Optical data recording medium and method of manufacturing the same
    72.
    发明授权
    Optical data recording medium and method of manufacturing the same 失效
    光学数据记录介质及其制造方法

    公开(公告)号:US5085910A

    公开(公告)日:1992-02-04

    申请号:US550016

    申请日:1990-07-09

    IPC分类号: G11B7/24 G11B7/26

    摘要: Disclosed is an optical data recording medium provided with a glass substrate and a recording layer carried by the glass substrate, wherein the glass substrate is composed of a glass plate having a mixed layer of metallic tin or a tin compound formed on at least one surface thereof, a content of the metallic tin or tin compound on the surface of the glass substrate being regulated to 1.3 wt % or less and the entire surface of the glass plate being subject to a chemically reinforcing treatment, and also disclosed is a method of manufacturing an optical data recording medium provided with a glass substrate and a recording layer carried by the glass substrate, which comprises the steps of making a glass plate by a float method using melted metallic tin for the glass substrate, cutting the glass plate to a desired configuration and size, polishing at least one surface of the glass plate which is in contact with the melted metallic tin when making the glass plate to regulate a content of tin in the polished surface to 1.3 wt % or less, and subjecting the polished glass plate to a chemically reinforcing treatment.

    摘要翻译: 公开了一种设置有由玻璃基板和由玻璃基板承载的记录层的光学数据记录介质,其中玻璃基板由在其至少一个表面上形成的金属锡或锡化合物的混合层的玻璃板 将玻璃基板表面上的金属锡或锡化合物的含量调节至1.3重量%以下,并且对玻璃板的整个表面进行化学强化处理,并且还公开了制造 设置有玻璃基板的光学数据记录介质和由玻璃基板承载的记录层,其包括以下步骤:使用熔融金属锡制造玻璃板,使用熔融的金属锡作为玻璃基板,将玻璃板切割成所需的形状, 在制造玻璃板以调节含量的情况下,研磨与熔融的金属锡接触的玻璃板的至少一个表面 n在1.3重量%以下,对抛光后的玻璃板进行化学强化处理。

    Page printer
    73.
    发明授权

    公开(公告)号:US4953103A

    公开(公告)日:1990-08-28

    申请号:US345397

    申请日:1989-04-28

    申请人: Masahiro Suzuki

    发明人: Masahiro Suzuki

    摘要: A page printer with an internal CPU, interrupt controller, and DMAC has a DMA stopping circuit in the DMAC, the function of which is to stop a DMA transfer in response to a DMA stop signal and restart it in response to a DMA restart signal. The DMA signal is generated by the interrupt controller when it receives certain interrupt requests, such as communication interrupt requests, enabling the CPU to service these requests promptly. The DMA restart signal is generated at the end of the interrupt service routine. This arrangement permits DMA transfers to be performed in burst mode, stopping only when urgent interrupt service is required. Burst-mode DMA improves the speed of operation of the printer.

    Gang socket and jig for manufacturing capacitor element that uses said gang socket
    77.
    发明授权
    Gang socket and jig for manufacturing capacitor element that uses said gang socket 有权
    用于制造电容器元件的插座和夹具,使用所述组合插座

    公开(公告)号:US09196428B2

    公开(公告)日:2015-11-24

    申请号:US13993371

    申请日:2011-10-13

    摘要: Provided is a gang socket with which capacitor elements can be manufactured without contaminating chemical conversion treatment liquids or semiconductor layer forming liquids even when the chemical conversion treatment liquids and semiconductor layer forming liquids are corrosive and with which heat treatment can be carried out without obstacles even when heat treatment is carried out during the manufacture of the capacitor elements. This gang socket (1) is provided with a plurality of conductive socket main units (2) provided with insertion openings (37) and an insulator part (5) forming a plurality of receiving parts (6) that can accommodate at least part of the socket main units (2) and provided with a plurality of small openings (7) connecting to the bottom surface of the receiving parts (6) on a bottom surface (5b). The insulator part (5) is constituted of a material having heat resistance and corrosion resistance. At least part of the socket main units (2) are accommodated and secured in the receiving parts (6) of the insulator part (5), and the insertion openings (37) and the small openings (7) are connected.

