公开(公告)号：US07344938B2

公开(公告)日：2008-03-18

申请号：US11745059

申请日：2007-05-07

Applicant: Kent Kuohua Chang ,  Jongoh Kim ,  Yider Wu

Inventor： Kent Kuohua Chang ,  Jongoh Kim ,  Yider Wu

IPC: H01L21/8244

CPC classification number: H01L27/11568 ,  H01L27/105 ,  H01L27/11573

Abstract: A method of fabricating a memory device is described. During the process of forming the memory cell area and the periphery area of a semiconductor device a photoresist layer is formed on the memory cell area before the spacers are formed on the sidewalls of the gates. Therefore, the memory cell area is prevented from being damaged to mitigate the leakage current problem during the process of forming spacers in the periphery circuit area.

Abstract translation: 描述了一种制造存储器件的方法。 在形成存储单元区域和半导体器件的外围区域的过程中，在形成在栅极的侧壁上的间隔物之前，在存储单元区域上形成光致抗蚀剂层。 因此，在外围电路区域中形成间隔物的过程中，防止存储单元区域被损坏以减轻漏电流问题。

公开(公告)号：US20070262412A1

公开(公告)日：2007-11-15

申请号：US11781551

申请日：2007-07-23

Applicant: Angela Hui ,  Jusuke Ogura ,  Yider Wu

Inventor： Angela Hui ,  Jusuke Ogura ,  Yider Wu

IPC: H01L29/00

CPC classification number: H01L21/76224

Abstract: A method and device for avoiding oxide gouging in shallow trench isolation (STI) regions of a semiconductor device. A trench may be etched in an STI region and filled with insulating material. An anti-reflective coating (ARC) layer may be deposited over the STI region and extend beyond the boundaries of the STI region. A portion of the ARC layer may be etched leaving a remaining portion of the ARC layer over the STI region and extending beyond the boundaries of the STI region. A protective cap may be deposited to cover the remaining portion of the ARC layer as well as the insulating material. The protective cap may be etched back to expose the ARC layer. However, the protective cap still covers and protects the insulating material. By providing a protective cap that covers the insulating material, gouging of the insulating material in STI regions may be avoided.

Abstract translation: 一种用于避免半导体器件的浅沟槽隔离（STI）区域中的氧化物气刨的方法和装置。 可以在STI区域中蚀刻沟槽并填充绝缘材料。 抗反射涂层（ARC）层可以沉积在STI区域上并延伸超出STI区域的边界。 可以蚀刻ARC层的一部分，留下ARC层的剩余部分超过STI区域并延伸超出STI区域的边界。 可以沉积保护盖以覆盖ARC层的剩余部分以及绝缘材料。 可以将保护盖回蚀以暴露ARC层。 然而，保护盖仍然覆盖并保护绝缘材料。 通过提供覆盖绝缘材料的保护帽，可以避免STI区域中的绝缘材料的气刨。

公开(公告)号：US07229876B2

公开(公告)日：2007-06-12

申请号：US11138612

申请日：2005-05-25

Applicant: Kent Kuohua Chang ,  Jongoh Kim ,  Yider Wu

Inventor： Kent Kuohua Chang ,  Jongoh Kim ,  Yider Wu

IPC: H01L21/8244

CPC classification number: H01L27/11568 ,  H01L27/105 ,  H01L27/11573

Abstract: A method of fabricating a memory device is described. During the process of forming the memory cell area and the periphery area of a semiconductor device a photoresist layer is formed on the memory cell area before the spacers are formed on the sidewalls of the gates. Therefore, the memory cell area is prevented from being damaged to mitigate the leakage current problem during the process of forming spacers in the periphery circuit area.

Abstract translation: 描述了一种制造存储器件的方法。 在形成存储单元区域和半导体器件的外围区域的过程中，在形成在栅极的侧壁上的间隔物之前，在存储单元区域上形成光致抗蚀剂层。 因此，在外围电路区域中形成间隔物的过程中，防止存储单元区域被损坏以减轻漏电流问题。

公开(公告)号：US07067388B1

公开(公告)日：2006-06-27

申请号：US10819162

申请日：2004-04-07

Applicant: Angela Hui ,  Yider Wu

Inventor： Angela Hui ,  Yider Wu

IPC: H04L29/02

CPC classification number: H01L21/28273 ,  H01L29/7881

Abstract: The present invention provides a flash memory device and method for making the same having a floating gate structure with a semiconductor substrate and shallow trench isolation (STI) structure formed in the substrate. A first polysilicon layer is formed over the substrate and the STI structure. The recess formed within the first polysilicon layer is over the STI structure and extends through the first polysilicon layer to the STI structure. An oxide fill is provided within the recess and is etched back. ONO (oxide-nitride-oxide) layer conformally covers the oxide fill and the first polysilicon layer. The second polysilicon layer covers the ONO layer. The oxide fill within the recess provides a minimum spacing between the second polysilicon layer and the corner of the STI regions, thereby avoiding the creation of a weak spot and reducing the risk of gate breakdown, gate leakage, and improving device reliability.

