下，由于气囊的折叠状态在进行充气和展开操作的初始阶段中以使乘员进入 第一个状态或第二个状态。
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公开(公告)号：US20120243143A1
公开(公告)日：2012-09-27
申请号：US13411752
申请日：2012-03-05
IPC分类号： H01G4/00
CPC分类号： H01G4/005
摘要： An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.
摘要翻译： 防止在安装期间和之后相对于电路板倾斜的电子部件包括优选地通过堆叠多个绝缘体层而构造的层叠体，并且包括设置有凹部的下表面。 下表面包括绝缘体层的一系列外边缘。 电容器电极由结合在层叠体中的内部导体限定，分别具有从下表面上的凹部中的绝缘体层之间露出的暴露部分。 优选通过电镀直接形成的外部电极设置在凹部中以覆盖暴露部分。
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公开(公告)号：US20120140374A1
公开(公告)日：2012-06-07
申请号：US13365280
申请日：2012-02-03
IPC分类号： H01G4/12 , H01F5/02 , H01C7/13 , H01L41/047
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
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