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    Polishing pad for chemical mechanical polishing apparatus
    2.
    发明授权
    Polishing pad for chemical mechanical polishing apparatus 有权
    化学机械抛光设备抛光垫

    公开(公告)号：US08920220B2

    公开(公告)日：2014-12-30

    申请号：US13233715

    申请日：2011-09-15

    申请人： Ah-Ram Kim ,  Byeong-In Ahn ,  Dong-Mok Shin

    发明人： Ah-Ram Kim ,  Byeong-In Ahn ,  Dong-Mok Shin

    IPC分类号： B24D11/00 ,  B24B37/22

    CPC分类号： B24B37/22

    摘要： This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.

    摘要翻译： 本公开涉及一种用于化学机械抛光的抛光垫，其具有连接3个或更多个连接在平面上相邻的2个谷的半椭圆形或半圆形曲线的形状，并且包括形成为确定厚度的2个或更多个修改图案 在抛光垫上，其中一个修改图案的峰值和与其相邻的另一个修改图案的谷值依次位于同一行上。 抛光垫可以在抛光过程中将浆料均匀地分散在整个区域上，以提供改进的抛光均匀性，并适当地控制浆料的停留时间以提高抛光速率。

    POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS
    5.
    发明申请
    POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS 有权
    化学机械抛光设备抛光垫

    公开(公告)号：US20120071068A1

    公开(公告)日：2012-03-22

    申请号：US13233715

    申请日：2011-09-15

    申请人： Ah-Ram KIM ,  Byeong-In AHN ,  Dong-Mok SHIN

    发明人： Ah-Ram KIM ,  Byeong-In AHN ,  Dong-Mok SHIN

    IPC分类号： B24D11/00 ,  B24B53/017

    CPC分类号： B24B37/22

    摘要： This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.

    摘要翻译： 本公开涉及一种用于化学机械抛光的抛光垫，其具有连接3个或更多个连接在平面上相邻的2个谷的半椭圆形或半圆形曲线的形状，并且包括形成为确定厚度的2个或更多个修改图案 在抛光垫上，其中一个修改图案的峰值和与其相邻的另一个修改图案的谷值依次位于同一行上。 抛光垫可以在抛光过程中将浆料均匀地分散在整个区域上，以提供改进的抛光均匀性，并适当地控制浆料的停留时间以提高抛光速率。

    METHOD FOR MANUFACTURING POROUS SHEET AND POROUS SHEET MANUFACTURED BY THE METHOD
    8.
    发明申请
    METHOD FOR MANUFACTURING POROUS SHEET AND POROUS SHEET MANUFACTURED BY THE METHOD 审中-公开
    方法制造多孔板和方法制造的多孔板

    公开(公告)号：US20120085038A1

    公开(公告)日：2012-04-12

    申请号：US13377792

    申请日：2010-06-10

    申请人： Seong-Uk Jeong ,  Byeong-In Ahn ,  Young-Ji Tae ,  Keong-Yeon Yoon

    发明人： Seong-Uk Jeong ,  Byeong-In Ahn ,  Young-Ji Tae ,  Keong-Yeon Yoon

    IPC分类号： B24D3/00

    CPC分类号： B29C44/348 ,  C08J5/18 ,  C08J9/26 ,  C08J2201/042 ,  C08J2203/08 ,  Y02P20/544

    摘要： The present invention provides a method for producing a porous sheet, including the steps of a) producing a polymer resin sheet containing an object to be processed by supercritical fluid extraction which is dissolved in supercritical fluid; and b) injecting the supercritical fluid into the polymer resin sheet to extract the object to be processed by supercritical fluid extraction that is contained in the polymer resin sheet, thereby forming pores in the polymer resin sheet, and a porous sheet produced by the same.

    摘要翻译： 本发明提供一种多孔片的制造方法，包括以下步骤：a）通过超临界流体萃取法生产含有超临界流体萃取物的聚合物树脂片，所述超临界流体萃取溶解在超临界流体中; 以及b）将超临界流体注入到聚合物树脂片中，通过聚合物树脂片中所含的超临界流体萃取提取待处理物体，从而在聚合物树脂片中形成孔，以及由其制造的多孔片。