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100 条记录 (耗时 0.022 秒)

    High Resolution Organic Light-Emitting Diode Devices, Displays, and Related Method
    71.
    发明申请
    High Resolution Organic Light-Emitting Diode Devices, Displays, and Related Method 有权
    高分辨率有机发光二极管器件，显示器及相关方法

    公开(公告)号：US20140197396A1

    公开(公告)日：2014-07-17

    申请号：US14156188

    申请日：2014-01-15

    申请人： Kateeva, Inc.

    发明人： Conor F. Madigan

    IPC分类号： H01L51/00 ,  H01L27/32

    CPC分类号： H01L27/3246 ,  H01L27/3216 ,  H01L27/3218 ,  H01L27/3276 ,  H01L51/0005 ,  H01L51/5218 ,  H01L51/5234

    摘要： In accordance with an exemplary embodiment of the present disclosure, a method of manufacturing an organic light-emissive display can be provided. A plurality of electrodes can be provided on a substrate. A first hole conducting layer can be deposited via inkjet printing over the plurality of electrodes on the substrate. A liquid affinity property of selected surface portions of the first hole conducting layer can be altered to define emissive layer confinement regions. Each emissive layer confinement region can have a portion that respectively corresponds to each of the plurality of electrodes provided on the substrate. An organic light-emissive layer can be deposited via inkjet printing within each emissive layer confinement region.

    摘要翻译： 根据本公开的示例性实施例，可以提供制造有机发光显示器的方法。 可以在基板上设置多个电极。 可以通过喷墨印刷在衬底上的多个电极上沉积第一孔导电层。 可以改变第一空穴传导层的选定表面部分的液体亲和性，以限定发光层限制区域。 每个发射层约束区域可以具有分别对应于设置在基板上的多个电极中的每一个的部分。 有机发光层可以通过喷墨印刷沉积在每个发射层约束区域内。

    METHOD AND APPARATUS FOR LOAD-LOCKED PRINTING
    76.
    发明申请
    METHOD AND APPARATUS FOR LOAD-LOCKED PRINTING 有权

    公开(公告)号：US20220024226A1

    公开(公告)日：2022-01-27

    申请号：US17450713

    申请日：2021-10-13

    申请人： Kateeva, Inc.

    发明人： Sass Somekh ,  Eliyahu Vronsky ,  Conor F. Madigan

    IPC分类号： B41J11/00

    摘要： The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

    Techniques for manufacturing thin films with improved homogeneity and print speed
    77.
    发明授权
    Techniques for manufacturing thin films with improved homogeneity and print speed 有权

    公开(公告)号：US11203207B2

    公开(公告)日：2021-12-21

    申请号：US15368290

    申请日：2016-12-02

    申请人： Kateeva, Inc.

    发明人： Conor F. Madigan ,  Christopher R. Hauf

    IPC分类号： B01J3/00 ,  B41J3/407 ,  H01L51/00 ,  B41J2/21 ,  H01L31/048 ,  H01L51/52 ,  H01L51/56 ,  H01L51/50

    摘要： Improved manufacturing using a printer that deposits a liquid to fabricate a layer having specified thickness includes automated adjustment or print parameters based on ink or substrate characteristics which have been specifically measured or estimated. In one embodiment, ink spreading characteristics are used to select droplet size used to produce a particular layer, and/or to select a specific baseline volume/area or droplet density that is then scaled and/or adjusted to provide for layer homogeneity. In a second embodiment, expected per-droplet particulars are used to interleave droplets in order to carefully control melding of deposited droplets, and so assist with layer homogeneity. The liquid layer is then cured or baked to provide for a permanent structure.

    TECHNIQUES FOR THERMAL TREATMENT OF ELECTRONIC DEVICES
    79.
    发明申请
    TECHNIQUES FOR THERMAL TREATMENT OF ELECTRONIC DEVICES 有权

    公开(公告)号：US20210358783A1

    公开(公告)日：2021-11-18

    申请号：US17443450

    申请日：2021-07-26

    申请人： Kateeva, Inc.

    发明人： Conor F. Madigan ,  Eliyahu Vronsky ,  Alexander Sou-Kang Ko ,  Justin Mauck

    IPC分类号： H01L21/67 ,  H01L51/00 ,  H01L51/56 ,  H01L21/673

    摘要： Apparatus and techniques are described herein for use in manufacturing electronic devices. such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

    Techniques for thermal treatment of electronic devices
    80.
    发明授权
    Techniques for thermal treatment of electronic devices 有权

    公开(公告)号：US11107712B2

    公开(公告)日：2021-08-31

    申请号：US16421834

    申请日：2019-07-03

    申请人： Kateeva, Inc.

    发明人： Conor F. Madigan ,  Eliyahu Vronsky ,  Alexander Sou-Kang Ko ,  Justin Mauck

    IPC分类号： H01L21/67 ,  H01L51/00 ,  H01L51/56 ,  H01L21/673 ,  B05D3/02

    摘要： Apparatus and techniques are described herein for use in manufacturing electronic devices. Such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.