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公开(公告)号：US09714905B1
公开(公告)日：2017-07-25
申请号：US14311270
申请日：2014-06-21
发明人： Martin Plihal , Deepak Gupta , Vidyasagar Anantha , Premkumar Vijayaraman , Lakshman Deenadayalan
IPC分类号： G01N21/95
CPC分类号： G05B19/41875 , G01N21/956 , G05B2219/37224 , H01L22/12 , H01L22/20 , Y02P90/20 , Y02P90/22
摘要： Methods and systems for setting up a wafer inspection recipe are provided. Inspection results produced by complete wafer inspection recipe candidates, each of which includes one or more optical mode candidates with at least one set of defect detection parameters, are compared to determine which of the complete wafer inspection recipe candidates is the best for use as the wafer inspection recipe. The method does not involve making any decisions regarding performance of the complete wafer inspection recipe candidates until after the inspection results have been compared. In other words, the method does not involve selecting optical mode(s) that will be used in the wafer inspection recipe followed by selecting the defect detection parameters for the selected optical mode(s). In this manner, a greater number of optical mode and defect detection parameters can be considered in an efficient manner to determine the best wafer inspection recipe for any given wafer.
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82.发明授权公开(公告)号：US09710903B2
公开(公告)日：2017-07-18
申请号：US12997855
申请日：2009-06-05
IPC分类号： G06F17/50 , H01L21/66 , G06T7/00 , G03F7/20 , G01N21/956
CPC分类号： G06T7/0006 , G01N21/956 , G03F7/705 , G06F17/5081 , G06T2207/10061 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided. One system is configured to detect design defects and process defects at locations on a wafer at which images are acquired by an electron beam review subsystem based on defects in a design, additional defects in the design, which are detected by comparing an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database, and defects detected on the wafer by a wafer inspection system.
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公开(公告)号：US09704234B2
公开(公告)日：2017-07-11
申请号：US14450170
申请日：2014-08-01
发明人： Junqing Huang , Hucheng Lee , Kenong Wu , Lisheng Gao
CPC分类号： G06T7/0008 , G06T7/0006 , G06T7/90 , G06T2207/10024 , G06T2207/20024 , G06T2207/20076 , G06T2207/30148
摘要： Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
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公开(公告)号：US09702827B1
公开(公告)日：2017-07-11
申请号：US14946604
申请日：2015-11-19
发明人： Bjorn Brauer , Ravikumar Sanapala
CPC分类号： G01N21/8851 , G01N21/9501 , G01N2201/11
摘要： Methods and systems for selecting one or more modes of an inspection subsystem or system for inspection of a specimen are provided. The systems described herein are configured to acquire output for all of the modes to be considered at a location of a known defect on the specimen by aligning output, which is generated at the location with a mode known to generate output in which patterned features on the specimen are resolved to a degree that allows the output to be aligned to design data, with the design data for the specimen to identify the location with substantially high accuracy and then without moving the field of view of the inspection subsystem or system from that location, acquiring the output for all other modes. All of the acquired output can then be used to select mode(s) for inspection of the specimen or another specimen of the same type.
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公开(公告)号：US09478019B2
公开(公告)日：2016-10-25
申请号：US14702336
申请日：2015-05-01
发明人： Abdurrahman Sezginer , Rui-fang Shi
IPC分类号： G06T7/00 , G01N21/88 , G01N21/956 , G01N21/95
CPC分类号： G06T7/00 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N21/95607 , G01N2021/8887 , G01N2021/95676 , G01N2201/06113 , G01N2201/10 , G01N2201/12 , G06T7/0008 , G06T7/001 , G06T2207/10056 , G06T2207/30148
摘要： Systems and methods for detecting defects on a reticle are provided. The embodiments include generating and/or using a data structure that includes pairs of predetermined segments of a reticle pattern and corresponding near-field data. The near-field data for the predetermined segments may be determined by regression based on actual image(s) of a reticle generated by a detector of a reticle inspection system. Inspecting a reticle may then include separately comparing two or more segments of a pattern included in an inspection area on the reticle to the predetermined segments and assigning near-field data to at least one of the segments based on the predetermined segment to which it is most similar. The assigned near-field data can then be used to simulate an image that would be formed for the reticle by the detector, which can be compared to an actual image generated by the detector for defect detection.
