摘要:
The outer surface of a butt-welded joint is build-up welded such that a ratio h/t is higher than approximate 0.2 and a ratio L/.sqroot.Rt is higher than approximate 1, where h denotes height of a build-up welded portion; t, wall thickness of a pipe; L, width of the build-up welded portion; and R, radius of the pipe. As a result, the residual stresses in the build-up welded portion counterbalances the residual stresses in the welded joint, whereby the residual stresses at the inner surface of the welded joint can be relieved.
摘要:
A novel diester compound of the formula (I): ##STR1## wherein each of R.sub.1 and R.sub.2 represents a group of the formula (II): ##STR2## wherein n is an integer of 0 to 4; and m an integer of 1 to 5, is found to be capable of imparting excellent flame-retardancy to various inflammable polymeric materials such as polystyrene, polyester, polyamide, polyphenylene oxide, etc. without deleterious effects on other physical properties of such polymeric materials.
摘要:
A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.
摘要:
A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.
摘要:
A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.
摘要:
A fretting-resistant connector, having an organic coating that is formed of an organic compound which has an ether linkage group at least a part on a surface of an electrically conductive metal material.
摘要:
An operating device for a manual transmission apparatus, comprising a plurality of operation shafts, a shift-and-select shaft having an engagement groove extending in a circumferential direction thereof, selecting one of a plurality of operation shafts by rotating and moving the selected operation shaft in an axial direction thereof by moving in an axial direction of the shift-and-select shaft, an operating portion for manually operating the shift-and-select shaft, an inertia unit including an engagement pin, positioned within the engagement groove and pivoting in response to a movement of the shift-and-select shaft in the axial direction thereof, and a swing-and-contact member provided at the engagement pin of the inertia unit so as to swing when being pressed by one of first and second inner surfaces of the engagement groove in accordance with the movement of the shift-and-select shaft and contacting the first and second inner surfaces of the engagement groove.
摘要:
The present invention relates to a production process of polyphenylene ether composition comprising (A-1) a polyphenylene ether, (A-2) a polystyrene, (A-3) an ester phosphate, (B) a hindered amine light stabilizer, and (C) an ultraviolet absorber. The feature of the present invention is melt compounding a part of raw materials to obtain a pre-mixture at Step 1, and melt compounding the pre-mixture and the rest of the raw materials at Step 2. A polyphenylene ether composition which has a good light-discoloration resistance and causes little unmelted portion, and to a molded article formed from the polyphenylene ether composition can be obtained according to the production process of the present invention.
摘要:
A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.
摘要:
The present invention relates to a production process of polyphenylene ether composition comprising (A-1) a polyphenylene ether, (A-2) a polystyrene, (A-3) an ester phosphate, (B) a hindered amine light stabilizer, and (C) an ultraviolet absorber. The feature of the present invention is melt compounding a part of raw materials to obtain a pre-mixture at Step 1, and melt compounding the pre-mixture and the rest of the raw materials at Step 2. A polyphenylene ether composition which has a good light-discoloration resistance and causes little unmelted portion, and to a molded article formed from the polyphenylene ether composition can be obtained according to the production process of the present invention.