公开(公告)号：US20110113945A1

公开(公告)日：2011-05-19

申请号：US12930878

申请日：2011-01-19

申请人： Kazuya Maekawa ,  Haruo Wakayama

发明人： Kazuya Maekawa ,  Haruo Wakayama

IPC分类号： B26D3/08

CPC分类号： B28D1/225 ,  C03B33/033 ,  C03B33/07 ,  C03B33/107 ,  Y10T29/49 ,  Y10T83/0385 ,  Y10T83/9403 ,  Y10T225/12 ,  Y10T225/321

摘要： A scribing wheel for a brittle material includes a circumferential ridge line in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridge line. The protrusion are portions of the ridge line remaining after the ridge line is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.

摘要翻译： 用于脆性材料的划线轮包括周向脊线，其中两个截锥体具有连接的底部以共享旋转轴线。 交替的凹口和突起沿着圆周脊线形成。 突出部是在脊线被切口后残留的脊线的部分。 凹口的长度小于突起的长度，从而在降低高穿透性的同时提高了表面上的卡扣。

公开(公告)号：US07931755B2

公开(公告)日：2011-04-26

申请号：US10583348

申请日：2004-12-16

申请人： Yoshitaka Nishio ,  Yukio Oshima

发明人： Yoshitaka Nishio ,  Yukio Oshima

IPC分类号： B08B5/00 ,  B08B5/02

CPC分类号： F26B21/004 ,  B08B5/023 ,  B08B5/04 ,  B08B5/043 ,  F26B5/14

摘要： In a method for removing deposit that has attached to a main surface of a substrate from the main surface of the substrate using air knife units where a slit portion is formed so that a fluid can be discharged in band form, a fluid introduction path having an approximately uniform form in the direction perpendicular to the direction in which a number of air knife units move relative to the substrate is formed between the air knife units and the main surface of the substrate while the air knife units move relative to the substrate, a fluid is discharged toward the fluid introduction path from a slit that is formed in the rear portion of the above described air knife units, and then, passes through the fluid introduction path so as to be led to a wall surface that is formed so as to face the front portion of the air knife units or the fluid which has the appearance of a wall surface, and furthermore, deposit on the substrate that has attached to the substrate is led away from the main surface of the substrate, together with said fluid, via a fluid lead-out path of which the cross sectional area of the low path is greater than that of the fluid introduction path, and which is formed between the air knife units and the wall surface.

摘要翻译： 在使用形成有狭缝部的空气刀单元从基板的主面剥离附着于基板的主面的沉积物的方法中，使得能够以带状排出流体的流体导入路径具有 在空气刀单元与基板的主表面之间，在垂直于多个气刀单元相对于基板移动的方向的方向上形成大致均匀的形状，同时气刀单元相对于基板移动，流体 从形成在上述气刀单元的后部的狭缝向流体导入路径排出，然后通过流体导入路径被引导到形成为面对的壁面 气刀单元的前部或具有壁面外观的流体，此外，沉积在附着于基板的基板上，从主要的壳体 衬底的所述表面与所述流体一起经由流体引出路径，低通道的横截面积大于流体引入路径的横截面积，并且其形成在气刀单元和壁表面之间 。

公开(公告)号：US20100326138A1

公开(公告)日：2010-12-30

申请号：US12827267

申请日：2010-06-30

申请人： Issei KUMATANI ,  Seiji SHIMIZU

发明人： Issei KUMATANI ,  Seiji SHIMIZU

IPC分类号： C03B23/00

CPC分类号： C03B33/0222 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/023 ,  C03B33/03

摘要： A processing device is configured to irradiate a laser beam onto a glass substrate for processing. The processing device has a work table, a laser beam output section, a multi-spot focus section, a rotation drive mechanism, an optical system, and a laser beam scan section. The multi-spot focus section receives a laser beam, and splits and focuses the laser beam inputted therein into a plurality of beam focus spots. The rotation drive mechanism rotates the plurality of beam focus spots about a single center axis that is arranged in a center of the plurality of beam focus spots. The optical system guides the laser beam to the multi-spot focus section. The laser beam scan section moves all the plurality of beam focus spots rotating about the single center axis in a desired direction within a predetermined range of a plane arranged along a surface of the glass substrate.

