Coating film forming apparatus and coating unit
    71.
    发明申请
    Coating film forming apparatus and coating unit 有权
    涂膜成膜装置和涂装单元

    公开(公告)号:US20010003964A1

    公开(公告)日:2001-06-21

    申请号:US09734877

    申请日:2000-12-13

    CPC classification number: H01L21/6715 G03F7/162 Y10S134/902

    Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

    Abstract translation: 一种涂膜形成装置,用于通过将涂布溶液涂布到基底上来形成膜,该基材设置有盒部,涂布单元,显影单元,预处理/后处理单元和用于在基板之间转移基板的主臂 各单位。 在涂布单元中,设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴,以单行程的方式将抗蚀剂施加在基板上的涂布部分,并且设置为 减压干燥部分,用于在施加后在减压下干燥基板,并且还提供了用于去除附着到基板周边的涂膜的设备。 此外,当将减压干燥部配置在涂布单元的外侧时,主臂被盖覆盖,使其内部处于溶剂气氛下。

    APPARATUS FOR MANUFACTURING PLANAR SPIN-ON FILMS
    72.
    发明申请
    APPARATUS FOR MANUFACTURING PLANAR SPIN-ON FILMS 有权
    制造平面旋转薄膜的装置

    公开(公告)号:US20010001407A1

    公开(公告)日:2001-05-24

    申请号:US09190721

    申请日:1998-11-12

    CPC classification number: H01L21/76801 G03F7/16 H01L21/6715

    Abstract: This invention describes improved apparatus and methods for spin-on deposition of semiconductor thin films. The improved apparatus provides for controlled temperature, pressure and gas compositions within the deposition chamber. The improved methods comprise dispensing of solutions containing thin film precursor via a moveable dispensing device and the careful regulation of the pattern of deposition of the precursor solution onto the wafer. The invention also comprises the careful regulation of deposition variables including dispensation time, wafer rpm, stop time and rates of wafer rotation. In one embodiment, the precursor solution is dispensed from the outer edge of the wafer toward the center. In alternative embodiments, processors regulate the movement of the dispensing arm and the precursor pump to provide an evenly dispensed layer of precursor solution. The invention also describes improved methods for evaporating solvents and curing thin films. The methods of this invention enable the production of spin-on thin films, which have more even film thickness and uniformity. The semiconductor thin films produced by the methods of this invention are useful for the manufacture of semiconductor devices comprising interlevel dielectric materials.

    Abstract translation: 本发明描述了用于半导体薄膜的旋涂沉积的改进的装置和方法。 改进的装置提供沉积室内的受控温度,压力和气体组成。 改进的方法包括通过可移动的分配装置分配含有薄膜前体的溶液,以及仔细调节前体溶液沉积在晶片上的图案。 本发明还包括仔细调节沉积变量,包括分配时间,晶片转速,停止时间和晶片旋转速率。 在一个实施方案中,前体溶液从晶片的外边缘向中心分配。 在替代实施例中,处理器调节分配臂和前驱泵的运动,以提供均匀分配的前体溶液层。 本发明还描述了用于蒸发溶剂和固化薄膜的改进方法。 本发明的方法能够生产具有更均匀的膜厚度和均匀性的旋涂薄膜。 通过本发明的方法生产的半导体薄膜可用于制造包括层间电介质材料的半导体器件。

    Marking and removing turf lines method and composition
    73.
    发明申请
    Marking and removing turf lines method and composition 有权
    标记和除草草线的方法和组成

    公开(公告)号:US20040213926A1

    公开(公告)日:2004-10-28

    申请号:US10424548

    申请日:2003-04-25

    CPC classification number: C09D5/008 Y10T156/1111 Y10T156/1184

    Abstract: The present invention is related to methods and compositions for marking and removing turf lines and other markings from artificial and natural turf, including sports fields. The marking compositions include alkali-activatible acrylics, including one or both of alkali-soluble resin and an alkali-swellable thickener to enable removing the dried composition with an alkaline solution.

