公开(公告)号：US11836028B2

公开(公告)日：2023-12-05

申请号：US17153583

申请日：2021-01-20

申请人： DELL PRODUCTS, LP

发明人： Hasnain Shabbir ,  Carlos Henry

IPC分类号： G06F1/32 ,  G06F1/20 ,  G06F11/30 ,  G06F1/3225

CPC分类号： G06F1/3225 ,  G06F1/206 ,  G06F11/3037 ,  G06F11/3062

摘要： An information handling system includes a management controller configured to determine whether to initiate control of power consumption of a memory subsystem of the information handling system. A closed-loop memory thermal controller may receive temperature values to determine a temperature setpoint for the memory subsystem, and calculate an error value that is a difference between the temperature setpoint and a temperature measurement. If the error value is within a temperature margin, then the thermal controller may determine a proportional-integral power signal based on the temperature margin and the temperature measurement; and determine a proportional-integral gain based on a maximum rate of change of the temperature measurement between polling events of the temperature measurement and a polling rate of the temperature measurement. The thermal controller may also determine a modified proportional-integral power signal based on the proportional-integral gain, wherein the modified proportional-integral power signal is used to determine a power adjustment value of the memory subsystem; and in response to an initiation from the management controller to control the power consumption of the memory subsystem, control the power consumption of the memory subsystem based on the power adjustment value.

公开(公告)号：US11836023B2

公开(公告)日：2023-12-05

申请号：US17689636

申请日：2022-03-08

申请人： Dell Products L.P.

发明人： Pei-Yi Chou ,  Chien-Yi Juan ,  Che-Ling Huang ,  Adolfo Montero ,  William Leara

IPC分类号： G06F1/20 ,  G05B15/02

CPC分类号： G06F1/206 ,  G05B15/02 ,  G06F2200/201

摘要： An information handling system uses one connector for both liquid and air cooling and detects the type of cooling system installed. That provides the ability to choose the correct thermal handling table based on the installed cooling system. To detect the type of cooling system installed, a thermal management controller sets a control signal supplied to the cooling system through the connector to a first control value and determines if a tachometer signal supplied by the cooling system to the thermal management controller through the connector indicates a first type of cooling system. If the first type of cooling system is not detected, the thermal management controller checks if the tachometer signal from the cooling system with the control signal set at the first control value, or alternatively at a second control value, indicates a second type of cooling system. If no cooling system is detected, an error condition exists.

公开(公告)号：US20230376221A1

公开(公告)日：2023-11-23

申请号：US17746571

申请日：2022-05-17

申请人： Western Digital Technologies, Inc.

发明人： Cono J. Sammarco ,  Gurjit Chadha

IPC分类号： G06F3/06 ,  G06F1/20

CPC分类号： G06F3/0625 ,  G06F3/0653 ,  G06F3/0659 ,  G06F3/0673 ,  G06F1/206

摘要： Various devices, such as storage devices or storage systems are configured to recycle heat generated during normal operation. This recycled heat can be captured and converted into electricity that can be stored for later discharge and use in cooling the storage devices. The recycling can be done through a variety of energy recycling modules that can be placed on various components within a storage device. These energy recycling modules can be a series of semiconductors that utilize various natural effects to convert heat applied on one side of the module into electricity that can be delivered to various power storing components or used in other areas of the storage device or system. These energy recycling modules can include versions that act as a cooler that can work to accelerate cooling of the storage device upon completion of a period of high usage, thereby reducing cooling costs and increasing device lifespans.

公开(公告)号：US20230376094A1

公开(公告)日：2023-11-23

申请号：US18229631

申请日：2023-08-02

申请人： Samsung Electronics Co., Ltd.

发明人： Zhan Ping

IPC分类号： G06F1/20 ,  H05K7/20 ,  G11B33/14

CPC分类号： G06F1/206 ,  H05K7/20209 ,  H05K7/20836 ,  G11B33/142

摘要： A storage system with temperature control. The system includes a plurality of storage devices such as solid state drives, a system controller such as a baseboard management controller, and one or more cooling fans. Each storage devices includes a controller configured to estimate the heat load in the storage device and/or an effective temperature, resulting from operations performed in the storage device. The system controller employs active disturbance rejection control to adjust the fan speed based on the estimated heat loads, the estimated temperatures, and/or the sensed internal temperatures, of the storage devices.

公开(公告)号：US11822410B2

公开(公告)日：2023-11-21

申请号：US17732792

申请日：2022-04-29

申请人： Intel Corporation

发明人： Rajashree Baskaran ,  Maruti Gupta Hyde ,  Min Suet Lim ,  Van Le ,  Hebatallah Saadeldeen

IPC分类号： G06F1/3203 ,  G06F1/3234 ,  H01L25/16 ,  G06N3/063 ,  H01L25/065 ,  G06F1/20 ,  H01L25/18 ,  G06N3/08 ,  G06N3/044

CPC分类号： G06F1/3203 ,  G06F1/206 ,  G06F1/3243 ,  G06F1/3275 ,  G06N3/063 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/18 ,  G06N3/044 ,  G06N3/08

摘要： Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example integrated circuit (IC) package includes a computer processor unit (CPU) die, a memory die, inference engine circuitry within the CPU die, the inference engine circuitry to infer, based on a first machine learning model, a workload for at least one of the CPU die or the memory die, and power management engine circuitry within the CPU die, the power management engine circuitry distinct from the inference engine circuitry, the power management engine circuitry to adjust, based on a second machine learning model different than the first machine learning model, operational parameters associated with the at least one of the CPU die or the memory die, the inferred workload to be an input to the second machine learning model.

