中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4258 records (took 0.036 seconds)

    Gas sensor
    81.
    发明授权
    Gas sensor 有权

    公开(公告)号：US11959877B2

    公开(公告)日：2024-04-16

    申请号：US17128361

    申请日：2020-12-21

    Applicant: NGK INSULATORS, LTD.

    Inventor： Yusuke Watanabe ,  Takayuki Sekiya

    IPC: G01N27/407 ,  G01N1/24 ,  G01N27/41 ,  G01N33/00 ,  G01R19/00

    CPC classification number: G01N27/41 ,  G01N1/24 ,  G01N27/4071 ,  G01N33/0006 ,  G01R19/0092

    Abstract: In a gas sensor, oxygen pumping control is performed to pump oxygen from the surroundings of an outer side pump electrode into the surroundings of a reference electrode. In addition, during execution of the oxygen pumping control, a pump current Ip2 is measured when oxygen originating from NOx is pumped out from the surroundings of a measurement electrode so that a voltage V2 reaches a target voltage V2*. Then, the NOx concentration of a measurement-object gas is calculated based on Ip2. In the gas sensor, the NOx concentration is corrected based on DVref which is the difference between Vref1 and Vref2, wherein Vref1 is the voltage across the reference electrode and the outer side pump electrode when the oxygen pumping control is not performed, and Vref2 is the voltage across the reference electrode and the outer side pump electrode when the oxygen pumping control is performed.

    Multi-zone heater
    83.
    发明授权
    Multi-zone heater 有权

    公开(公告)号：US11956863B2

    公开(公告)日：2024-04-09

    申请号：US17005745

    申请日：2020-08-28

    Applicant: NGK INSULATORS, LTD.

    Inventor： Yutaka Unno ,  Nobuyuki Kondou

    IPC: H05B3/26 ,  C23C16/46 ,  C23C16/50 ,  H01J37/32 ,  H05B1/02

    CPC classification number: H05B3/265 ,  C23C16/46 ,  C23C16/50 ,  H01J37/32522 ,  H01J2237/3321 ,  H05B1/0233 ,  H05B2203/002 ,  H05B2203/005 ,  H05B2203/016

    Abstract: A multi-zone heater includes an outer circumferential zone heater and first and second elemental wire portions. The outer circumferential zone heater is a coil that is provided in an outer circumferential zone of a ceramic substrate in the same plane as a plane in which a central zone heater is provided and that is routed throughout the outer circumferential zone in a unicursal manner from one end portion to the other end portion in the outer circumferential portion. The first elemental wire portion extends from a first terminal, passes through a central portion, is connected to the one end portion of the outer circumferential zone heater, and has a meandering shape in plan view. The second elemental wire portion extends from a second terminal, passes through the central portion, is connected to the other end portion of the outer circumferential zone heater, and has a meandering shape in plan view.

    HEAT TREATMENT SYSTEM
    87.
    发明公开
    HEAT TREATMENT SYSTEM 审中-公开

    公开(公告)号：US20240085111A1

    公开(公告)日：2024-03-14

    申请号：US18460780

    申请日：2023-09-05

    Applicant: NGK INSULATORS, LTD. ,  NGK KILNTECH, CORPORATION

    Inventor： Masashi TANAMURA ,  Tomoaki OYAMA ,  Takanori ISONO

    IPC: F27B9/02 ,  F27D5/00 ,  F27D25/00

    CPC classification number: F27B9/021 ,  F27D5/0068 ,  F27D25/00

    Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar, the saggar including a saggar body and a lid; a lid removing device configured to remove the lid from the saggar; a body conveyor configured to convey the saggar body; a lid conveyor configured to convey the lid; a recovery device configured to recover the material from the saggar body; a supply device configured to supply a non-heat-treated material to the saggar body; and a lid attaching device configured to attach the lid to the saggar body. A conveying time for the lid to be conveyed from an entrance to an exit of a conveying path of the lid conveyor may be shorter than a conveying time for the saggar body to be conveyed from an entrance to an exit of a conveying path of the body conveyor.

    Package and electronic device
    88.
    发明授权
    Package and electronic device 有权

    公开(公告)号：US11929301B2

    公开(公告)日：2024-03-12

    申请号：US17700717

    申请日：2022-03-22

    Applicant: NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

    Inventor： Naoya Shirai ,  Yoshikazu Mihara ,  Noriyasu Yamamoto

    IPC: H01L23/367 ,  H01L23/373

    CPC classification number: H01L23/3675 ,  H01L23/3731

    Abstract: A package has a cavity to be sealed by a lid. The package includes a heat sink having a coefficient of thermal expansion of 9 ppm/° C. or more and 15 ppm/° C. or less from 25° C. to 100° C. and a frame disposed on the heat sink, made of ceramics, and surrounding the cavity in plan view. An outer edge of the frame includes a first linear portion extending along a first direction, a second linear portion extending along a second direction orthogonal to the first direction, and a chamfer connecting the first linear portion and the second linear portion in plan view.

    Heat exchange member, heat exchanger and heat conductive member
    89.
    发明授权
    Heat exchange member, heat exchanger and heat conductive member 有权

    公开(公告)号：US11920874B2

    公开(公告)日：2024-03-05

    申请号：US17453021

    申请日：2021-11-01

    Applicant: NGK INSULATORS, LTD.

    Inventor： Daisuke Kimura ,  Tatsuo Kawaguchi

    IPC: F28D7/10 ,  F28D7/12 ,  F28F1/02 ,  F28F1/40

    CPC classification number: F28D7/106 ,  F28D7/12 ,  F28F1/022 ,  F28F1/40

    Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; an inner peripheral wall; and partition walls arranged between the outer peripheral wall and the inner peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member for covering an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls extend in a radial direction. Each of the cells is formed from the outer peripheral wall, the inner peripheral wall, and the partition walls.

Patent Agency Ranking