摘要:
A novel fine carbon fiber is produced by vapor growth, in which a graphite-net plane consisting of carbon atoms alone forms a temple-bell-shaped structural unit comprising closed head-top part and body-part with open lower-end, where an angle θ formed by a generatrix of the body-part and a fiber axis is less than 15°, 2 to 30 of the temple-bell-shaped structural units are stacked sharing a central axis to form an aggregate, and the aggregates are connected in head-to-tail style with a distance, thereby forming a fiber. Furthermore, a fine short carbon fibers with excellent dispersibility can be obtained by shortening the fine carbon fiber.
摘要:
A method of manufacturing an electronic component, which includes arranging a plurality of first electrode pads on a first substrate, and a plurality of second electrode pads on a second substrate, so that the first and second electrode pads correspond to each other. The method further includes forming a plurality of solder bumps on the second electrode pads and putting the first substrate over the second substrate. The first and second substrates are shifted in parallel to each other, in a horizontal direction, while the solder bumps are melting, so that the solder bumps are stretched in a slant direction to cause the solder bumps to be solidified into hourglass-shapes.
摘要:
There is disclosed a conductive resin composition, comprising: (a) a resin component, and (b) a fine carbon fiber dispersed in the resin component, wherein a graphite-net plane consisting solely of carbon atoms forms a temple-bell-shaped structural unit comprising closed head-top part and body-part with open lower-end, 2 to 30 of the temple-bell-shaped structural units are stacked sharing a common central axis to form an aggregate, and the aggregates are connected in head-to-tail style with a distance to form the fiber. The resin composition has high conductivity while maintaining the original physical properties of the resin.
摘要:
A low on-resistance silicon carbide semiconductor device is provided to include an ohmic electrode of low contact resistance and high adhesion strength formed on a lower surface of silicon carbide. Specifically, the silicon carbide semiconductor device includes at least an insulating film, formed on an upper surface of a silicon carbide substrate, and includes at least an ohmic electrode, formed of an alloy comprising nickel and titanium, or formed of a silicide comprising nickel and titanium, and which is formed on the lower surface of the silicon carbide substrate.
摘要:
A first apparatus includes a sending unit which attaches a sequence number which is numbered for each priority of QoS set in a first packet, the sequence number is numbered for each priority of QoS set in the first packet, and sends the first packet with the sequence number. A second apparatus includes a storage unit which stores, for each priority, a history of sequence numbers attached to packets received, a determining unit which receives the first packet from the first apparatus, identifies the sequence number of the first packet, and determines whether the first packet has been previously received by comparing the identified sequence number with the history of sequence numbers according to the priority of QoS set in the first packet stored in the storage unit, and a unit which discards, when the determining unit determines the first packet has been previously received, the first packet.
摘要:
There is provided a polishing tool which enables a polishing surface thereof to be in surface contact with a to-be-polished surface over a wide area of the polishing surface when polishing a corner portion, and which can reduce an impact of a polishing member caused when the polishing member hits against a member around the polishing member. A generally triangular polishing member having apex angles of 60 degrees is connected, through the intermediary of an oscillation transmitting member made of a plate-like spring member, to an oscillating shaft oscillated by a motor. The oscillation transmitting member has a triangular base having at the center thereof a fixing hole by which the triangular base is fitted and fixed to the oscillating shaft, and triangular polishing member holding portions each extending from each side of the triangular base. The polishing member has three polishing pieces each composed of a pad held by the polishing member holding portion and a polishing sheet laminated to the pad. The edge of the polishing piece extends outwardly beyond the edge of the polishing member holding portion.
摘要:
A semiconductor device formed on a silicon carbide semiconductor substrate comprises an epitaxial layer formed on a surface sloping (or inclining) by 0 to less than 1 degree from a (000-1) face of the silicon carbide semiconductor substrate, wherein at least one of a P type semiconductor area or an N type semiconductor area is selectively formed in the epitaxial layer by ion implantation, a metal electrode is formed so as to contact a surface layer of the P type semiconductor area or the N type semiconductor area, a rectification function is shown between the metal electrode and the P type semiconductor area or the N type semiconductor area, and the semiconductor device is formed on the silicon carbide semiconductor substrate of a Schottky barrier diode or a PN type diode.
摘要:
Disclosed are a fertilizer containing a sparingly water-soluble phosphatic fertilizer and an urea/aliphatic aldehyde condensation product. The process for controlling inorganizing speed of urea/aliphatic aldehyde condensation product comprises adding to the urea/aliphatic aldehyde condensation product a sparingly water-soluble phosphatic fertilizer having special elution characteristics. The fertilizer of the invention and the process for controlling inorganizing speed of urea/aliphatic aldehyde condensation product of the invention make it possible to control the inorganizing speed of the condensation product without changing the particle size or form. The fertilizers of the invention or the urea/aliphatic aldehyde condensation products can provide nitrogen components to plant in accordance with the periods of culture of desired crops and a pattern of absorbing nutrition. This is effective in saving of the number of additional fertilization or nitrogen components left in soil after the period of culture.
摘要:
[Problems] It is an object of the invention to provide a producing method of a magnesium-based alloy screw capable of producing a screw made of magnesium-based alloy having excellent strength with excellent productivity, and to provide a magnesium-based alloy screw. [Means to Solve the Problem] The producing method includes a head forging step in which a head working for forming a head portion of a screw on a wire made of magnesium-based alloy obtained by drawing is carried out by warm working to produce a screw blank, and a thread rolling step in which thread rolling for forming screw thread on the screw blank is carried out by warm working to produce a screw. The head working in the head forging step is carried out using holding die which fixes the wire and a punch which forms a head portion of the screw. The holding die and the punch are heated, in which at least the holding die are heated to 140° C. or higher and 250° C. or lower, thereby heating the wire to 140° C. or higher and lower than 250° C.
摘要:
The present invention provides a method of high speed assemble process capable of dealing with long packets with effective buffer memories usage. A processing method of fragmented packets in packet transfer equipment for transmitting and receiving packet data between terminals through network, includes, receiving fragmented packets, identifying whether the received packet is a packet fragmented into two from original, or a packet fragmented into three or more, for the packet identified as fragmented into two, storing the two fragmented packets into assembly buffer in fragmentation order, on basis of the respective offset values in the packets, and reading out from top, and for the packet fragmented into three or more, chain-connecting the assembly buffers and storing the packets therein in reception order, reading out the packets after deciding the order by comparing chain information and offset values of the fragmented packets within the chain, and then reassembling the packets.