公开(公告)号：US20230367435A1

公开(公告)日：2023-11-16

申请号：US18357543

申请日：2023-07-24

申请人： Wacom Co., Ltd.

发明人： Jun KADOWAKI

IPC分类号： G06F3/044 ,  G06F3/041 ,  G06F3/0354 ,  G06F1/20

CPC分类号： G06F3/0446 ,  G06F3/04166 ,  G06F3/03547 ,  G06F3/0412 ,  G06F1/206 ,  G06F2203/04112 ,  G06F3/04182

摘要： Electronic equipment includes a touch sensor including a plurality of electrodes arranged in a plane shape and separated from each other in an array direction, a differential amplifier that amplifies a difference between a positive-side signal and a negative-side signal selectively output from the plurality of electrodes and that outputs the difference, a position detection unit that detects a touch position in a sensor area that is formed by the touch sensor, based on an output signal from the differential amplifier, and a conductive part that is a part made of a conductive material or contains a conductive material and that is arranged to partially overlap the sensor area in plan view. The conductive part is arranged such that an outermost end point thereof in the array direction is positioned on one of the plurality of electrodes.

公开(公告)号：US20230363105A1

公开(公告)日：2023-11-09

申请号：US18354561

申请日：2023-07-18

申请人： TUSIMPLE, INC.

发明人： Kaixin ZHENG ,  Xiaoling HAN ,  Zehua HUANG ,  Todd SKINNER

IPC分类号： H05K7/20 ,  G05D1/00 ,  B60R16/03 ,  B60R16/023 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3287

CPC分类号： H05K7/202 ,  G05D1/0088 ,  H05K7/20863 ,  H05K7/20381 ,  B60R16/03 ,  H05K7/20881 ,  B60R16/0231 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/3287 ,  G05D2201/0213 ,  Y02D10/00

摘要： Techniques are described for managing temperature in an autonomous vehicle. An exemplary method comprises performing autonomous driving operations that operate the autonomous vehicle in an autonomous mode, receiving one or more messages from a temperature sensor associated with an electrical device located on or in the autonomous vehicle while the autonomous vehicle is operated in the autonomous mode, determining a cooling technique to reduce the temperature of electrical device, and performing the cooling technique.

公开(公告)号：US11812590B2

公开(公告)日：2023-11-07

申请号：US17457468

申请日：2021-12-03

申请人： SCHNEIDER ELECTRIC IT CORPORATION

发明人： James William VanGilder ,  Michael B. Condor

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20836 ,  G06F1/206 ,  H05K7/20745

摘要： According to at least one aspect of the present disclosure, an information-technology-design system is provided comprising at least one processor coupled to at least one memory, wherein the at least one processor is configured to receive information-technology-device information indicative of a plurality of information-technology devices in a space, the information-technology-device information including information-technology-device-location information, temperature information, and capture-index information, determine, based on the information-technology-device information, a containment type of the plurality of information-technology devices, select, based on the containment type, at least a portion of the capture-index information, determine, based on the information-technology-device-location information, the temperature information, and the at least the portion of the capture-index information, a respective cooling-performance assessment for each information-technology device of the plurality of information-technology devices, and display an indicator of the respective cooling-performance assessment for each information-technology device of the plurality of information-technology devices in the space.

公开(公告)号：US11809246B2

公开(公告)日：2023-11-07

申请号：US16938677

申请日：2020-07-24

申请人： Dell Products L.P.

发明人： Steven Embleton ,  Jon Taylor Fitch ,  Sandor T. Farkas ,  Joseph Danny King

IPC分类号： G06F1/20 ,  G05B19/042 ,  H05K7/20 ,  G01N17/04

CPC分类号： G06F1/206 ,  G05B19/0428 ,  H05K7/20309 ,  H05K7/20381 ,  G01N17/04 ,  G05B2219/24015

摘要： A computing device of an information handling system includes a hardware component. The hardware component is also connected to a trace. The computing device also includes a corrosion management component that is physically connected to the trace. The corrosion management component reduces a rate of corrosion of the trace due to an ambient environment in which the trace resides. The corrosion management component reduces the rate of corrosion by applying an electrical potential to the trace.

公开(公告)号：US20230350472A1

公开(公告)日：2023-11-02

申请号：US18346394

申请日：2023-07-03

申请人： Samsung Electronics Co., Ltd.

发明人： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Seunghoon KANG ,  Boram KIM ,  Hongki MOON ,  Yoonsun PARK ,  Kyungwoo LEE ,  Seungjoo LEE ,  Jonghoon LIM

IPC分类号： G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC分类号： G06F1/203 ,  H01L23/427 ,  G06F1/206 ,  G06F1/1637

摘要： Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.