摘要翻译： 处理装置被配置为将激光束照射到玻璃基板上进行处理。 处理装置具有工作台，激光束输出部，多点聚焦部，旋转驱动机构，光学系统和激光束扫描部。 多点聚焦部分接收激光束，并将其中输入的激光束分裂并聚焦成多个光束聚焦点。 旋转驱动机构围绕布置在多个束聚焦点的中心的单个中心轴旋转多个束聚焦点。 光学系统将激光束引导到多点聚焦部分。 激光束扫描部分将沿着沿着玻璃基板的表面布置的平面的预定范围内的期望方向围绕单个中心轴线旋转的所有多个光束聚焦点移动。

公开(公告)号：US20100276404A1

公开(公告)日：2010-11-04

申请号：US12768317

申请日：2010-04-27

申请人： Kenji FUKUHARA ,  Seiji SHIMIZU ,  Kouji YAMAMOTO

发明人： Kenji FUKUHARA ,  Seiji SHIMIZU ,  Kouji YAMAMOTO

IPC分类号： B23K26/00

CPC分类号： B23K26/0624 ,  B23K26/40 ,  B23K2103/50

摘要： A laser machining method includes directing pulse laser light onto a surface of a brittle material substrate, and a laser light scanning step for scanning laser light along a scribe-scheduled line. The laser intensity of the pulse laser light is 1.0×108 W/cm2 or greater and 1.0×1010 W/cm2 or less. The value obtained by multiplying the amount of heat input (J/cm2) by the linear expansion coefficient (10−7/K) of the brittle material is in a range of 3000 or greater and 100000 or less. Furthermore, the number of pulses within a square circumscribing the condensed light diameter of the pulse laser light is two or greater.

摘要翻译： 激光加工方法包括将脉冲激光引导到脆性材料基板的表面上，以及激光扫描步骤，用于沿着刻划线扫描激光。 脉冲激光的激光强度为1.0×10 8 W / cm 2以上且1.0×10 10 W / cm 2以下。 通过将热输入量（J / cm 2）乘以脆性材料的线膨胀系数（10-7 / K）而获得的值在3000以上且100000以下的范围内。 而且，脉冲激光的聚光范围内的方波脉冲数是2个以上。

公开(公告)号：US07772522B2

公开(公告)日：2010-08-10

申请号：US10490323

申请日：2002-09-20

申请人： Masato Matsumoto ,  Tougo Gonoe

发明人： Masato Matsumoto ,  Tougo Gonoe

IPC分类号： B23K26/00

CPC分类号： C03B33/093 ,  B23K26/0604 ,  B23K26/0736 ,  B23K26/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011

摘要： A mother glass substrate is continuously heated by a first laser spot LS1 to a temperature which is lower than a softening point of the mother glass substrate, along a scribe line formation line SL on a surface of the mother glass substrate, along which a scribe line is to be formed, while an area close to the first laser spot LS1 is continuously cooled along the scribe line formation line SL; and an area which is close to the cooled area and is on an opposite side to the first laser spot LS1 is continuously heated by a second laser spot LS2 along the scribe line formation line SL to a temperature which is lower than the softening point of the mother glass substrate.

