摘要:
A semiconductor integrated circuit includes: an oxide resistance change element, a constant current source circuit supplying a write current to the oxide resistance change element, and a voltage clamper clamping a voltage in a path in which a write current flows. The voltage clamper is arranged in parallel with the path between the constant current source circuit and the oxide resistance change element.
摘要:
MRAM includes a first wiring, a second wiring, and a memory cell. The first wiring extends to a first direction, and the second wiring extends to a second direction. The memory cell includes a free magnetic layer in which a plurality of magnetic layers coupled anti-ferromagnetically through non-magnetic layers are laminated, and is provided at an intersection of the first and second wirings. The magnetization direction of the free magnetic layer is different from the first and second directions. The writing method includes (a) reading a first data stored in the memory cell; (b) comparing a second data to be written to the memory cell and the first data; and (c) changing a direction of a first write current supplied to the first wiring and a direction of the second write current to be supplied to the second wiring, when the first data and second data are different.
摘要:
An integrated-circuit device comprises a combination of a microprocessor in the form of a circuit cell having a prescribed shape as an existing microprocessor and cache memories and a tag memory each in the form of a circuit cell. The tag memory have the same row addresses as the cache memories, and some of the row addresses are converted to column addresses. The tag memory is of a structure in which a basic structure similar to a conventional structure is divided into a plurality of parts in one of x and y directions, and the parts are arrayed in the other of the x and y directions. The tag memory thus shaped can be placed in a dead space on a circuit board, and hence an undesirable dead space can be eliminated from the integrated-circuit device.
摘要:
A dynamic random access memory device selects a row of memory cells from a plurality of memory cell sub-arrays with main word lines and sub-word lines for a data access, and data bits read out from the row of memory cells are amplified by a sense amplifier circuit array, wherein a row block address decoder and a column block address decoder supply a first enable signal and a second enable signal to a row of memory cell sub-arrays and a column of memory cell sub-arrays so that only one of the sense amplifier circuit arrays is powered for the amplification, thereby decreasing peak current consumed by the sense amplifier circuit arrays.
摘要:
A semiconductor integrated circuit device has a first internal voltage controlling circuit which lowers an external power source voltage and produces a predetermined internal power source voltage. The device further has a second internal voltage controlling circuit formed by an internal-voltage drop detection circuit for detecting the lowering of the internal power source voltage from a predetermined reference voltage and a switching circuit for causing the external power source voltage to be directly connected to an internal voltage output terminal based on an output from the internal-voltage drop detection circuit. The internal power source voltage is maintained close to the required value thereby preventing a deterioration of circuit performance even when the external power source voltage drops close to the internal power source voltage.
摘要:
A dynamic random access memory device can enter a diagnostic mode of operation to see whether or not undesirable short-circuit takes place in a word line and/or a control signal line for transfer gates between bit lines and a sense amplifier unit, and a built-in testing operation discriminating unit discriminates the testing operation on the word lines and the control signal lines from other testing operations for causing a power supply system to interrupt electric power to a row address decoder unit and a driver unit for the control signal lines so that voltage level on a word line and/or a control signal line is rapidly decayed due to the short-circuit, thereby screening out the defective products before the delivery from the manufacturer.
摘要:
MRAM includes a first wiring, a second wiring, and a memory cell. The first wiring extends to a first direction, and the second wiring extends to a second direction. The memory cell includes a free magnetic layer in which a plurality of magnetic layers coupled anti-ferromagnetically through non-magnetic layers are laminated, and is provided at an intersection of the first and second wirings. The magnetization direction of the free magnetic layer is different from the first and second directions. The writing method includes (a) reading a first data stored in the memory cell; (b) comparing a second data to be written to the memory cell and the first data; and (c) changing a direction of a first write current supplied to the first wiring and a direction of the second write current to be supplied to the second wiring, when the first data and second data are different.
摘要:
The present invention relates to a transistor for selecting a storage cell and a switch using a solid electrolyte. In a storage cell, a metal is stacked on a drain diffusion layer of a field-effect transistor formed on a semiconductor substrate surface. The solid electrolyte using the metal as a carrier is stacked on the metal. The solid electrolyte contacts with the metal via a gap, and the metal is connected to a common grounding conductor. A source of the field-effect transistor is connected to a column address line, and a gate of the field-effect transistor is connected to a row address line.
摘要:
A technology for eliminating the defects in a tunnel insulation film of magnetic tunnel junction and for suppressing generation of a defective bit in an MRAM using magnetic tunnel junction in a memory. The magnetic memory includes a substrate, an interlayer insulation film covering the upper surface side of the substrate, memory cells, and plugs penetrating the interlayer insulation film. The memory cell includes a first magnetic layer formed on the upper surface side of the interlayer insulation film, a tunnel insulation layer formed on the first magnetic layer, and a second magnetic layer formed on the tunnel insulation layer. The plug is connected electrically with the first magnetic layer. The tunnel current passing part of the tunnel insulation layer located between the first and second magnetic layers is arranged, at least partially, so as not to overlap the plug in the direction perpendicular to the surface of the substrate.
摘要:
Semiconductor integrated circuit includes a MPU and a cache memory implemented by a plurality of DRAM macro blocks each disposed between the MPU and bonding pads of the chip. Each DRAM macro block has a redundancy function for replacing a defective row with a redundancy row of memory cells. A plurality of fuse blocks each for storing the row address of the defective row are arranged in a row, with the elongate sides of each of the fuse blocks extending parallel to the signal lines extending between the MPU and the bonding pads. The arrangement allows a large number of signal lines to pass the space between the fuse blocks, thereby allowing a smaller chip size.