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    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    71.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20120064677A1

    公开(公告)日：2012-03-15

    申请号：US13225703

    申请日：2011-09-06

    申请人： Hidekazu MIYAIRI ,  Koji DAIRIKI ,  Shunpei YAMAZAKI ,  Ryo ARASAWA

    发明人： Hidekazu MIYAIRI ,  Koji DAIRIKI ,  Shunpei YAMAZAKI ,  Ryo ARASAWA

    IPC分类号： H01L21/336

    CPC分类号： H01L29/78678 ,  H01L29/66765 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78669 ,  H01L29/78696

    摘要： Provided is a method for manufacturing a semiconductor device with fewer masks and in a simple process. A gate electrode is formed. A gate insulating film, a semiconductor film, an impurity semiconductor film, and a conductive film are stacked in this order, covering the gate electrode. A source electrode and a drain electrode are formed by processing the conductive film. A source region, a drain region, and a semiconductor layer, an upper part of a portion of which does not overlap with the source region and the drain region is removed, are formed by processing the upper part of the semiconductor film, while the impurity semiconductor film is divided. A passivation film over the gate insulating film, the semiconductor layer, the source region, the drain region, the source electrode, and the drain electrode are formed. An etching mask is formed over the passivation film. At least the passivation film and the semiconductor layer are processed to have an island shape while an opening reaching the source electrode or the drain electrode is formed, with the use of the etching mask. The etching mask is removed. A pixel electrode is formed over the gate insulating film and the passivation film.

    摘要翻译： 提供一种用于制造具有较少掩模的半导体器件的方法，并且在简单的过程中。 形成栅电极。 依次层叠栅绝缘膜，半导体膜，杂质半导体膜和导电膜，覆盖栅电极。 通过处理导电膜形成源电极和漏电极。 通过处理半导体膜的上部，形成源区域，漏极区域和半导体层，其部分的上部不与源极区域和漏极区域重叠，而杂质 半导体薄膜被划分。 形成栅极绝缘膜，半导体层，源极区域，漏极区域，源极电极和漏极电极之后的钝化膜。 在钝化膜上形成蚀刻掩模。 通过使用蚀刻掩模，至少钝化膜和半导体层被加工成具有岛状，同时形成到达源电极或漏电极的开口。 去除蚀刻掩模。 在栅极绝缘膜和钝化膜上形成像素电极。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    73.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号：US20120058599A1

    公开(公告)日：2012-03-08

    申请号：US13227585

    申请日：2011-09-08

    申请人： Shunpei YAMAZAKI ,  Hidekazu MIYAIRI ,  Kengo AKIMOTO ,  Kojiro SHIRAISHI

    发明人： Shunpei YAMAZAKI ,  Hidekazu MIYAIRI ,  Kengo AKIMOTO ,  Kojiro SHIRAISHI

    IPC分类号： H01L21/02 ,  H01L21/20

    CPC分类号： H01L29/7869 ,  H01L27/1225

    摘要： The semiconductor device includes a thin film transistor which includes a gate electrode layer, a gate insulating layer over the gate electrode layer, a source electrode layer and a drain electrode layer over the gate insulating layer, a buffer layer over the source electrode layer and the drain electrode layer, and a semiconductor layer over the buffer layer. A part of the semiconductor layer overlapping with the gate electrode layer is over and in contact with the gate insulating layer and is provided between the source electrode layer and the drain electrode layer. The semiconductor layer is an oxide semiconductor layer containing indium, gallium, and zinc. The buffer layer contains a metal oxide having n-type conductivity. The semiconductor layer and the source and drain electrode layers are electrically connected to each other through the buffer layer.