摘要翻译： 母玻璃基板通过第一激光光斑LS1沿着母玻璃基板的表面上的划线生成线SL连续加热到低于母玻璃基板的软化点的温度，沿着该玻璃基板 而沿着划线生成线SL连续冷却第一激光光点LS1附近的区域; 并且靠近冷却区域并且与第一激光光斑LS1相反的一侧的区域沿着划线生成线SL被第二激光光斑LS2连续地加热到低于第一激光光点LS1的软化点的温度 母玻璃基板。

公开(公告)号：US07717311B2

公开(公告)日：2010-05-18

申请号：US10535770

申请日：2003-11-19

申请人： Yoshitaka Nishio

发明人： Yoshitaka Nishio

IPC分类号： B26F3/00

CPC分类号： C03B33/107 ,  C03B33/023 ,  G02F1/133351 ,  Y10T83/0333 ,  Y10T225/12 ,  Y10T225/321

摘要： Vertical cracks Vm in the thickness direction of a mother glass substrate 10 are sequentially formed along lines to be scribed and broken, and thus main scribe lines MS are formed along the lines to be scribed and broken of the mother glass substrate 10. Then, subordinate scribe lines SS are formed along the main scribe lines MS which have been formed, at a predetermined distance from the main scribe lines MS. Thus, the mother glass substrate 10 is broken along the main scribe lines MS. In this manner, the substrate can be scribed and broken efficiently without requiring a complicated device or the like.

摘要翻译： 母玻璃基板10的厚度方向上的垂直裂纹Vm沿着划线断线顺序地形成，从而沿着母玻璃基板10的划线和断裂线形成主划线MS。然后，从属 沿着主划线MS形成刻划线SS，它们已经形成在离主划线MS一预定距离处。 因此，母玻璃基板10沿着主划线MS断开。 以这种方式，可以在不需要复杂的装置等的情况下有效地刻划和破坏基板。

公开(公告)号：US20100065599A1

公开(公告)日：2010-03-18

申请号：US11915894

申请日：2006-05-26

申请人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

发明人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

IPC分类号： B26F3/00 ,  B26D3/08 ,  B31B1/25

CPC分类号： C03B33/033 ,  B28D1/222 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B65G2249/04 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T225/30 ,  Y10T225/325

摘要： A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section (112, 122) for applying a pressing force in a vicinity of a scribe line S formed on a substrate G and cutting the pressed portion of the substrate G; and a holding section moving parallel to the scribe line S while holding the cutting section. The brittle material substrate cutting apparatus continuously cuts the substrate G along the scribe line S. The brittle material substrate cutting apparatus further includes: a cut-face separating section (113, 123), provided in the holding section, for holding and pressing at least one part of cut substrate portions of the substrate G, wherein the cut substrate portions are generated as a result of the cutting and they oppose each other, and moving cut faces of the cut substrate portions approximately parallel to a main face of the substrate G and in directions to separate the cut faces from each other.

摘要翻译： 提供了一种脆性材料基板切割方法和切割装置，其在连续切割脆性材料基板的断裂步骤中，在脆性材料基板的切割面彼此接触之后彼此接触，从而对脆性材料造成损坏或污染 可以防止由于接触引起的基板。 脆性材料基板切割装置包括：切割部分，用于在形成在基板G上的划线S附近施加按压力，并切割基板G的按压部分; 以及在保持切割部的同时平行于划线S移动的保持部。 脆性材料基板切断装置沿着切割线S连续地切断基板G.脆性材料基板切断装置还具备：切割面分离部（113,123），设置在保持部中，用于至少保持和按压 衬底G的切割衬底部分的一部分，其中由于切割而产生切割的衬底部分并且它们彼此相对，并且将切割的衬底部分的切割面大致平行于衬底G的主面移动;以及 在将切割面彼此分开的方向上。

