Abstract:
A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
Abstract:
This invention describes improved apparatus and methods for spin-on deposition of semiconductor thin films. The improved apparatus provides for controlled temperature, pressure and gas compositions within the deposition chamber. The improved methods comprise dispensing of solutions containing thin film precursor via a moveable dispensing device and the careful regulation of the pattern of deposition of the precursor solution onto the wafer. The invention also comprises the careful regulation of deposition variables including dispensation time, wafer rpm, stop time and rates of wafer rotation. In one embodiment, the precursor solution is dispensed from the outer edge of the wafer toward the center. In alternative embodiments, processors regulate the movement of the dispensing arm and the precursor pump to provide an evenly dispensed layer of precursor solution. The invention also describes improved methods for evaporating solvents and curing thin films. The methods of this invention enable the production of spin-on thin films, which have more even film thickness and uniformity. The semiconductor thin films produced by the methods of this invention are useful for the manufacture of semiconductor devices comprising interlevel dielectric materials.
Abstract:
The present invention is related to methods and compositions for marking and removing turf lines and other markings from artificial and natural turf, including sports fields. The marking compositions include alkali-activatible acrylics, including one or both of alkali-soluble resin and an alkali-swellable thickener to enable removing the dried composition with an alkaline solution.
Abstract:
A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.
Abstract:
In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.
Abstract:
The invention relates to a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a seal (14). A natural flow of the liquid metal from the surface of the liquid seal is set up in an overflow compartment (25) made in the said duct (13) and having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartment (25) is maintained at a level below the surface of the liquid seal (14). The invention also relates to a plant for implementing the process.
Abstract:
To provide a thin-film forming device and a thin-film forming method, a liquid crystal display and a device and method for manufacturing the same, and a thin-film structure and a device and method for manufacturing the same, in which material losses are reduced by using a droplet ejection head, and in addition, the thickness of the entire film can be made uniform. The invention can include a thin-film forming device that is a device for forming a thin film by applying a coating solution onto a substrate, the coating solution containing a solvent and a film-forming material dissolved or dispersed therein. Also an ejection mechanism having a droplet ejection head for ejecting the coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a control unit for controlling at least one of the ejection mechanism and the moving mechanism can be provided for the thin-film forming device. In addition, a solvent vapor supply mechanism for supplying the solvent vapor to the vicinity of the coating solution applied onto the substrate can also be provided for the thin-film forming device.
Abstract:
Gas wiping apparatus and method can reliably prevent edge overcoat and splash, and has face gas wiping nozzles extending widthwise of a strip material, a pair of baffle plates spaced from an edge of the strip material, an edge wiping nozzle disposed between baffle plates at its inner edge and adjacent the strip material edge, all with critical spacings relative to each other.
Abstract:
Described are dispensing apparatuses and methods of their use, the dispensing apparatuses having one or more process chamber inside of a control chamber, and the volume of the process chamber increases or decreases by adding or removing control fluid from the control chamber, with proper valving, to cause fluid to flow into and out of the process chamber, for use in dispensing fluid, especially in precise amounts.
Abstract:
A squeegee unit comprises a paste pressurizing slope and a squeegee. The paste pressurizing slope is inclined at an angle narrower than 90null to a surface of a screen mask in a printing direction. As solder paste is pressurized by means of the paste pressurizing slope, the solder paste is filled into a mask hole. The squeegee has a paste scraping surface for scraping off the solder paste on the screen mask. The paste scraping surface extends at an angle of 90null or more to the surface of the screen mask in the printing direction.