摘要翻译： 提供了用于检测掩模版上的缺陷的系统和方法。 实施例包括生成和/或使用包括标线图案的预定片段对和对应的近场数据的数据结构。 用于预定段的近场数据可以通过基于由掩模版检查系统的检测器产生的掩模版的实际图像的回归来确定。 然后检查掩模版可以包括单独地将掩模版上的检查区域中包括的图案的两个或多个段与预定的段进行比较，并且基于其最大的预定段将近场数据分配给至少一个段 类似。 所分配的近场数据然后可以用于模拟由检测器为掩模版形成的图像，其可以与由检测器生成的用于缺陷检测的实际图像进行比较。
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公开(公告)号：US09442077B2
公开(公告)日：2016-09-13
申请号：US14468237
申请日：2014-08-25
发明人： Junqing Huang , Huan Jin , Grace Hsiu-Ling Chen , Lisheng Gao
CPC分类号： G01N21/9501 , G06T5/002 , G06T2207/20061 , G06T2207/30148
摘要： Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.
摘要翻译： 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。
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公开(公告)号：US09401016B2
公开(公告)日：2016-07-26
申请号：US14707592
申请日：2015-05-08
发明人： Ashok V. Kulkarni
CPC分类号： G06T7/001 , G01B21/16 , G01N21/8806 , G01N21/8851 , G01N21/9501 , G01N23/2251 , G01N2021/8825 , G01N2021/8887 , G01N2201/10 , G01N2201/12 , G01N2223/6116 , G06F17/5045 , G06T7/60 , G06T7/74 , G06T2207/30148 , H01L21/67288 , H01L22/12
摘要： Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.
摘要翻译： 提供了用于确定检查数据相对于存储的高分辨率管芯图像的位置的方法和系统。 一种方法包括将通过检查系统获取的数据对准用于晶片上的对准位置的数据与用于预定对准位置的数据。 预定的对准位置在晶片的存储的高分辨率芯片图像的管芯图像空间中具有预定位置。 该方法还包括基于管芯图像空间中的预定对准位置的预定位置来确定管芯图像空间中的对准位置的位置。 此外，该方法包括基于管芯图像空间中的对准位置的位置来确定由管芯图像空间中的检查系统为晶片获取的检查数据的位置。
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88.发明授权Data perturbation for wafer inspection or metrology setup using a model of a difference 有权使用差异模型进行晶圆检测或计量设置的数据扰动公开(公告)号：US09360863B2
公开(公告)日：2016-06-07
申请号：US13258441
申请日：2011-06-09
申请人： Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
发明人： Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
IPC分类号： G06F17/50 , G05B19/418
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/45031 , Y02P90/22
摘要： Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
摘要翻译： 提供了用于确定晶片检查和/或度量的参数的各种实施例。
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公开(公告)号：US09355208B2
公开(公告)日：2016-05-31
申请号：US14321565
申请日：2014-07-01
发明人： Eugene Shifrin , Ashok Kulkarni , Kris Bhaskar , Graham Michael Lynch , John Raymond Jordan, III , Chwen-Jiann Fang
CPC分类号： G06F17/5081 , G01N21/9501 , G06F17/5045 , H01L22/12
摘要： Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.
摘要翻译： 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括在晶片的设计中确定弱几何的所有实例的位置。 这些位置包括随机，不定期的位置。 弱几何包括与设计中的其他特征相比更容易出现缺陷的一个或多个特征。 该方法还包括用晶片检查系统扫描晶片，从而通过晶片检查系统的一个或多个检测器产生用于晶片的输出。 此外，该方法包括基于在晶片上的单个管芯中的弱几何形状的两个或多个实例处产生的输出来检测弱几何形状的至少一个实例中的缺陷。
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公开(公告)号：US09311698B2
公开(公告)日：2016-04-12
申请号：US13737677
申请日：2013-01-09
发明人： Xing Chu , Jan A. Lauber , J. Rex Runyon
CPC分类号： G06T7/0004 , G06T2207/20012 , G06T2207/30148 , H01L22/12 , H01L22/20
摘要： Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.
摘要翻译： 提供了用于检测晶片上的缺陷的各种实施例。 一些实施例包括使至少一些像素与具有不同特征的设备中的区域相关联的模板图像匹配到电子束检查系统的输出并且将缺陷检测参数应用于输出中的像素，基于像素 在输出端位于其内，从而检测晶片上的缺陷。
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