摘要:
A computer program product is provided for power delivery analysis and design for a hierarchical system. The product includes a storage medium, readable by a processing circuit, for storing instructions for execution by the processing circuit for facilitating a method. The method includes building a model corresponding to each element of the hierarchical system, and compiling a repository that contains models corresponding to each element, where the repository includes a net list, a domain list, a component list, a pin list, and a layer list. The method also includes performing optimized gridding for each element, the net list, the domain list, the component list, the pin list, and the layer list; assembling a system model from the models contained in the repository; flattening the system model by converting the system model to a flattened system model that consists entirely of resistors; and running a simulation on the flattened system model.
摘要:
A method, evacuation system and hazard warning center for the evacuation of a building divided into sections by the hazard warning center, which is connected to at least one hazard warning unit detecting a hazard. The hazard warning center produces an evacuation plan for the sections of the building on the basis of the location of the hazard detected by the hazard warning unit, the data received in connection with the hazard and at least one stored condition, and at least one alarm signaling unit in a section is sent at least one request to emit either a warning signal or an evacuation signal on the basis of the evacuation plan.
摘要:
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is provided. With the apparatus and method, one or more vias in the multi-layer ceramic package may be removed from the structure to provide area through which an offset of the signal lines may pass. Because these offsets of the signal lines exist in parallel planes above or below each other, with no ground lines existing directly between these signal line offsets, a capacitive cross-talk is introduced into the signal lines. This capacitive cross-talk is opposite in polarity to the inductive cross-talk already experienced by the signal lines. As a result, the capacitive cross-talk tends to negate or reduce the inductive cross-talk thereby reducing the far end noise in the signal line.
摘要:
In a video projection system, an operating device (12) activates a lamp (10), so that it delivers light with intensity which changes over time. A light modulation unit (16) is provided to apply image information to the light and is activated by a control unit (18) for this purpose. The operating device (12) and control unit (18) must be synchronized. While in the prior art the control unit transmits synchronization signals to the operating device (12), a reversal is provided according to the invention, i.e., the operating device (12) is designed to transmit synchronization signals to the control unit (18).
摘要:
A process for producing a semiconductor substrate comprising a carrier wafer and a layer of single-crystalline semiconductor material:a) producing a layer containing recesses at the surface of a donor wafer of single-crystalline semiconductor material,b) joining the surface of the donor wafer containing recesses to the carrier wafer,c) heat treating to close the recesses at the interface between the carrier wafer and the donor wafer to form a layer of cavities within the donor wafer, andd) splitting the donor wafer along the layer of cavities, resulting in a layer of semiconductor material on the carrier wafer. Semiconductor substrates prepared thusly may have a single-crystalline semiconductor layer having a thickness of 100 nm or less, a layer thickness uniformity of 5% or less, and an HF defect density of 0.02/cm2 or less.
摘要翻译:一种制造半导体衬底的方法,包括载体晶片和单晶半导体材料层:a)在单晶半导体材料的施主晶片的表面上产生包含凹陷的层,b)将所述供体的表面 晶片容纳凹槽到载体晶片,c)热处理以关闭在载体晶片和施主晶片之间的界面处的凹槽,以在施主晶片内形成一层空腔,以及d)沿着该空腔层分裂供体晶片 ,从而在载体晶片上产生一层半导体材料。 因此制备的半导体衬底可以具有厚度为100nm以下,层厚均匀度为5%以下,HF缺陷密度为0.02 / cm 2以下的单晶半导体层。
摘要:
A light source (10) is disclosed, emitting multi-coloured light with light of at least two different colours, emitted from a number of primary light sources (1) wherein the primary light sources (1) are divided into groups and the brightness values of the primary light sources (1) within a group are determined and controlled separately according to colour, such that the colour location of the multi-coloured light lies in a given region of the CIE standard colour diagram. The invention further relates to a method for controlling such a light source (10) and an illumination device with such a light source (10), for example, for backlighting a display.
摘要:
A lighting device (10, 11) has at least one light source (1, 1R, 1G, 1B) which is actuated by an operating unit (2) with an electrical signal on the basis of a light curve (3) stored in the operating unit (2). A display system having such a lighting device is also described.
摘要:
A method for determining the activation voltage of a piezoelectric actuator of at least one injector which is used to inject a liquid volume under high pressure into a cavity, in particular into a combustion chamber of an internal combustion engine, the activation voltage being varied as a function of the pressure used to pressurize the liquid volume. A drift of the activation voltage (voltage requirement) required for a predefined lift of a control valve of the injector is controlled on an injector-specific basis by controlling the difference between the cutoff-voltage threshold and the final steady-state voltage to a setpoint value predefined for one operating point.
摘要:
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is provided. With the apparatus and method, one or more vias in the multi-layer ceramic package may be removed from the structure to provide area through which an offset of the signal lines may pass. Because these offsets of the signal lines exist in parallel planes above or below each other, with no ground lines existing directly between these signal line offsets, a capacitive cross-talk is introduced into the signal lines. This capacitive cross-talk is opposite in polarity to the inductive cross-talk already experienced by the signal lines. As a result, the capacitive cross-talk tends to negate or reduce the inductive cross-talk thereby reducing the far end noise in the signal line.
摘要:
A metallization surface (5), which acts as an etching stop layer during the production of openings (4) in a passivation layer (3) applied to its upper face and protects an interconnect structure (6) arranged underneath it, is arranged in an uppermost metallization level (1). A further opening is produced in the metal surface (5), through which a focused ion beam is aimed at the interconnect structure (6) in order to connect interconnects to one another and/or to interrupt at least one interconnect. The wiring of the integrated circuit can thus be varied individually, starting from identically produced semiconductor chips.