Absorbent article package and method of folding the same along folding lines toward opposite sides thereof
    72.
    发明授权
    Absorbent article package and method of folding the same along folding lines toward opposite sides thereof 有权
    吸收性物品包装及其折叠线朝向其相对侧折叠的方法

    公开(公告)号:US09387137B2

    公开(公告)日:2016-07-12

    申请号:US13976233

    申请日:2011-12-27

    摘要: An absorbent article package is individually packaged by folding a packaging sheet and an absorbent article in a state where the absorbent article is arranged on the packaging sheet. In a state where the individually-packaged absorbent article is opened, in the packaging sheet and the absorbent article, a first folding line based on which the absorbent article and the packaging sheet are folded towards the topsheet side, and a second folding line based on which the absorbent article and the packaging sheet are folded towards the backsheet side are formed adjacent to each other in the longitudinal direction.

    摘要翻译: 通过在吸收性物品配置在包装片上的状态下折叠包装片和吸收性物品,分别包装吸收性物品包装。 在打开单独包装的吸收性物品的状态下,在包装用片材和吸收性物品中,将吸收性物品和包装用片材朝向顶片侧折叠的第一折叠线和基于 所述吸收性物品和所述包装用薄片朝向所述背面侧折叠而形成为在长度方向上彼此相邻地形成。

    WRAPPED ABSORBENT ARTICLE
    74.
    发明申请
    WRAPPED ABSORBENT ARTICLE 审中-公开
    包装吸收品

    公开(公告)号:US20120123378A1

    公开(公告)日:2012-05-17

    申请号:US13320353

    申请日:2010-05-13

    IPC分类号: A61F13/84

    CPC分类号: B65D75/20 A61F13/5514

    摘要: While a protection sheet 60 is disposed on a non-skin-surface 20a of an absorbent article 1, part of the protection sheet 60 is folded back in such a manner as to reach a position where the part overlaps other part, which comes in contact with the non-skin surface 20a of the absorbent article 1. An end portion 60a of the protection sheet 60 is bonded, while being folded back, to the protection sheet 60 by means of an adhesive material 70. Edge portions 60b and 60c on both sides of the protection sheet 60 in a longitudinal direction of the protection sheet 60 are bonded together through thermal fusion bonding while being folded. A second adhesive region 71 coated with the adhesive material 70 is formed in a predetermined position which faces the non-skin-surface 20a of a backsheet 20. The second adhesive region 71 is formed at a position corresponding to a non-adhesive region 52.

    摘要翻译: 虽然保护片60设置在吸收性物品1的非皮肤表面20a上,但是保护片60的一部分被折回到达到与其他部分重叠的位置的位置 与吸收性物品1的非皮肤表面20a连接。保护片60的端部60a通过粘合材料70在折回的状态下被粘合到保护片60上。两者上的边缘部分60b和60c 保护片60在保护片60的长度方向上的两侧通过热熔接而被折叠而接合在一起。 涂覆有粘合剂材料70的第二粘合剂区域71形成在与底片20的非皮肤表面20a相对的预定位置。第二粘合区域71形成在对应于非粘合区域52的位置。

    OPTICAL LENS
    75.
    发明申请
    OPTICAL LENS 有权
    光学镜头

    公开(公告)号:US20110109980A1

    公开(公告)日:2011-05-12

    申请号:US13003170

    申请日:2009-07-06

    摘要: An optical lens formed of a polyester resin having a high refractive index, a low Abbe number and good moldability is provided.The optical lens is obtained by injection-molding a polyester resin containing a diol unit containing from 40 to 99% by mol of a unit derived from ethylene glycol and from 1 to 60% by mol of a unit derived from a diol having from 3 to 16 carbon atoms, and a dicarboxylic acid unit containing 50% by mol or more of a unit derived from a naphthalenedicarboxylic acid.

    摘要翻译: 提供了由具有高折射率,低阿贝数和良好成型性的聚酯树脂形成的光学透镜。 光学透镜是通过注射成型含有二醇单元的聚酯树脂而获得的,所述二醇单元含有40〜99摩尔%的来源于乙二醇的单元和1〜60摩尔%的来自具有3〜 16个碳原子,和含有50摩尔%以上衍生自萘二甲酸的单元的二羧酸单元。

    Gas Head and Thin-Film Manufacturing Apparatus
    76.
    发明申请
    Gas Head and Thin-Film Manufacturing Apparatus 有权
    气头和薄膜制造设备

    公开(公告)号:US20090250004A1

    公开(公告)日:2009-10-08

    申请号:US12086032

    申请日:2006-11-13

    IPC分类号: C23C16/00 B05B7/00

    摘要: A gas head that, at low cost, is capable of suppressing any deactivation of radical gas and capable of uniformly introducing a raw material gas on a substrate; and a relevant thin-film manufacturing apparatus are provided. A gas head (13) according to the present invention includes a reactive gas introduction port (30A) for introduction of a reactive gas, a plurality of raw material gas introduction ports (30B) for introduction of a raw material gas, and a dispersion board (32) for dispersing the raw material gas, wherein the plurality of the raw material gas introduction ports (30B) are disposed so as to surround the periphery of the reactive gas introduction port (30A). The reactive gas having been introduced in the reactive gas introduction port (30A) is mixed with the raw material gas having been introduced through a plurality of raw material gas introduction ports (30B) and dispersed by means of the dispersion board (32). Although the plurality of raw material gas introduction ports (30B) are disposed around the reactive gas introduction port (30A), they are not required to be minute holes such as shower holes.