    Abstract translation: 本发明涉及用于标记和去除人造和天然草皮(包括运动场)的草皮线和其它标记的方法和组合物。 标记组合物包括碱活性丙烯酸类,包括碱溶性树脂和碱溶胀性增稠剂中的一种或两种,以使碱性溶液除去干燥的组合物。

    Liquid processing apparatus and liquid processing method
    75.
    发明申请
    Liquid processing apparatus and liquid processing method 有权
    液体处理装置和液体处理方法

    公开(公告)号:US20040180142A1

    公开(公告)日:2004-09-16

    申请号:US10796179

    申请日:2004-03-10

    Abstract: In a liquid processing apparatus for forming a coating film on a polygonal substrate by spin coating in an ambient with a descending clean air flow, a spin chuck includes a support plate for substantially horizontally supporting the substrate thereon. Air flow control members are provided on the spin chuck such that the air flow control member being disposed adjacent to a periphery of the polygonal substrate supported on the spin chuck, wherein the air flow control member is not provided near corner portions of the substrate supported on the spin chuck. The liquid processing apparatus may includes an air flow regulation ring which is provided with an air inlet having an opening surrounding an outer periphery of the air flow control member, wherein the air inlet communicates with the exhaust unit.

    Abstract translation: 在用于通过在下降的清洁空气流中在环境中旋涂在多边形基板上形成涂膜的液体处理装置中,旋转卡盘包括用于在其上大致水平地支撑基板的支撑板。 空气流量控制构件设置在旋转卡盘上,使得气流控制构件邻近支撑在旋转卡盘上的多边形基板的周边设置,其中气流控制构件不设置在支撑在基座上的基板的拐角部分附近 旋转卡盘。 液体处理装置可以包括气流调节环,该气流调节环设置有具有围绕空气流量控制构件的外周的开口的空气入口,其中空气入口与排气单元连通。

    Method and installation for dip coating of a metal strip
    76.
    发明申请
    Method and installation for dip coating of a metal strip 有权
    金属条的浸涂方法和安装

    公开(公告)号:US20040052958A1

    公开(公告)日:2004-03-18

    申请号:US10416192

    申请日:2003-10-21

    CPC classification number: C23C2/40 C23C2/003

    Abstract: The invention relates to a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a seal (14). A natural flow of the liquid metal from the surface of the liquid seal is set up in an overflow compartment (25) made in the said duct (13) and having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartment (25) is maintained at a level below the surface of the liquid seal (14). The invention also relates to a plant for implementing the process.

    Abstract translation: 本发明涉及一种用于在包含液态金属浴(12)的罐(11)中连续浸涂金属条(1)的方法,其中使金属条(1)连续地通过一 管道(13),其下部(13a)浸没在液体金属浴(12)中,以便与所述槽的表面限定密封件(14)。 来自液体密封件表面的液体金属的自然流动被设置在在所述管道(13)中制成的溢流室(25)中,并且具有在其下部部分延伸管道(13)的内壁, 所述隔室(25)中的液态金属的水平面保持在液体密封(14)的表面以下。 本发明还涉及一种用于实施该方法的设备。

    Thin film structure, device and method for manufacturing the same
    77.
    发明申请
    Thin film structure, device and method for manufacturing the same 失效
    薄膜结构,其制造方法及其制造方法

    公开(公告)号:US20030159651A1

    公开(公告)日:2003-08-28

    申请号:US10365537

    申请日:2003-02-13

    Inventor: Kazuaki Sakurada

    Abstract: To provide a thin-film forming device and a thin-film forming method, a liquid crystal display and a device and method for manufacturing the same, and a thin-film structure and a device and method for manufacturing the same, in which material losses are reduced by using a droplet ejection head, and in addition, the thickness of the entire film can be made uniform. The invention can include a thin-film forming device that is a device for forming a thin film by applying a coating solution onto a substrate, the coating solution containing a solvent and a film-forming material dissolved or dispersed therein. Also an ejection mechanism having a droplet ejection head for ejecting the coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a control unit for controlling at least one of the ejection mechanism and the moving mechanism can be provided for the thin-film forming device. In addition, a solvent vapor supply mechanism for supplying the solvent vapor to the vicinity of the coating solution applied onto the substrate can also be provided for the thin-film forming device.