公开(公告)号：USD586194S1

公开(公告)日：2009-02-10

申请号：US29297523

申请日：2007-11-13

申请人： Hirotake Haraguchi ,  Kazuya Maekawa

设计人： Hirotake Haraguchi ,  Kazuya Maekawa

公开(公告)号：US20080305615A1

公开(公告)日：2008-12-11

申请号：US11722355

申请日：2005-12-27

申请人： Tsutomu Ueno ,  Kenji Otoda ,  Koji Yamamoto

发明人： Tsutomu Ueno ,  Kenji Otoda ,  Koji Yamamoto

IPC分类号： H01L21/301 ,  B23K26/00

CPC分类号： H05K3/0052 ,  B23K26/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/0222 ,  C03B33/033 ,  C03B33/091 ,  C03B33/093 ,  H01L21/67092 ,  H01L21/67282 ,  H05K1/0306 ,  H05K3/0029 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  Y02P40/57

摘要： An object of the present invention is to provide a method of scribing and breaking a substrate made of a brittle material by which good-quality cutting surface of the substrate can be obtained without any defects such as chippings on the substrate.The method comprises (a) the first scribing step in the first direction by controlling the relative moving velocity and output power of the laser beam so that local volume shrinkage and local tensile stress can be generated in the vicinity of the formed first scribed line, (b) the second scribing step in the second direction of forming locally trigger cracks, which use tensile stress in the vicinity of the first scribed line and work as a starting point in the second direction, in the vicinity of the intersection of a scribed line in the first direction with a scribed line in the second direction, (c) the first breaking step of breaking the substrate along the first scribed line in the first direction, and (d) the second breaking step of breaking the substrate along the second scribed line in the second direction after the first breaking step and performing the breaking from the trigger that works as a starting point of breaking.

摘要翻译： 本发明的目的是提供一种划片和断裂由脆性材料制成的基材的方法，通过该方法可以获得基材的优质切割表面，而没有诸如基材上的切屑的任何缺陷。 该方法包括：（a）通过控制激光束的相对移动速度和输出功率在第一方向上的第一划刻步骤，使得可以在形成的第一划线附近产生局部体积收缩和局部拉伸应力（ b）形成局部触发裂纹的第二划线方向上的第二刻划步骤，其在第一划线附近使用拉伸应力，作为第二方向的起点，在与第 所述第一方向在所述第二方向上具有划线，（c）所述第一断裂步骤，沿着所述第一方向沿着所述第一划线切断所述基板;以及（d）所述第二断裂步骤，沿着所述第二划线切断所述基板 在第一断裂步骤之后的第二方向上，并且从作为断裂起点的触发器执行断开。

公开(公告)号：US20080135532A1

公开(公告)日：2008-06-12

申请号：US11587957

申请日：2005-04-27

申请人： Noboru Hasaka ,  Toru Kumagai ,  Koji Yamamoto

发明人： Noboru Hasaka ,  Toru Kumagai ,  Koji Yamamoto

IPC分类号： B23K26/14 ,  B23K26/02

CPC分类号： B23K26/0676 ,  B23K26/0604 ,  B23K26/0736 ,  B23K26/40 ,  B23K26/703 ,  B23K2103/50 ,  B23K2103/52 ,  B28D1/221 ,  C03B33/0207 ,  C03B33/093

摘要： The forming of a heated spot (10) by using a laser beam irradiated to a brittle substrate along a predetermined scribing line (S) and the ejecting of a cooling medium, after interruption of irradiation of laser beam, to impinge on the spot to thereby form a cooled spot (20) constitute a unit operation to be repeated. The cooled spot overlapping the heated spot (10) that has a longitudinal center line (b) crossing the scribing line (S) at a right angle serves to restore thermal equilibrium in and around the spots while forming unit cracks (n) continued one from another to form a linear crack (E,U) perpendicular to the brittle substrate surface.

摘要翻译： 通过使用沿着预定划线（S）照射到脆性基板的激光束并且在中断激光束照射之后喷射冷却介质来形成加热点（10）以冲击到该位置 形成冷却点（20）构成要重复的单元操作。 与直角交叉划线（S）的纵向中心线（b）的加热点（10）重叠的冷却点用于恢复斑点中和周围的热平衡，同时形成单元裂纹（n） 另一个形成垂直于脆性基底表面的线性裂纹（E，U）。