    摘要翻译: 一种低成本地能够抑制自由基气体的失活并能够将原料气体均匀地引入到基板上的气体头, 并提供相关的薄膜制造装置。 根据本发明的气体头(13)包括用于引入反应性气体的反应气体引入口(30A),用于引入原料气体的多个原料气体导入口(30B)和分散板 (32),用于分散原料气体,其中多个原料气体导入口(30B)配置成包围反应气体导入口(30A)的周围。 引入到反应气体导入口(30A)中的反应性气体与通过多个原料气体导入口(30B)导入并通过分散板(32)分散的原料气体混合。 虽然多个原料气体导入口(30B)配置在反应气体导入口(30A)的周围,但不需要像淋浴孔那样的小孔。

    Selective W-Cvd Method and Method for Forming Multi-Layered Cu Electrical Interconnection
    77.
    发明申请
    Selective W-Cvd Method and Method for Forming Multi-Layered Cu Electrical Interconnection 有权
    选择性W-CVD方法和形成多层Cu电互连的方法

    公开(公告)号:US20080311741A1

    公开(公告)日:2008-12-18

    申请号:US11886428

    申请日:2006-03-13

    IPC分类号: H01L21/768

    摘要: A substrate provided thereon with an electrical insulating film which carries holes or the like filled with a Cu-containing electrical interconnection film is subjected to a pre-treatment in which the surface of the electrical insulating film and that of the Cu-containing electrical interconnection film are treated at a temperature of not more than 300° C. using, in a predetermined state, a gas of a compound containing an atom selected from the group consisting of N, H and Si atoms within the chemical formula thereof, before selectively forming a W-capping film on the electrical interconnection film. After the completion of the pre-treatment, a W-capping film is selectively formed on the electrical interconnection film and then an upper Cu electrical interconnection is further formed.

    摘要翻译: 在其上设置有带有填充有含Cu电互连膜的孔等的电绝缘膜的基板经受预处理,其中电绝缘膜的表面和含Cu电互连膜的表面 在不超过300℃的温度下,在预定状态下,在选择性地形成其中之前,含有选自由N,H和Si原子组成的组的化合物的化合物的气体 电气互连膜上的W覆盖膜。 在预处理完成之后,在电互连膜上选择性地形成W覆盖膜,然后进一步形成上部Cu电互连。

    Method for forming barrier film and method for forming electrode film
    79.
    发明授权
    Method for forming barrier film and method for forming electrode film 有权
    形成阻挡膜的方法和形成电极膜的方法

    公开(公告)号:US07419904B2

    公开(公告)日:2008-09-02

    申请号:US11495648

    申请日:2006-07-31

    申请人: Nobuyuki Kato

    发明人: Nobuyuki Kato

    IPC分类号: H01L21/4763

    摘要: In the present invention, a barrier film 20 is formed by forming a tungsten nitride film 21 and subsequently by forming a tungsten silicide film 22. The tungsten silicide film 22 is exposed at the surface of the barrier film 20, and an electrode film 25′ is formed so as to be brought into close contact with the tungsten silicide film 22. Since a conductive material constituting the electrode film 25′ is chemically bound to silicon atoms in the tungsten silicide film 22, the adhesion between the barrier film 20 and the electrode film 25′ is high, and the electrode film 25′ resists peeling from the barrier film 20. Further, agglomeration is not likely to occur in the electrode film 25′ during annealing.

    摘要翻译: 在本发明中,通过形成氮化钨膜21并随后通过形成硅化钨膜22来形成阻挡膜20。 硅化钨膜22在阻挡膜20的表面露出,并且形成电极膜25'以与硅化钨膜22紧密接触。 由于构成电极膜25'的导电材料与硅化钨膜22中的硅原子化学键合,因此阻挡膜20与电极膜25'之间的粘合力高,并且电极膜25'抵抗屏障剥离 电影20。 此外,退火时电极膜25'中不可能发生聚集。

    Method for forming tungsten nitride film
    80.
    发明申请
    Method for forming tungsten nitride film 有权
    形成氮化钨膜的方法

    公开(公告)号:US20050221625A1

    公开(公告)日:2005-10-06

    申请号:US11140362

    申请日:2005-05-31

    摘要: A method for forming a tungsten nitride film including a first material gas supply step of supplying a first material gas composed of a tungsten compound gas, a reduction step of supplying a reducing gas, a second material gas supply step of supplying a second material gas composed of a tungsten compound gas, and a nitridation step of supplying a nitriding gas. Since a step of depositing tungsten on a substrate 5, and a step of forming tungsten nitride are performed separately, by varying the flow rate of each gas, the pressure when each gas is supplied, and the supply time, or the number of times each step is performed and the order in which the steps are performed, the quantity of tungsten deposited and the quantity of tungsten nitride formed can be controlled easily.

    摘要翻译: 一种形成氮化钨膜的方法,包括:供给由钨化合物气体构成的第一原料气体的第一原料气体供给工序,供给还原气体的还原工序;第二原料气体供给工序, 的钨化合物气体,以及氮化步骤,供给氮化气体。 由于在基板5上沉积钨的步骤和形成氮化钨的步骤是通过改变每种气体的流量,每个气体的供给时的压力,供给时间或每个气体的次数, 执行步骤,并且可以容易地控制步骤的顺序,钨沉积的量和形成的氮化钨的量。