    Abstract translation: 为了提供薄膜形成装置和薄膜形成方法,液晶显示器及其制造方法及其制造方法,以及薄膜结构及其制造方法,其中材料损耗 通过使用液滴喷射头来减少,并且还可以使整个膜的厚度均匀。 本发明可以包括薄膜形成装置,其是通过将涂布溶液涂布在基材上而形成薄膜的装置,所述涂布溶液含有溶解或分散在其中的成膜材料。 另外,具有用于将涂布液喷射到基板上的液滴喷射头的喷射机构,能够相对移动液滴喷射头和基板的位置的移动机构,以及用于控制喷射机构和/ 可以为薄膜形成装置提供移动机构。 此外,也可以为薄膜形成装置提供用于将溶剂蒸气供给到涂布在基板上的涂布溶液附近的溶剂蒸气供给机构。

    Gas wiping apparatus and method
    78.
    发明申请
    Gas wiping apparatus and method 有权
    气体擦拭装置及方法

    公开(公告)号:US20030129313A1

    公开(公告)日:2003-07-10

    申请号:US10377529

    申请日:2003-02-28

    CPC classification number: C23C2/20

    Abstract: Gas wiping apparatus and method can reliably prevent edge overcoat and splash, and has face gas wiping nozzles extending widthwise of a strip material, a pair of baffle plates spaced from an edge of the strip material, an edge wiping nozzle disposed between baffle plates at its inner edge and adjacent the strip material edge, all with critical spacings relative to each other.

    Abstract translation: 气体擦拭装置和方法可以可靠地防止边缘外涂层和飞溅,并且具有沿条带材料宽度方向延伸的面部气体擦拭喷嘴,与条带材料的边缘间隔开的一对挡板,设置在其挡板之间的边缘擦拭喷嘴 内缘并且邻近带材材料边缘,全部具有相对于彼此的临界间隔。

    Dispensing apparatus
    79.
    发明申请
    Dispensing apparatus 失效
    点胶装置

    公开(公告)号:US20030075555A1

    公开(公告)日:2003-04-24

    申请号:US10255370

    申请日:2002-09-26

    Inventor: Kader Mekias

    CPC classification number: B67D7/02 F04B43/10 Y10T137/3631

    Abstract: Described are dispensing apparatuses and methods of their use, the dispensing apparatuses having one or more process chamber inside of a control chamber, and the volume of the process chamber increases or decreases by adding or removing control fluid from the control chamber, with proper valving, to cause fluid to flow into and out of the process chamber, for use in dispensing fluid, especially in precise amounts.

    Abstract translation: 描述了分配装置及其使用方法,分配装置在控制室内部具有一个或多个处理室,并且通过用适当的阀门从控制室中添加或除去控制流体来增加或减少处理室的体积, 使流体流入和流出处理室,用于分配流体,特别是精确量的流体。

    Squeegee unit and solder-paste printing machine
    80.
    发明申请
    Squeegee unit and solder-paste printing machine 审中-公开
    刮胶单元和焊膏印刷机

    公开(公告)号:US20020166505A1

    公开(公告)日:2002-11-14

    申请号:US10186457

    申请日:2002-06-28

    CPC classification number: B41F15/46 H05K3/1233 H05K2203/0139

    Abstract: A squeegee unit comprises a paste pressurizing slope and a squeegee. The paste pressurizing slope is inclined at an angle narrower than 90null to a surface of a screen mask in a printing direction. As solder paste is pressurized by means of the paste pressurizing slope, the solder paste is filled into a mask hole. The squeegee has a paste scraping surface for scraping off the solder paste on the screen mask. The paste scraping surface extends at an angle of 90null or more to the surface of the screen mask in the printing direction.

    Abstract translation: 刮板单元包括糊状加压斜面和刮板。 膏状加压斜面在与打印方向相对于筛网掩模的表面成90°以上的角度倾斜。 当焊膏通过糊料加压斜坡加压时,将焊膏填充到掩模孔中。 刮刀具有用于刮除屏幕上的焊膏的糊状刮削表面。 糊状刮削面在打印方向上与屏幕掩模的表面成90度以上的角度延伸。

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