公开(公告)号：US07935204B2

公开(公告)日：2011-05-03

申请号：US12334520

申请日：2008-12-15

Applicant: Seung Jin Lee ,  Susan Williams ,  Jan Waszczuk ,  Kia Silverbrook

Inventor： Seung Jin Lee ,  Susan Williams ,  Jan Waszczuk ,  Kia Silverbrook

IPC: C09J163/00

CPC classification number: B32B37/0023 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2/164 ,  Y10T29/49032

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract translation: 打印头组件包括模制的油墨歧管，多个打印头集成电路和夹在墨水歧管和打印头集成电路之间的粘合膜。 模制油墨歧管的歧管结合表面包括聚合物涂层。 聚合物涂层堵塞由用于模制油墨歧管的模制过程产生的裂缝。

公开(公告)号：US20100239818A1

公开(公告)日：2010-09-23

申请号：US12406319

申请日：2009-03-18

Applicant: Seung Jin Lee ,  Hee Soo Yeo

Inventor： Seung Jin Lee ,  Hee Soo Yeo

IPC: B32B3/10 ,  H01L21/306 ,  C09K13/08

CPC classification number: H01L31/02363 ,  C09K13/08 ,  H01L31/0236 ,  H01L31/03682 ,  H01L31/182 ,  Y02E10/50 ,  Y10T428/24479

Abstract: A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.

Abstract translation: 一种使硅衬底纹理化的方法，包括：a）使衬底与包含乙醇酸的蚀刻溶液接触，b）蚀刻衬底的表面，从而在衬底的所述表面中形成破坏，以及c）去除蚀刻溶液以产生纹理化 衬底，所述纹理化衬底在至少一个表面中具有多个破坏，其表面密度在400微米方形区域中具有至少60个破坏的中断。

公开(公告)号：US20090233050A1

公开(公告)日：2009-09-17

申请号：US12049372

申请日：2008-03-17

Applicant: Seung Jin Lee ,  Martin Tiong We Tay ,  Kia Silverbrook

Inventor： Seung Jin Lee ,  Martin Tiong We Tay ,  Kia Silverbrook

IPC: G03F7/00 ,  B32B3/00

CPC classification number: B41J2/1634 ,  B41J2/1603 ,  B41J2/1631 ,  Y10T428/24479

Abstract: A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing an adhesive polymeric film, the film being comprised of one or more photopatternable materials; (b) exposing predetermined regions of the film through a mask; and (c) developing the film to define a plurality of ink supply holes.

Abstract translation: 一种制造用于将一个或多个打印头集成电路连接到供墨歧管的膜的方法。 该方法包括以下步骤：（a）提供粘合聚合物膜，该膜由一种或多种光可图案化材料组成; （b）通过掩模曝光胶片的预定区域; 和（c）显影膜以限定多个供墨孔。

公开(公告)号：US07541276B2

公开(公告)日：2009-06-02

申请号：US11223311

申请日：2005-09-09

Applicant: Jae Hak Kim ,  Sun Jung Lee ,  Seung Jin Lee

Inventor： Jae Hak Kim ,  Sun Jung Lee ,  Seung Jin Lee

IPC: H01L21/4763

CPC classification number: H01L21/76843 ,  H01L21/31144 ,  H01L21/76808 ,  H01L21/76844 ,  H01L21/76849 ,  H01L21/7685

Abstract: Exemplary embodiments of the invention generally include methods for forming multilayer metal interconnect structures using dual damascene methods that incorporate a via capping process to protect lower interconnection lines from etching damage or oxidation, for example, that may be caused by inadvertent exposure of lower interconnection lines to etching atmospheres.

Abstract translation: 本发明的示例性实施例通常包括使用双镶嵌方法形成多层金属互连结构的方法，该方法包括通孔封盖工艺以保护较低的互连线免受蚀刻损伤或氧化，例如可能由于下层互连线的无意曝光而引起 蚀刻气氛。

公开(公告)号：US07514109B2

公开(公告)日：2009-04-07

申请号：US10411751

申请日：2003-04-10

Applicant: Seung Jin Lee ,  Min Su Han ,  Yeong Il Chang

Inventor： Seung Jin Lee ,  Min Su Han ,  Yeong Il Chang

IPC: A23L1/22 ,  A23K1/00

CPC classification number: A23L27/10 ,  A23L7/104 ,  A23L11/09 ,  A23L11/37

Abstract: A method for producing a koji of a hot pepper paste with reduced capsaicin and/or dihydrocapsaicin content through action of enzymes secreted from a koji fungus includes adding a koji fungus to starting material for preparation of koji of hot pepper paste, and adding a predetermined amount of hot peppers one or more times to the material during the cultivating step performed by enzymes secreted from the koji fungus. The method can reduce the hotness of a hot pepper paste, while maintaining the intrinsic colors of traditional hot pepper pastes. Accordingly, it is possible to prepare various hot pepper paste products satisfying customer's diverse needs.

