公开(公告)号：US10535618B2

公开(公告)日：2020-01-14

申请号：US16045868

申请日：2018-07-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Silvio Dragone ,  Michael A. Gaynes ,  Kenneth P. Rodbell ,  William Santiago-Fernandez

IPC: H01L23/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H01L23/053 ,  H01L23/08 ,  H01L21/48 ,  G06F21/87

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).

公开(公告)号：US20190293690A1

公开(公告)日：2019-09-26

申请号：US16423023

申请日：2019-05-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew W. Copel ,  Michael S. Gordon ,  Kenneth P. Rodbell

IPC: G01R19/00

Abstract: An apparatus and method for measuring flux, current, or integrated charge of a beam are provided. The apparatus and method include a cup on which the beam is incident. The cup includes an inner cylinder, a coaxial cylinder, and an aperture. The coaxial cylinder surrounds the inner cylinder and is electrically insulated therefrom. An offset current source is in electrical communication with the inner cylinder. An electrometer, a charge integrator, or a counter may be electrically connected to the cup and the offset current source. When the beam is incident on the cup and aligned with the aperture, the electrometer can measure the beam current and the charge integrator can measure the integrated charge of the beam.

公开(公告)号：US10416199B2

公开(公告)日：2019-09-17

申请号：US15408075

申请日：2017-01-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew W. Copel ,  Michael S. Gordon ,  Kenneth P. Rodbell

IPC: G01R19/00 ,  G01R29/24

Abstract: An apparatus and method for measuring flux, current, or integrated charge of a beam are provided. The apparatus and method include a cup on which the beam is incident. The cup includes an inner cylinder, a coaxial cylinder, and an aperture. The coaxial cylinder surrounds the inner cylinder and is electrically insulated therefrom. An offset current source is in electrical communication with the inner cylinder. An electrometer, a charge integrator, or a counter may be electrically connected to the cup and the offset current source. When the beam is incident on the cup and aligned with the aperture, the electrometer can measure the beam current and the charge integrator can measure the integrated charge of the beam.

公开(公告)号：US10380284B2

公开(公告)日：2019-08-13

申请号：US15626582

申请日：2017-06-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Li-Wen Hung ,  Wanki Kim ,  John U. Knickerbocker ,  Kenneth P. Rodbell ,  Robert L. Wisnieff

IPC: G06F17/50 ,  G06F15/78 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/11 ,  H01L25/07 ,  H01L21/56 ,  H01L25/18 ,  G06F15/80

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

公开(公告)号：US10214809B2

公开(公告)日：2019-02-26

申请号：US15926663

申请日：2018-03-20

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, Jr. ,  Gregory M. Fritz ,  Kenneth P. Rodbell

IPC: C23C16/34 ,  C23C14/22 ,  C23C16/44

Abstract: A reactive material stack with tunable ignition temperatures is provided by inserting a barrier layer between layers of reactive materials. The barrier layer prevents the interdiffusion of the reactive materials, thus a reaction between reactive materials only occurs at an elevated ignition temperature when a certain energy threshold is reached.

公开(公告)号：US20190011572A1

公开(公告)日：2019-01-10

申请号：US15643771

申请日：2017-07-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael S. Gordon ,  John G. Massey ,  Kenneth P. Rodbell

IPC: G01T1/02 ,  G21K1/02

Abstract: A radiation exposure system having a beam source is provided. The system further includes a variable thickness degrader, positioned between the beam source and an object to be exposed, for providing varying degrees of degradation to a radiation beam emitted from the beam source onto the object. The system also includes a set of detectors, positioned between the variable thickness degrader and the object, for receiving and measuring only a portion of the radiation beam remaining after the degradation of the radiation beam by the variable thickness degrader.

公开(公告)号：US10043765B2

公开(公告)日：2018-08-07

申请号：US15722219

申请日：2017-10-02

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, Jr. ,  Kenneth P. Rodbell

IPC: H01L23/00 ,  H01L27/24 ,  H01L21/768

Abstract: An integrated circuit structure and formation thereof. The integrated circuit structure includes a substrate and a front-end-of-the-line (FEOL) portion. The FEOL portion rests on top of and in contact with the substrate. The integrated circuit structure includes a memory level portion. The memory level portion rests on top of and in contact with the FEOL portion. The integrated circuit structure includes a back-end-of-the-line (BEOL) portion. The BEOL portion rests on top of and in contact with the memory level portion. The integrated circuit structure includes a multiple layer that includes one or more pairs of reactive materials. The multiple layer is one or more of: i) on top of the BEOL portion; ii) within the BEOL portion; iii) within the memory level portion; iv) within the FEOL portion; v) embedded in the substrate; and vi) on bottom of a thinned substrate.

公开(公告)号：US20180096954A1

公开(公告)日：2018-04-05

申请号：US15222056

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, Jr. ,  Kenneth P. Rodbell

IPC: H01L23/00 ,  C06B45/10 ,  H01L23/58 ,  H05K1/18

CPC classification number: H01L23/576 ,  C06B43/00 ,  C06B45/10 ,  C06B45/14 ,  H01L23/573 ,  H01L23/585 ,  H01L27/2472 ,  H01L2924/0002 ,  H05K1/185

Abstract: A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.

公开(公告)号：US09913370B2

公开(公告)日：2018-03-06

申请号：US15154077

申请日：2016-05-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Silvio Dragone ,  Michael J. Fisher ,  Michael A. Gaynes ,  David C. Long ,  Kenneth P. Rodbell ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G01L1/24 ,  H05K1/02 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K1/0275 ,  G06F21/87 ,  H05K1/181 ,  H05K1/185 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10371

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 μm with the intrusion event.

公开(公告)号：US20180061782A1

公开(公告)日：2018-03-01

申请号：US15800643

申请日：2017-11-01

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, JR. ,  Gregory M. Fritz ,  Conal E. Murray ,  Kenneth P. Rodbell

IPC: H01L23/00 ,  H01L25/16 ,  H01L23/06 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/04 ,  H01L23/525 ,  H01L23/34

CPC classification number: H01L23/576 ,  H01L23/04 ,  H01L23/06 ,  H01L23/345 ,  H01L23/525 ,  H01L23/573 ,  H01L25/16 ,  H01L31/02019 ,  H01L31/02021 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present invention provide integrated circuits and methods for activating reactions in integrated circuits. In one embodiment, an integrated circuit is provided having reactive material capable of being activated by electrical discharge, without requiring a battery or similar external power source, to produce an exothermic reaction that erases and/or destroys one or more semiconductor devices on the integrated circuit.