Abstract:
A switched capacitor circuit includes an amplifier, a charging unit, an offset unit, and an integrating unit. The charging unit is coupled between an input node and a first node, and is for accumulating charge corresponding to an input signal during a sampling mode. The offset unit is coupled between the first node and an input of the amplifier, and is for maintaining the first node to be a virtual ground during an integrating mode. The integrating unit is coupled between the first node and an output of the amplifier, and is for receiving charge from the charging unit during the integrating mode.
Abstract:
A ratio-independent switched capacitor amplifier includes a first sampling circuit configured to sample a first input voltage as a first sampling voltage and to double a level of the first sampling voltage during an interval in which the first input voltage is cut off; a second sampling circuit configured to sample a second input voltage as a second sampling voltage and to double a level of the second sampling voltage during an interval in which the second input voltage is cut off; and a differential amplifier circuit configured to output a difference between the first sampling voltage and the second sampling voltage.
Abstract:
An image sensor includes an analog-to-digital converter (ADC) and a decimation filter. The decimation filter includes a first digital data generator and a second digital data generator. The first digital data generator is configured to integrate sigma-delta modulated M-bit pixel data and output N-bit pixel data based on an integration result. The second digital data generator is configured to integrate the N-bit pixel data, generate P-bit pixel data based on an integration result, and output the P-bit pixel data as decimated data.
Abstract:
Provided is a pixel circuit in a CMOS image sensor, a structure thereof, and a method of operating the same. The pixel includes: a photodiode; a floating diffusion node connected to the photodiode through a first switch; a source follower responsive to a voltage of the floating diffusion node. The voltage of the floating diffusion node is applied to the source follower through capacitance coupling.
Abstract:
The present invention relates to an apparatus and method for protecting a semiconductor device, and more particularly to an n-type metal-oxide semiconductor (NMOS) transistor with a ladder structure, used for protecting a semiconductor device from electrostatic discharge. In the present invention, a plurality of drain branches are connected by resistors, and a contact point of the well and the source/well pattern is formed only alongside the drain branch of the ladder structure which is nearest an input/output terminal of the semiconductor device. Accordingly, the current is better dispersed to all of the drain branches, thereby preventing the voltage breakdown of the transistor due to heat caused by the localization of current in the drain branch farthest from the input/output terminal.
Abstract:
Disclosed is an electrostatic discharge (ESD) protecting circuit, capable of consuming a high voltage or overcurrent applied to a semiconductor circuit device and thereby protecting the circuit device from the instant ESD impact. The ESD protecting circuit according to this invention has only two wells and a highly doped region which brings an N-well into an electrical connection with the P-well. Accordingly, the present invention provides effects of reducing the area of the ESD protecting circuit and removing an instant ESD impact.
Abstract:
Integrated circuits having improved electrostatic discharge capability include MOS transistors having wide channel widths formed by patterning a plurality of MOS transistor cells side-by-side in a well region as a highly integrated ladder network. The drain regions of the MOS transistor cells are coupled to an input pad to be protected and the source regions of the MOS transistor cells are coupled to a reference signal line (e.g., GND, VSS). The gate electrodes of the MOS transistor cells are also coupled together and indirectly through the well region to the reference signal line. The gates electrodes are coupled to the well region so that at the onset of reverse P-N junction breakdown between one or more of the drain regions (e.g., N-type) and the well region (e.g., P-type), the potentials of the gate electrodes of the MOS transistor cells are increased. This increase in gate electrode potential causes the breakdown voltages of the other nonconducting drain regions to be lowered to initiate breakdown so that the electrostatic discharge current can be more uniformly shared by all of the MOS transistor cells.
Abstract:
A plurality of transistors are aligned to form a ladder structure between two well contacts in a semiconductor substrate, the ladder structure including a plurality of elongate gate contacts extending parallel to one another, a plurality of elongate source contacts extending parallel to one another, and a plurality of elongate drain contacts extending parallel to one another, wherein the source contacts and the drain contacts are alternately arranged between the gate contacts. In the ladder structure, a first distance is made greater than a second distance to prevent current localization at respective junctions between a first drain contact and adjacent gate contacts located on opposite sides of the first drain contact, the first drain contact being a one of the plurality of drain contacts which is spaced furthest away from both the two well contacts. The first distance is a distance between the first drain contact and each of the adjacent gate contacts located on opposite sides of the first drain contact, and the second distance is a distance between each of the remaining drain contacts and each of the gate contacts adjacent to the remaining drain contacts.