Abstract translation: 通过从曲木真菌分泌的酶的作用产生辣椒素和/或二氢辣椒素含量降低的辣椒糊的曲的方法包括将曲霉真菌添加到用于制备辣椒酱的曲的原料中，并加入预定量 的辣椒一次或多次，由从曲木真菌分泌的酶进行的培养步骤中的材料。 该方法可以降低辣椒酱的热度，同时保持传统辣椒酱的固有颜色。 因此，可以制备满足顾客多种需求的各种辣椒糊产品。

公开(公告)号：US20080233162A1

公开(公告)日：2008-09-25

申请号：US12064801

申请日：2006-08-28

Applicant: Seung Jin Lee ,  Sol Han ,  In Kyong Shim

Inventor： Seung Jin Lee ,  Sol Han ,  In Kyong Shim

IPC: A61K9/00 ,  C12N5/06 ,  A61K35/12 ,  A61P43/00

CPC classification number: A61L27/48 ,  A61L27/56 ,  D01D5/003

Abstract: The present invention relates to a fibrous 3-dimensional porous scaffold via electrospinning for tissue regeneration and a method for preparing the same. The fibrous porous scaffold for tissue regeneration of the present invention characteristically has a biomimetic structure established by using electrospinning which is efficient without wasting materials and simple in handling techniques. The fibrous porous scaffold for tissue regeneration of the present invention has the size of between nanofiber and microfiber and regular form and strength, so that it facilitates 3-dimensional tissue regeneration and improves porosity at the same time with making the surface area contacting to a cell large. Therefore, the scaffold of the invention can be effectively used as a support for the cell adhesion, growth and regeneration.

Abstract translation: 本发明涉及用于组织再生的静电纺丝的纤维状三维多孔支架及其制备方法。 本发明的组织再生用纤维多孔支架特征在于具有通过使用静电纺丝而建立的仿生结构，其在不浪费材料和简单的处理技术的情况下是有效的。 本发明的组织再生用纤维多孔支架具有纳米纤维与超细纤维之间的尺寸和规则的形状和强度，使得其有助于三维组织再生，同时在使表面积接触细胞的同时改善孔隙率 大。 因此，本发明的支架可以有效地用作细胞粘附，生长和再生的载体。

公开(公告)号：US20080058368A1

公开(公告)日：2008-03-06

申请号：US11664528

申请日：2005-10-11

Applicant: Sang-Geon Kim ,  Seung-Jin Lee ,  Eun-Young Park ,  Mvong-Suk Ko ,  Jin-Wan Kim ,  Kwang-Do Choi ,  Jee-Woong Lim ,  Sang-Ho Lee

Inventor： Sang-Geon Kim ,  Seung-Jin Lee ,  Eun-Young Park ,  Mvong-Suk Ko ,  Jin-Wan Kim ,  Kwang-Do Choi ,  Jee-Woong Lim ,  Sang-Ho Lee

IPC: A61K31/4365 ,  A61P1/16 ,  C07D471/04

CPC classification number: C07D495/04

Abstract: The present invention relates to new compounds directly increasing kinase activity of p90 ribosomal S6 kinase 1 (RSK1), a pharmaceutical composition comprising them as active ingredient, a use thereof to prevent or treat hepatic fibrosis or cirrhosis, and a method for preventing or treating hepatic fiborsis or cirrhosis, comprising administering a therapeutically effective amount of the composition to mammal.

Abstract translation: 本发明涉及直接增加p90核糖体S6激酶1（RSK1）的激酶活性的新化合物，其是包含它们作为活性成分的药物组合物，其用于预防或治疗肝纤维化或肝硬化的用途，以及用于预防或治疗肝脏的方法 纤维性或肝硬化，包括向哺乳动物施用治疗有效量的组合物。

公开(公告)号：US07014948B2

公开(公告)日：2006-03-21

申请号：US10258170

申请日：2002-03-05

Applicant: Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Byeong-In Ahn ,  Soon-Yong Park ,  You-Jin Kyung

Inventor： Seung-Jin Lee ,  Hyang-Mok Lee ,  Soon-Ho Ahn ,  Jin-Yeon Cho ,  Hyun-Hang Yong ,  Hyung-Keun Lee ,  Sang-Young Lee ,  Heon-Sik Song ,  Byeong-In Ahn ,  Soon-Yong Park ,  You-Jin Kyung

IPC: H01M2/16

CPC classification number: H01M2/1653 ,  B01D67/0013 ,  B01D67/0027 ,  B01D67/0083 ,  B01D67/009 ,  B01D69/12 ,  B01D2325/04 ,  B01D2325/26 ,  H01M2/14 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/0585

Abstract: The present invention provides a electrochemical element, wherein a multi-component composite film comprising a) polymer support layer film and b) a porous gellable polymer layer which is formed on either or both sides of the support layer film of a), wherein the support layer film of a) and the gellable polymer layer of b) are unified with each other without an interface between them.