    摘要翻译： 该半导体器件包括薄膜晶体管，该薄膜晶体管包括栅极电极层，栅极电极层上的栅极绝缘层，栅极绝缘层上的源极电极层和漏极电极层，源电极层上的缓冲层和 漏极电极层和缓冲层上的半导体层。 与栅电极层重叠的半导体层的一部分与栅极绝缘层相接触并且设置在源极电极层和漏极电极层之间。 半导体层是含有铟，镓和锌的氧化物半导体层。 缓冲层含有具有n型导电性的金属氧化物。 半导体层和源极和漏极电极层通过缓冲层彼此电连接。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    74.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20120058598A1

    公开(公告)日：2012-03-08

    申请号：US13211588

    申请日：2011-08-17

    申请人： Shunpei YAMAZAKI

    发明人： Shunpei YAMAZAKI

    IPC分类号： H01L21/34

    CPC分类号： H01L21/02565 ,  H01L21/02488 ,  H01L21/02554 ,  H01L21/02631 ,  H01L21/283 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869

    摘要： Electrical characteristics of transistors using an oxide semiconductor are greatly varied in a substrate, between substrates, and between lots, and the electrical characteristics are changed due to heat, bias, light, or the like in some cases. In view of the above, a semiconductor device using an oxide semiconductor with high reliability and small variation in electrical characteristics is manufactured. In a method for manufacturing a semiconductor device, hydrogen in a film and at an interface between films is removed in a transistor using an oxide semiconductor. In order to remove hydrogen at the interface between the films, the substrate is transferred under a vacuum between film formations. Further, as for a substrate having a surface exposed to the air, hydrogen on the surface of the substrate may be removed by heat treatment or plasma treatment.

    摘要翻译： 使用氧化物半导体的晶体管的电气特性在基板，基板之间和批次之间变化很大，并且电特性在某些情况下由于热，偏压，光等而改变。 鉴于上述，制造了使用具有高可靠性和小的电特性变化的氧化物半导体的半导体器件。 在制造半导体器件的方法中，使用氧化物半导体在晶体管中去除膜中的膜和膜之间的界面处的氢。 为了在膜之间的界面处除去氢，基板在膜形成之间在真空下转移。 此外，对于具有暴露于空气的表面的基板，可以通过热处理或等离子体处理来去除基板表面上的氢。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    75.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号：US20120052624A1

    公开(公告)日：2012-03-01

    申请号：US13211504

    申请日：2011-08-17

    申请人： Shunpei YAMAZAKI

    发明人： Shunpei YAMAZAKI

    IPC分类号： H01L21/34

    CPC分类号： H01L21/02565 ,  H01L21/02631 ,  H01L21/02694 ,  H01L29/26 ,  H01L29/4908 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78606 ,  H01L29/7869

    摘要： One object is to have stable electrical characteristics and high reliability and to manufacture a semiconductor device including a semi-conductive oxide film. Film formation is performed by a sputtering method using a target in which gallium oxide is added to a material that is easy to volatilize compared to gallium when the material is heated at 400° C. to 700° C. like zinc, and a formed film is heated at 400° C. to 700° C., whereby the added material is segregated in the vicinity of a surface of the film and the oxide is crystallized. Further, a semi-conductive oxide film is deposited thereover, whereby a semi-conductive oxide having a crystal which succeeds a crystal structure of the oxide that is crystallized by heat treatment is formed.

    摘要翻译： 一个目的是具有稳定的电特性和高可靠性，并且制造包括半导体氧化膜的半导体器件。 当将材料在400℃加热至700℃（如锌）时，使用其中加入氧化镓的靶与易于挥发的材料相比，通过溅射法进行成膜，并且形成膜 在400℃加热至700℃，由此将添加的材料分离在膜的表面附近，并使氧化物结晶化。 此外，在其上沉积半导电氧化物膜，由此形成具有通过热处理结晶化的氧化物晶体结构成为结晶的半导体氧化物。

    ELECTRO-OPTICAL DEVICE
    76.
    发明申请
    ELECTRO-OPTICAL DEVICE 有权
    电光器件

    公开(公告)号：US20120044433A1

    公开(公告)日：2012-02-23

    申请号：US13278219

    申请日：2011-10-21

    申请人： Yoshiharu HIRAKATA ,  Takeshi NISHI ,  Shunpei YAMAZAKI

    发明人： Yoshiharu HIRAKATA ,  Takeshi NISHI ,  Shunpei YAMAZAKI

    IPC分类号： G02F1/1337

    CPC分类号： G02F1/13454 ,  G02F1/1339 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/1248

    摘要： In an active matrix semiconductor display device in which pixel TFTs and driver circuit TFT are formed on the same substrate in an integral manner, the cell gap is controlled by gap retaining members that are disposed between a pixel area and driver circuit areas. This makes it possible to provide a uniform cell thickness profile over the entire semiconductor display device. Further, since conventional grainy spacers are not used, stress is not imposed on the driver circuit TFTs when a TFT substrate and an opposed substrate are bonded together. This prevents the driver circuit TFTs from being damaged.