Abstract translation: 本发明提供了一种闪存器件及其制造方法，其具有在衬底中形成的具有半导体衬底和浅沟槽隔离（STI）结构的浮动栅极结构。 在衬底和STI结构上形成第一多晶硅层。 形成在第一多晶硅层内的凹槽在STI结构之上并且延伸穿过第一多晶硅层到STI结构。 在凹槽内设置氧化物填充物并被回蚀。 ONO（氧化物 - 氧化物 - 氧化物）层保形地覆盖氧化物填充物和第一多晶硅层。 第二多晶硅层覆盖ONO层。 凹陷内的氧化物填充提供了第二多晶硅层与STI区域的拐角之间的最小间隔，从而避免了产生弱点并降低了栅极击穿，栅极泄漏和提高器件可靠性的风险。

公开(公告)号：US06797565B1

公开(公告)日：2004-09-28

申请号：US10244369

申请日：2002-09-16

Applicant: Jean Yee-Mei Yang ,  Yider Wu ,  Zhizheng Liu

Inventor： Jean Yee-Mei Yang ,  Yider Wu ,  Zhizheng Liu

IPC: H01L21336

CPC classification number: H01L27/11568 ,  H01L27/115

Abstract: Methods are disclosed for fabricating dual bit SONOS flash memory cells, comprising forming polysilicon gate structures over an ONO layer, and doping source/drain regions of the substrate using the gate structures as an implant mask. Methods are also disclosed in which dielectric material is formed over and between the gate structures, and the wafer is planarized using an STI CMP process to remove dielectric material over the polysilicon gate structures.

Abstract translation: 公开了用于制造双位SONOS闪速存储器单元的方法，包括在ONO层上形成多晶硅栅极结构，以及使用栅极结构作为注入掩模来掺杂衬底的源极/漏极区域。 还公开了在栅极结构之上和栅极结构之间形成电介质材料的方法，并且使用STI CMP工艺对晶片进行平面化以去除多晶硅栅极结构上的电介质材料。

公开(公告)号：US06607925B1

公开(公告)日：2003-08-19

申请号：US10165837

申请日：2002-06-06

Applicant: Unsoon Kim ,  Dawn M. Hopper ,  Yider Wu ,  Krishnashree Achuthan

Inventor： Unsoon Kim ,  Dawn M. Hopper ,  Yider Wu ,  Krishnashree Achuthan

IPC: H01L2100

CPC classification number: H01L21/76224 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/32139

Abstract: A method for repairing an isolation dielectric damaged during a semiconductor fabrication process is disclosed in which a hard mask material is used to pattern a first material, the first material having openings therein exposing isolation regions comprising a first isolation dielectric layer. The method includes etching the hard mask material from the first material, wherein the etch creates gouges in the first isolation dielectric layer, and depositing a second layer of isolation dielectric over the first material, wherein the second isolation dielectric layer fills the gouges in the first isolation dielectric layer. The method further includes polishing on the second layer of isolation dielectric to remove the second layer of isolation dielectric from the first material.

Abstract translation: 公开了一种用于修复在半导体制造工艺期间损坏的隔离电介质的方法，其中使用硬掩模材料来图案化第一材料，其中在其中具有开口的第一材料暴露出包括第一隔离介电层的隔离区域。 该方法包括从第一材料蚀刻硬掩模材料，其中蚀刻在第一隔离电介质层中产生沟槽，以及在第一材料上沉积第二隔离电介质层，其中第二隔离电介质层填充第一隔离电介质层中的沟槽 隔离介电层。 该方法还包括在第二层隔离电介质上抛光以从第一材料去除第二隔离电介质层。

公开(公告)号：US06555436B2

公开(公告)日：2003-04-29

申请号：US10223195

申请日：2002-08-19

Applicant: Mark T. Ramsbey ,  Jean Y. Yang ,  Hidehiko Shiraiwa ,  Michael A. Van Buskirk ,  David M. Rogers ,  Ravi Sunkavalli ,  Janet Wang ,  Narbeh Derhacobian ,  Yider Wu

Inventor： Mark T. Ramsbey ,  Jean Y. Yang ,  Hidehiko Shiraiwa ,  Michael A. Van Buskirk ,  David M. Rogers ,  Ravi Sunkavalli ,  Janet Wang ,  Narbeh Derhacobian ,  Yider Wu

IPC: H01L21336

CPC classification number: H01L27/11568 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11573 ,  Y10S438/954 ,  Y10S438/981

Abstract: One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.

公开(公告)号：US06512701B1

公开(公告)日：2003-01-28

申请号：US09886861

申请日：2001-06-21

Applicant: Darlene G. Hamilton ,  Kulachet Tanpairoj ,  Yider Wu

Inventor： Darlene G. Hamilton ,  Kulachet Tanpairoj ,  Yider Wu

IPC: G11C1604

CPC classification number: G11C16/16 ,  G11C16/0475 ,  G11C16/0491

Abstract: A system and methodology is provided for verifying erasure of one or more dual bit virtual ground memory cells in a memory device, such as a flash memory. Each of the dual bits have a first or normal bit and a second or complimentary bit associated with the first or normal bit. The system and methodology include verifying and erasure of both a normal bit and a complimentary bit of the cell. The erasure includes applying a set of erase pulses to the normal bit and complimentary bit in a single dual bit cell. The set of erase pulses is comprised of a two sided erase pulse to both sides of the bits in the cell or transistor junction followed by a first single sided erase pulse to one side and a second single sided erase pulse to the other side of transistor junction.

