公开(公告)号：US20200154576A1

公开(公告)日：2020-05-14

申请号：US16746920

申请日：2020-01-19

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes

IPC: H05K3/30 ,  H05K1/02 ,  B29C45/14 ,  H01L23/42 ,  H01L21/56 ,  H01L23/367 ,  B29C45/37 ,  H05K3/28 ,  H05K1/18

Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

公开(公告)号：US10548228B2

公开(公告)日：2020-01-28

申请号：US15060137

申请日：2016-03-03

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes

IPC: H05K3/30 ,  H05K1/18

Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

公开(公告)号：US10338024B2

公开(公告)日：2019-07-02

申请号：US15644759

申请日：2017-07-08

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  Edward J. Yarmchuk

IPC: G01N27/22 ,  H01L23/34 ,  H01L23/373 ,  H01L23/42 ,  H05K3/30

Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.

公开(公告)号：US20170307558A1

公开(公告)日：2017-10-26

申请号：US15644759

申请日：2017-07-08

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  Edward J. Yarmchuk

IPC: G01N27/22 ,  H01L23/42 ,  H01L23/34 ,  H05K3/30 ,  H01L23/373

CPC classification number: G01N27/228 ,  H01L23/34 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  H05K3/30 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.

公开(公告)号：US09583410B2

公开(公告)日：2017-02-28

申请号：US14221477

申请日：2014-03-21

Applicant: International Business Machines Corporation

Inventor： Daniel C. Edelstein ,  Michael A. Gaynes ,  Thomas M. Shaw ,  Bucknell C. Webb ,  Roy R. Yu

IPC: H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2224/11

Abstract: A volumetric integrated circuit manufacturing method is provided. The method includes assembling a slab element of elongate chips, exposing a wiring layer between adjacent elongate chips of the slab element, metallizing a surface of the slab element at and around the exposed wiring layer to form a metallized surface electrically coupled to the wiring layer and passivating the metallized surface to hermetically seal the metallized surface.

Abstract translation: 提供了体积集成电路制造方法。 该方法包括组装细长芯片的平板元件，暴露板坯元件的相邻细长芯片之间的布线层，将暴露的布线层周围和周围的平板元件的表面金属化以形成电耦合到布线层的金属化表面，以及 钝化金属化表面以气密地密封金属化表面。

公开(公告)号：US20150287960A1

公开(公告)日：2015-10-08

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01M2/02 ,  A61B5/145 ,  A61F9/00 ,  G02C7/08

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A system comprising a first dielectric element and a second dielectric element each having a first surface, wherein the first surface of the first dielectric element and the first surface of the second dielectric element are joined. The system further comprises one or more enclosed voids within the joined first and second dielectric elements. The system further comprises a flexible battery in a first enclosed void of the one or more enclosed voids, the flexible battery having a thickness of less than about 150 microns.

Abstract translation: 一种包括第一介电元件和第二介电元件的系统，每个第一介质元件和第二介质元件均具有第一表面，其中第一介电元件的第一表面和第二介电元件的第一表面被接合。 该系统还包括在所接合的第一和第二介电元件内的一个或多个封闭的空隙。 该系统还包括在一个或多个封闭空隙的第一封闭空间中的柔性电池，柔性电池具有小于约150微米的厚度。

公开(公告)号：US09153460B2

公开(公告)日：2015-10-06

申请号：US14011218

申请日：2013-08-27

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC: H01L23/00 ,  H01L21/50 ,  H01L23/433 ,  H01L23/31

CPC classification number: H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

Abstract: An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

Abstract translation: 提供了一种用于芯片封装设备的散热器连接模块的组装过程，包括将半导体芯片附接到基板以形成模块子组件，将负载框架和垫片放置在固定装置中，将粘合剂分配到负载框架并且可负载地将 模块组件芯片正面朝下。

公开(公告)号：US20140016283A1

公开(公告)日：2014-01-16

申请号：US14042752

申请日：2013-10-01

Applicant: International Business Machines Corporation

Inventor： Martin Beaumier ,  Alexandre Blander ,  Pascale Gagnon ,  Michael A. Gaynes ,  Eric Giguere ,  Eric Salvas ,  Luc Tousignant

IPC: H05K9/00

CPC classification number: H05K9/0009 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16251 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Abstract translation: 用于在微电子部件级降低EMI的装置包括具有集成在其中的接地导体的基板。 诸如集成电路的微电子部件安装到基板。 导电盖安装到基板上，从而与基板形成物理界面。 导电盖基本覆盖微电子部件。 提供导电链路以在物理接口处在导电盖和接地导体之间产生电连接。

公开(公告)号：US11140786B2

公开(公告)日：2021-10-05

申请号：US16746920

申请日：2020-01-19

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes

IPC: H05K3/30 ,  H05K1/18 ,  H05K3/28 ,  B29C45/37 ,  H01L23/367 ,  H01L21/56 ,  H01L23/42 ,  B29C45/14 ,  H05K1/02 ,  H01L23/373 ,  H01L23/31 ,  H01L23/467 ,  H01L23/14 ,  H01L23/473

Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

公开(公告)号：US10908110B2

公开(公告)日：2021-02-02

申请号：US16458431

申请日：2019-07-01

Applicant: International Business Machines Corporation

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  Edward J. Yarmchuk

IPC: G01N27/22 ,  H01L23/34 ,  H01L23/373 ,  H01L23/42 ,  H05K3/30

Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.