    摘要翻译： 在其中像素TFT和驱动电路TFT以整体方式形成在同一基板上的有源矩阵半导体显示装置中，通过设置在像素区域和驱动电路区域之间的间隙保持构件来控制单元间隙。 这使得可以在整个半导体显示装置上提供均匀的电池厚度分布。 此外，由于不使用常规的颗粒状间隔物，当TFT基板和相对的基板接合在一起时，驱动电路TFT不施加应力。 这防止驱动电路TFT被损坏。

    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
    77.
    发明申请
    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20120040501A1

    公开(公告)日：2012-02-16

    申请号：US13285256

    申请日：2011-10-31

    申请人： Shunpei YAMAZAKI

    发明人： Shunpei YAMAZAKI

    IPC分类号： H01L21/8238 ,  H01L21/336

    CPC分类号： H01L27/3262 ,  H01L21/28114 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/3244 ,  H01L27/3248 ,  H01L29/42384 ,  H01L29/66492 ,  H01L29/66598 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78627 ,  H01L29/78675 ,  H01L29/78696 ,  H01L51/5256 ,  H01L2029/7863 ,  H01L2227/32

    摘要： There is provided a thin film transistor having improved reliability. A gate electrode includes a first gate electrode having a taper portion and a second gate electrode with a width narrower than the first gate electrode. A semiconductor layer is doped with phosphorus of a low concentration through the first gate electrode. In the semiconductor layer, two kinds of n−-type impurity regions are formed between a channel formation region and n+-type impurity regions. Some of the n−-type impurity regions overlap with a gate electrode, and the other n−-type impurity regions do not overlap with the gate electrode. Since the two kinds of n−-type impurity regions are formed, an off current can be reduced, and deterioration of characteristics can be suppressed.

    摘要翻译： 提供了具有改进的可靠性的薄膜晶体管。 栅电极包括具有锥形部分的第一栅电极和宽度比第一栅电极窄的第二栅电极。 半导体层通过第一栅电极掺杂低浓度的磷。 在半导体层中，在沟道形成区域和n +型杂质区域之间形成两种n型杂质区域。 n型杂质区域中的一些与栅电极重叠，其他n型杂质区域与栅电极不重叠。 由于形成了两种n型杂质区，所以可以减少截止电流，并且可以抑制特性劣化。

    SEMICONDUCTOR DEVICE
    78.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20120037993A1

    公开(公告)日：2012-02-16

    申请号：US13280716

    申请日：2011-10-25

    申请人： Shunpei YAMAZAKI ,  Yuugo Goto ,  Tsutomu Murakawa

    发明人： Shunpei YAMAZAKI ,  Yuugo Goto ,  Tsutomu Murakawa

    IPC分类号： H01L29/78 ,  H01L29/06

    CPC分类号： H01L27/1218

    摘要： A semiconductor device in which damages to an element such as a transistor are reduced even when external force such as bending is applied and stress is generated in the semiconductor device. The semiconductor device includes a first island-like reinforcement film over a substrate having flexibility; a semiconductor film including a channel formation region and an impurity region over the first island-like reinforcement film; a first conductive film over the channel formation region with a gate insulating film interposed therebetween; a second island-like reinforcement film covering the first conductive film and the gate insulating film.

    摘要翻译： 即使在施加诸如弯曲的外力并且在半导体器件中产生应力的情况下，诸如晶体管的元件的损坏也减小的半导体器件。 半导体器件包括在具有柔性的衬底上的第一岛状增强膜; 包括第一岛状增强膜上的沟道形成区域和杂质区域的半导体膜; 在沟道形成区域上的第一导电膜，其间插入有栅极绝缘膜; 覆盖第一导电膜和栅极绝缘膜的第二岛状加强膜。