摘要:
A sputtering apparatus is provided with a magnetic assembly which is rotated and revolved, and the eccentric distance between the rotation axis and the revolution axis is varied. By this arrangement, erosion profile of a target is made uniform, whereby a uniform thin film is deposited on a substrate surface.
摘要:
A CVD mechanism includes a reactor, a substrate holder, a heating apparatus for heating the substrate holder, a reaction gas supply plate for supplying reaction gas into the reactor, and at least two cylinders disposed in a concentric form on the substrate-facing surface of the reaction gas supply plate so that reaction gas is supplied from an inward portion of each cylinder in the reaction gas supply plate. A power supply mechanism for supplying power to the reaction gas supply plate and the substrate holder, and ring magnets disposed in the upper and lower portions of the reactor are provided so that magnetic lines of force passing through a plasma space are generated by the facing magnetic pole parts of the respective magnets.
摘要:
A CVD apparatus is equipped with a reactor, a substrate holder, an evacuation section, a reactive gas supply mechanism, a heating mechanism for heating the substrate holder, a differential pressure chuck clamping section for clamping the substrate, and a purge gas supply mechanism for supplying purge gas. The substrate holder is configured to have a circular purge gas blowing channel on the top surface thereof, in which a diameter of an outside wall-surface is less than a diameter of the substrate, and a plurality of purge gas passages in an inside thereof, each of which supplies the purge gas into the purge gas blowing channel. The purge gas passing the purge gas blowing channel is blown off through a clearance between the outer periphery of the substrate and the substrate holder. The purge gas passage includes a radius-directed part directed in a radius direction of the substrate holder and has a purge gas outlet provided on the outside wall-surface of the purge gas blowing channel. The flow of the purge gas in a circumferential direction within the purge gas blowing channel is turbulent and dispersed, and therefore the purge gas blow-off pressure in the whole periphery of the substrate is uniform.
摘要:
In a CVD processing system for depositing a blanket tungsten film, a distinct shadow is formed without causing any micro-peeling when the substrate fixture is separated from the substrate so as to prevent any blanket tungsten from being deposited on SiO.sub.2, thus reducing the occurrence of fine dust particles. A CVD processing system for depositing a blanket tungsten film, includes a susceptor (4); a ring chuck (9) for affixing the peripheral portion of a substrate (3) on the susceptor; reactive gas supply mechanisms (17, 18 and 19) for supplying reactive gas; and an exhaust mechanism (2) for exhausting unreacted gas and the like, wherein: the ring chuck has at least three point contact members (10) in contact with the peripheral portion of the substrate; the point contact members are provided at positions outside the inner periphery of the ring chuck; a gap (11) is formed at the point contact members between the ring chuck and the substrate; and purge gas supply mechanisms (20 and 21) are provided to blow off purge gas through the gap in order to prevent reactive gas from entering the gap (11). A ratio of the size of the gap to the flow rate of purge gas is set to such an optimum value as to satisfy a condition in which the position of the peripheral portion of the thin film coincides with the position of the inner periphery of the ring chuck.
摘要:
A magnetron sputtering apparatus is provided that is equipped with a magnetron cathode assembly in which the target can be sufficiently sputtered in the central portion to insure that it will not be a cause of particulate contamination and which permits the use of a target of larger diameter without compromising the ability to assure a satisfactorily high film deposition rate. The magnetron cathode assembly comprises basically a flat circular target, a magnetic field applying means provided near the back side of the target, and a rotary driving means for rotating the position of a magnetic field on the surface of the target, and the magnetic field application means includes at least one arrangement in which different spaced magnetic poles are provided to face each other in such a manner that they surround the central portion of the target.
摘要:
An ultrahigh silicon, grain-oriented electrical steel sheet having a magnetic flux density, B.sub.8, of 1.57 or more and a degree of azimuth orientation, R (B.sub.8 /B.sub.s) of 0.87 or more is provided by cold-rolling an ultrahigh silicon steel sheet comprising by weight 0.005 to 0.023% of C, 5 to 7.1% of Si, 0.014% or less of S, 0.013 to 0.055% of acid soluble Al and 0.0095% or less of total N with the balance consisting of Fe and unavoidable impurities at a temperature in the range of from 120.degree. to 380.degree. C. optionally after annealing at a temperature in the range of from 800.degree. to 1100.degree. C., subjecting the cold-rolled sheet to decarburization annealing, coating the annealed sheet with an annealing separator, coiling the coated sheet to prepare a strip coil and subjecting the strip coil to high-temperature finish annealing for secondary recrystallization, the steel sheet being subjected to nitriding during a period from the decarburization annealing to the initiation of secondary recrystallization in the step of high-temperature finish annealing, to increase the nitrogen content.
摘要:
A vacuum processing apparatus capable of quickly replacing a substrate without opening the two gate valves simultaneously by using two waiting stages and a single transferring robot. The transferring robot is designed to transfer a substrate in a straight-line direction, and those two holding stages are set up in front of and behind the center of rotation of the baseplate of the transferring robot. An integrated module multi-chamber vacuum processing system is provided including a plurality of processing chambers capable of being vacuum evacuated, a substrate transferring chamber capable of being vacuum evacuated, at least one load-lock chamber capable of being vacuum evacuated, a substrate transferring robot assembly for transferring a substrate between the at least one load-lock chamber and the processing chamber disposed within the substrate transferring chamber. The substrate transferring robot assembly comprises a baseplate rotatable with respect to the substrate transferring chamber, two waiting stages integrated on the baseplate to store the substrate temporarily, and a substrate transferring robot mounted on the baseplate for transferring the substrate.
摘要:
A silicon steel slab comprising 0.05 to 0.8% by weight of Mn and up to 0.014% by weight of S+0.405Se is heated at a temperature lower than 1280.degree. C. and hot-rolled under such conditions that the hot rolling-finish temperature is 700.degree. to 1150.degree. C., the cumulative reduction ratio at the final three passes is at least 40%, and the reduction ratio at the final pass is at least 20%, or this silicon steel slab is hot-rolled at a hot rolling-finish temperature of 750.degree. to 1150.degree. C. while adopting the above-mentioned reduction ratio according to need, is maintained at a temperature not lower than 700.degree. C. for at least 1 second, and wound at a winding temperature lower than 700.degree. C. The hot-rolled sheet is subjected to the hot-rolled sheet annealing, finally cold-rolled at a reduction ratio of at least 80%, subjected to the decarburization annealing, and then subjected to the final finish annealing. According to this process, a grain-oriented electrical steel sheet having superior magnetic properties is obtained.
摘要:
There is described an electrical discharge machining medium which is a mixture of water and (a) a water-soluble compound of formula: ##STR1## wherein R.sub.1 is an alkyl group containing 1 to 6 carbon atoms; R.sub.2 is a hydrogen atom, a methyl group or an ethyl group; n is an integer of 4 to 100, inclusive; or (b) a compound which contains at least one oxygen-containing hydrocarbon chain of the general formula R--O--A--H).sub.m wherein A is a recurring oxyethylene group or a mixture of oxyethylene and one or both of oxypropylene and oxybutylene groups which do not interfere with the solubility of the compound; R is a hydrocarbon chain containing 3 to 8 carbon atoms; O is an oxygen atom forming an ether bond with a carbon atom constituting R; and m is an integer of 3 to 6, inclusive, which compound contains at least two groups of the formula --CH.sub.2 CH.sub.2 O--, has an average molecular weight not exceeding 5000, and is and remains liquid during machining, or a mixture of said compounds (a) and (b). This medium contributes to a decreased electrode consumption rate and an increased machining speed.