Abstract translation: 提供了用于验证擦除存储器设备（例如闪存）中的一个或多个双位虚拟接地存储器单元的系统和方法。 每个双位具有与第一或正常位相关联的第一或正常位和第二或补充位。 系统和方法包括验证和擦除单元的正常位和互补位。 擦除包括将一组擦除脉冲施加到单个双位单元中的正常位和补充位。 该组擦除脉冲由单元或晶体管结中的位的两侧的双侧擦除脉冲组成，之后是一侧的第一单侧擦除脉冲和到晶体管结的另一侧的第二单侧擦除脉冲 。

公开(公告)号：US06436768B1

公开(公告)日：2002-08-20

申请号：US09893279

申请日：2001-06-27

Applicant: Jean Yee-Mei Yang ,  Mark T. Ramsbey ,  Emmanuil Manos Lingunis ,  Yider Wu ,  Tazrien Kamal ,  Yi He ,  Edward Hsia ,  Hidehiko Shiraiwa

Inventor： Jean Yee-Mei Yang ,  Mark T. Ramsbey ,  Emmanuil Manos Lingunis ,  Yider Wu ,  Tazrien Kamal ,  Yi He ,  Edward Hsia ,  Hidehiko Shiraiwa

IPC: H01L21336

CPC classification number: H01L21/2652 ,  H01L21/2658 ,  H01L27/11568 ,  H01L29/66833

Abstract: One aspect of the present invention relates to a method of forming a SONOS type non-volatile semiconductor memory device, involving forming a first layer of a charge trapping dielectric on a semiconductor substrate; forming a second layer of the charge trapping dielectric over the first layer of the charge trapping dielectric on the semiconductor substrate; optionally at least partially forming a third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; forming a source/drain mask over the charge trapping dielectric; implanting a source/drain implant through the charge trapping dielectric into the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; and one of forming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, reforming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, or forming additional material over the third layer of the charge trapping dielectric.

Abstract translation: 本发明的一个方面涉及一种形成SONOS型非易失性半导体存储器件的方法，包括在半导体衬底上形成电荷俘获电介质的第一层; 在所述半导体衬底上的所述电荷俘获电介质的所述第一层上形成所述电荷俘获电介质的第二层; 可选地至少部分地在所述半导体衬底上的所述电荷俘获电介质的所述第二层上形成所述电荷俘获电介质的第三层; 任选地去除电荷俘获电介质的第三层; 在电荷俘获电介质上形成源极/漏极掩模; 将源极/漏极注入物通过电荷俘获电介质注入到半导体衬底中; 任选地去除电荷俘获电介质的第三层; 以及在半导体衬底上的电荷俘获电介质的第二层上形成电荷俘获电介质的第三层之一，在半导体衬底上的电荷俘获电介质的第二层上重整第三层电荷俘获电介质，或 在电荷俘获电介质的第三层上形成附加材料。

公开(公告)号：US06399984B1

公开(公告)日：2002-06-04

申请号：US09882242

申请日：2001-06-15

Applicant: Yider Wu ,  Mark T. Ramsbey ,  Chi Chang ,  Yu Sun ,  Tuan Duc Pham ,  Jean Y. Yang

Inventor： Yider Wu ,  Mark T. Ramsbey ,  Chi Chang ,  Yu Sun ,  Tuan Duc Pham ,  Jean Y. Yang

IPC: H01L29788

CPC classification number: H01L27/11568 ,  H01L27/115

Abstract: A predetermined species such as nitrogen is placed at an interface between a bit line junction and a dielectric layer of a control dielectric structure of a flash memory device to minimize degradation of such an interface by minimizing formation of interface defects during program or erase operations of the flash memory device. The predetermined species such as nitrogen is implanted into a bit line junction of the flash memory device. A thermal process is performed that heats up the semiconductor wafer such that the predetermined species such as nitrogen implanted within the semiconductor wafer thermally drifts to the interface between the bit line junction and the control dielectric structure during the thermal process. The predetermined species such as nitrogen at the interface minimizes formation of interface defects and thus degradation of the interface with time during the program or erase operations of the flash memory device.

Abstract translation: 将诸如氮的预定物质放置在闪存存储器件的控制电介质结构的位线结和电介质层之间的界面处，以通过在编程或擦除操作期间最小化界面缺陷的形成来最小化这种界面的劣化 闪存设备。 将诸如氮的预定物质注入到闪速存储器件的位线结中。 执行加热半导体晶片的热处理，使得在热处理期间注入到半导体晶片内的预定物质例如氮漂移到位线结和控制电介质结构之间的界面。 在闪存器件的编程或擦除操作期间，预定种类例如接口处的氮使界面缺陷的形成最小化，从而使界面的时效性降低。