    摘要翻译: 即使当化学转化处理液体和半导体层形成液体具有腐蚀性并且即使在没有障碍物的情况下也可以进行热处理时,即使在没有障碍物的情况下也可以在不污染化学转化处理液体或半导体层形成液体的情况下制造电容元件, 在电容器元件的制造期间进行热处理。 该组合插座(1)设置有多个具有插入开口(37)的导电插座主单元(2)和形成多个容纳部件(6)的绝缘体部件(5),该容纳部件可容纳至少部分 插座主单元(2),并且在底面(5b)上设置有多个与接收部(6)的底面连接的小开口(7)。 绝缘体部件(5)由具有耐热性和耐腐蚀性的材料构成。 插座主单元(2)的至少一部分被容纳并固定在绝缘体部分(5)的接收部分(6)中,并且插入开口(37)和小开口(7)连接。

    Manufacturing method for electroluminescent element
    79.
    发明授权
    Manufacturing method for electroluminescent element 有权
    电致发光元件的制造方法

    公开(公告)号:US09082980B2

    公开(公告)日:2015-07-14

    申请号:US14381470

    申请日:2013-02-28

    IPC分类号: H01L21/20 H01L51/00 H01L51/56

    摘要: A method for manufacturing an electroluminescent element including: a first manufacturing step of layering on a substrate, in the following order, a first electroconductive layer, a dielectric layer in which plural contact holes are formed which pass therethrough in a direction orthogonal to the substrate, a second electroconductive layer which is electrically connected to the first electroconductive layer inside the contact holes and which fills the contact holes, a light-emitting layer, and a third electroconductive layer; a temperature distribution measurement step of applying a voltage to the first electroconductive layer and the third electroconductive layer, causing the light-emitting layer to emit light, and measuring the temperature distribution of the electroluminescent element to obtain temperature unevenness information for the electroluminescent element; and a second manufacturing step of adjusting, the basis of the temperature unevenness information, the density of the plural contact holes that pass through the dielectric layer.

    摘要翻译: 一种电致发光元件的制造方法,其特征在于,包括:第一制造工序,依次层叠第1导电层,在与基板正交的方向上形成有多个接触孔的电介质层, 第二导电层,其电连接到接触孔内部的第一导电层并填充接触孔,发光层和第三导电层; 温度分布测量步骤,向第一导电层和第三导电层施加电压,使发光层发光,测量电致发光元件的温度分布以获得电致发光元件的温度不均匀信息; 以及调整通过电介质层的多个接触孔的密度的温度不均匀性信息的基础的第二制造步骤。

    MANUFACTURING METHOD FOR ELECTROLUMINESCENT ELEMENT
    80.
    发明申请
    MANUFACTURING METHOD FOR ELECTROLUMINESCENT ELEMENT 有权
    电致发光元件的制造方法

    公开(公告)号:US20150132864A1

    公开(公告)日:2015-05-14

    申请号:US14381470

    申请日:2013-02-28

    IPC分类号: H01L51/00 H01L51/56

    摘要: A method for manufacturing an electroluminescent element including: a first manufacturing step of layering on a substrate, in the following order, a first electroconductive layer, a dielectric layer in which plural contact holes are formed which pass therethrough in a direction orthogonal to the substrate, a second electroconductive layer which is electrically connected to the first electroconductive layer inside the contact holes and which fills the contact holes, a light-emitting layer, and a third electroconductive layer; a temperature distribution measurement step of applying a voltage to the first electroconductive layer and the third electroconductive layer, causing the light-emitting layer to emit light, and measuring the temperature distribution of the electroluminescent element to obtain temperature unevenness information for the electroluminescent element; and a second manufacturing step of adjusting, on the basis of the temperature unevenness information, the density of the plural contact holes that pass through the dielectric layer.

    摘要翻译: 一种电致发光元件的制造方法,其特征在于,包括:第一制造工序,依次层叠第1导电层,在与基板正交的方向上形成有多个接触孔的电介质层, 第二导电层,其电连接到接触孔内部的第一导电层并填充接触孔,发光层和第三导电层; 温度分布测量步骤,向第一导电层和第三导电层施加电压,使发光层发光,测量电致发光元件的温度分布以获得电致发光元件的温度不均匀信息; 以及第二制造步骤,基于温度不均匀信息调整通过电介质层的多个接触孔的密度。