Abstract:
A phase shift full bridge converter with a reduced current stress includes: a switching unit that switches an input voltage; a transformer that includes a first capacitor serially connected to, and having a primary side and a secondary side; an auxiliary circuit unit that includes a first switch, a second switch, and a second capacitor, which are connected in parallel to the secondary side of the transformer; and a rectification unit that is connected to the auxiliary circuit unit, with an output inductor being removed.
Abstract:
A method of forming a dielectric film, includes: introducing a siloxane gas essentially constituted by Si, O, C, and H and a silazane gas essentially constituted by Si, N, H, and optionally C into a reaction chamber where a substrate is placed; depositing a siloxane-based film including Si—N bonds on the substrate by plasma reaction; and annealing the siloxane-based film on the substrate in an annealing chamber to remove Si—N bonds from the film.
Abstract:
A method of forming stress-tuned dielectric films having Si—N bonds on a semiconductor substrate by modified plasma enhanced atomic layer deposition (PEALD), includes: introducing a nitrogen-and hydrogen-containing reactive gas and an additive gas into a reaction space inside which a semiconductor substrate is placed; applying RF power to the reaction space using a high frequency RF power source and a low frequency RF power source; and introducing a hydrogen-containing silicon precursor in pulses into the reaction space wherein a plasma is excited, thereby forming a stress-tuned dielectric film having Si—N bonds on the substrate.
Abstract:
Example embodiments relate to a memory test system having a semiconductor memory device, a coupling circuit and a tester. The semiconductor memory device may include a plurality of first output nodes and a plurality of second output nodes. The first output nodes may be connected to respective first on-die termination circuits that may not be tested, and the second output nodes may be connected to second on-die termination circuits that may be tested. The semiconductor memory device may be configured to generate test signals of the second on-die termination circuits and to provide the test signals to the second output nodes. The coupling circuit may be configured to connect the first output nodes and the second output nodes to communication channels, respectively. The tester may be configured to test a logic state of the test signals of the communication channels.
Abstract:
A mobile terminal includes a housing comprising a light emitting portion disposed on at least a portion of the housing, a light emitting unit disposed inside the housing, a light transmission member configured to transmit light emitted from the light emitting unit, and a guiding structure formed on the light transmission member and configured to direct and emit the light toward the light emitting portion.
Abstract:
A method of forming a dielectric film, includes: introducing a siloxane gas essentially constituted by Si, O, C, and H and a silazane gas essentially constituted by Si, N, H, and optionally C into a reaction chamber where a substrate is placed; depositing a siloxane-based film including Si—N bonds on the substrate by plasma reaction; and annealing the siloxane-based film on the substrate in an annealing chamber to remove Si—N bonds from the film.
Abstract:
Provided are a method and structure for optical connection between an optical transmitter and an optical receiver. The method includes the steps of: forming on a substrate a light source device, an optical detection device, an optical transmission unit electrically connected with the light source device, and an optical detection unit electrically connected with the optical detection device; preparing a flexible optical transmission-connection medium to optically connect the light source device with the optical detection device; cutting the prepared optical transmission-connection medium and surface-finishing it; and connecting one end of the surface-finished optical transmission-connection medium with the light source device and the other end with the optical detection device. Fabrication of an optical package having a 3-dimensional structure is facilitated and fabrication time is reduced, thus improving productivity. In addition, since the optical transmission-connection medium is directly connected with the light source device and the optical detection device, a polishing operation or additional connection block is not required, thus facilitating mass production.
Abstract:
Provided are a two-dimensional planar photonic crystal superprism device and a method of manufacturing the same, in which a manufacturing process is simplified using a nanoimprint lithography technique, and thus price-reduction and mass production are facilitated. The two-dimensional planar photonic crystal superprism device includes: a single-mode input waveguide comprising a straight waveguide having a taper structure and a bending waveguide; a superprism formed on an output end side of the single-mode input waveguide and comprising a slab and a photonic crystal superprism; and a single-mode output waveguide comprising a straight waveguide having a taper structure and a bending waveguide, and formed adjacent to the photonic crystal superprism. Using the two-dimensional planar photonic crystal superprism device, it is possible to facilitate manufacturing of nano-photonic integrated circuits, photonic crystal integrated circuits and nano-photonic systems. In addition, a wavelength-selectable photonic crystal superprism device using high dispersion of photonic crystal, which is several hundred times the dispersion of conventional glass prism, can be manufactured using thermal/hot and ultraviolet nanoimprint lithography techniques corresponding to nano-manufacturing technology.
Abstract:
Semiconductor devices, a system including said semiconductor devices and methods thereof are provided. An example semiconductor device may receive data scheduled for transmission, scramble an order of bits within the received data, the scrambled order arranged in accordance with a given pseudo-random sequence. The received data may be balanced such that a difference between a first number of the bits within the received data equal to a first logic level and a second number of bits within the received data equal to a second logic level is below a threshold. The balanced and scrambled received data may then be transmitted. The example semiconductor device may perform the scrambling and balancing operations in any order. Likewise, on a receiving end, another semiconductor device may decode the original data by unscrambling and unbalancing the transmitted data. The unscrambling and unbalancing operations may be performed in an order based upon the order in which the transmitted data is scrambled and balanced.
Abstract:
A circuit including a voltage boost circuit coupled to a first node and a second node, and configured to apply a boosted first node voltage to the second node; and an inverter circuit coupled to the first node, the second node, and a third node, and configured to generate a signal on the third node in response to the signals on the first node and the second node.