Substrate treatment device
    71.
    发明授权
    Substrate treatment device 失效
    底物处理装置

    公开(公告)号:US06244282B1

    公开(公告)日:2001-06-12

    申请号:US09308105

    申请日:1999-05-04

    申请人: Martin Weber

    发明人: Martin Weber

    IPC分类号: B08B304

    摘要: A device for the treatment of substrates has a fluid container filled with a treatment fluid and at least one substrate receiving device. A lifting device is provided for lifting and lowering the at least one substrate receiving device out of and into the treatment fluid. The lifting device is arranged laterally at the container and has parts that are positioned above the container and the treatment fluid. A vapor suction device with a suction channel is provided for exhaustion of vapors in an area in which parts of the at least one lifting device are located above the treatment fluid. In the area above the treatment fluid, a plate is provided having an opening to which the suction channel is connected.

    摘要翻译: 用于处理基板的装置具有填充有处理流体的流体容器和至少一个基板接收装置。 提供提升装置用于将至少一个基板接收装置提升和降低出处理流体并进入处理流体。 提升装置横向设置在容器处并且具有位于容器和处理流体上方的部件。 提供具有抽吸通道的蒸汽抽吸装置,用于在至少一个提升装置的部分位于处理流体上方的区域中排出蒸气。 在处理流体上方的区域中设置有一个开口,吸入通道连接到该开口上。

    Thermoplastic molding compositions
    76.
    发明授权
    Thermoplastic molding compositions 失效
    热塑性成型组合物

    公开(公告)号:US6051661A

    公开(公告)日:2000-04-18

    申请号:US12028

    申请日:1998-01-22

    摘要: Thermoplastic molding compositions modified with carboxyl groups and comprising:A) at least one polyarylene ether andB) if desired, at least one filler or reinforcing material, wherein the molding composition also includesC) at least one modified polyarylene ether which contains carboxyl groups and has recurring structural elements of the formulae I and II ##STR1## where Ar, Ar.sup.1, Ar.sup.2, Ar.sup.3, T, Z, Y, t, q, x and n are as variously defined, andR.sup.1 is H, C.sub.1 -C.sub.6 -alkyl or --(CH.sub.2).sub.n --COOH; and where the molar ratio of units of the formula I to units of the formula II is in the range from 0.05:99.95 to 99.95:0.05;the use of these molding compositions for producing films, fibers and shaped articles, and the objects produced using the molding compositions, are described.

    摘要翻译: 用羧基改性的热塑性模塑组合物,其包含:A)至少一种聚亚芳基醚和B)如果需要,至少一种填料或增强材料,其中所述模塑组合物还包括C)至少一种含有羧基的改性聚亚芳基醚, 具有式I和II的重复结构元素,其中Ar,Ar1,Ar2,Ar3,T,Z,Y,t,q,x和n如各种定义,并且R 1是H,C 1 -C 6烷基或 - ( CH2)n-COOH; 并且其中式I的单元与式II的单元的摩尔比在0.05:99.95至99.95:0.05的范围内; 描述了使用这些用于制造膜,纤维和成形制品的模制组合物以及使用模塑组合物制造的物体。

    Polyamide/polyolefin blends
    77.
    发明授权
    Polyamide/polyolefin blends 失效
    聚酰胺/聚烯烃共混物

    公开(公告)号:US5883186A

    公开(公告)日:1999-03-16

    申请号:US880540

    申请日:1997-06-23

    摘要: Thermoplastic molding materials containA) from 4 to 95% by weight of a semicrystalline, partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, andB) from 4 to 95% by weight of a polyolefin homo- or copolymer or a mixture thereof,C) from 1 to 20% by weight of a compatibilizer,D) from 0 to 20% by weight of an elastomeric polymer,E) from 0 to 50% by weight of a fibrous or particulate filler andF) from 0 to 30% by weight of conventional additives and processing assistants,the percentages by weight of components A to F together giving 100%.

    摘要翻译: 热塑性成型材料包含A)4至95重量%的半结晶部分芳族共聚酰胺,其由a1-30-44摩尔%的衍生自对苯二甲酸的单元组成,a2)6至20摩尔%的单元, 衍生自间苯二甲酸,a3)43至49.5摩尔%的衍生自六亚甲基二胺的单元和a4)0.5至7摩尔%的衍生自6至30个碳原子的脂族环状二胺的单元,摩尔百分数 组分a1)至a4)一起提供100%,和B)4至95重量%的聚烯烃均聚物或共聚物或其混合物,C)1至20重量%的增容剂,D)0 至20重量%的弹性体聚合物,E)0至50重量%的纤维或颗粒填料和F)0至30重量%的常规添加剂和加工助剂,组分A至 F一起给100%。

    Thermoplastic molding materials based on partly aromatic poly-amides and
polyetherimides
    79.
    发明授权
    Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides 失效
    基于部分芳族聚酰胺和聚醚酰亚胺的热塑性成型材料

    公开(公告)号:US5780576A

    公开(公告)日:1998-07-14

    申请号:US631096

    申请日:1996-04-12

    摘要: Thermoplastic molding materials contain A) from 1 to 99% by weight of a partly aromatic copolyamide composed of a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid, a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid, a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, B) from 1 to 99% by weight of a polyetherimide, C) from 0 to 30% by weight of a polymeric component having OH groups, D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, E) from 0 to 40% by weight of rubber impact modifiers and F) from 0 to 40% by weight of conventional additives and processing assistants.

    摘要翻译: 热塑性成型材料包含A)1至99重量%的部分芳族共聚酰胺,其由a1- 30-44摩尔%的衍生自对苯二甲酸的单元组成,a2)6至25摩尔%衍生的单元 来自间苯二甲酸,a3)43〜49.5摩尔%的衍生自六亚甲基二胺的单元和a4)0.5〜7摩尔%的衍生自6〜30个碳原子的脂肪族环状二胺的单元,成分a1 )与a4)一起提供100%的B)1至99重量%的聚醚酰亚胺,C)0至30重量%的具有OH基团的聚合物组分,D)0至60重量%的纤维 或颗粒填料或其混合物,E)0至40重量%的橡胶抗冲改性剂和F)0至40重量%的常规添加剂和加工助剂。