摘要:
A camera, which is removably mountable on an ophthalmologic photographing apparatus including an illumination optical system configured to illuminate a subject's eye with illumination light, includes an imaging unit configured to form an image from return light from the subject's eye through a photographing optical system in the ophthalmologic photographing apparatus, a development unit configured to develop a moving image or a still image of the subject's eye based on an output signal from the imaging unit with using a development parameter based on a wavelength range of the illumination light, and a display unit configured to display the moving image or the still image developed by the development unit.
摘要:
A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.
摘要:
A fundus photographing apparatus includes an imaging unit configured to capture a fundus image of an subject's eye via a photographing optical system, an imaging magnification output unit configured to output imaging magnification of the photographing optical system, a fixation target presenting unit configured to make the subject's eye to look firmly at a fixation target, a fixation target presenting position detection unit configured to detect a presenting position of the fixation target presenting unit, a matching area determination unit configured to determine an area for matching a fundus image based on the imaging magnification and the presenting position of the fixation target, and a correlation value calculation unit configured to calculate a correlation value between a plurality of fundus images captured by the imaging unit based on the matching area determined by the matching area determination unit.
摘要:
A medical imaging apparatus capable of concurrently performing a plurality of imaging operations including an imaging sequence setting unit configured to set a sequence for each of the plurality of imaging operations, an overlapping determination unit configured to determine temporal overlapping between an imaging sequence of an imaging operation that is currently performed and an imaging sequence for an imaging operation that is to be started, and an imaging sequence adjustment unit configured to adjust, based on a result of determination made by the overlapping determination unit, the imaging sequence for the imaging operation that is to be started.
摘要:
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
摘要:
A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.
摘要:
A power tool has a base, a main unit, a cutter, a bolt, an engagement member, and a unit. The base has a sliding surface slidable on a workpiece, another surface opposite to the sliding surface, and an opening in the base. The main unit is movable in a first direction substantially perpendicular to the sliding surface. The cutter is driven by a electric motor in the main unit to protrude through the opening from the sliding surface during an operation. The bolt extends in the first direction on the first side, a first male thread, and one end supported by the base. The bolt is rotatable about the longitudinal axis. The engagement member has a first female thread threadably engaged with the male thread. The engagement member is movable between an engaged position with the boot and a disengaged position therewith. The unit maintains the engagement member at the disengaged position in a second direction. The rotation of the bolt causes the first male thread portion to thread with respect to the first male thread portion, thereby moving the main unit in the first direction and adjusting a distance of the main unit to the sliding surface.
摘要:
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
摘要:
A cooperative diagnosis system for allowing a plurality of doctors to efficiently make a diagnosis in cooperation with each other is provided. When a terminal apparatus 112 on a requesting side 110 issues a diagnosis request to a server 120, the server 120 selects a doctor in charge of a diagnosis in accordance with preset priority levels, and transmits diagnosis request mail to the selected doctor's address in charge of the diagnosis. The doctor in charge of the diagnosis accesses the server 120 from his/her terminal 131A to browse examination data and register a diagnosis result in the server 120. The doctor on the requesting side 110 accesses the server 120 by using his/her terminal 112 to browse the diagnosis result.