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    Adjustment of polishing rates during substrate polishing with predictive filters
    82.
    发明授权
    Adjustment of polishing rates during substrate polishing with predictive filters 有权
    用预测滤波器调整衬底抛光期间的抛光速率

    公开(公告)号：US09375824B2

    公开(公告)日：2016-06-28

    申请号：US14092460

    申请日：2013-11-27

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Benjamin Cherian ,  Sivakumar Dhandapani ,  Harry Q. Lee

    IPC: B24B49/12 ,  G01B11/06 ,  B24B49/04

    CPC classification number: B24B49/12 ,  B24B49/04 ,  G01B11/06 ,  G01B11/0625

    Abstract: A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate.

    Abstract translation: 将取决于衬底的区域的厚度的测量的特征值输入到第一预测滤波器中。 第一个预测滤波器生成滤波后的特征值。 将测量的特征值改变的测量特征率输入到第二预测滤波器。 第二预测滤波器产生衬底区域的滤波表征速率。 基于在衬底的抛光过程中在第一次或之前进行的在位测量来确定所测量的特征值和测量的表征速率。 确定期望的表征速率用于在第一次之后以及在基于滤波的特征值和滤波的表征速率的第二较晚时间之前抛光衬底的区域。

    Path for probe of spectrographic metrology system
    85.
    发明授权
    Path for probe of spectrographic metrology system 有权
    探测光谱计量系统的路径

    公开(公告)号：US09056383B2

    公开(公告)日：2015-06-16

    申请号：US13777829

    申请日：2013-02-26

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Jun Qian ,  Thomas Li ,  Doyle E. Bennett ,  David J. Lischka ,  Steven M. Zuniga

    IPC: B24B49/00 ,  B24B49/12 ,  B24B37/013

    CPC classification number: B24B49/12 ,  B24B37/013

    Abstract: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.

    Abstract translation: 一种操作抛光系统的方法包括在抛光台处抛光衬底，在抛光期间由衬底保持的衬底，将衬底传送到定位在抛光站与另一抛光站或转移站之间的顺序光学测量系统 测量由光学计量系统的探针从衬底反射的多个光谱，同时移动载体头以使探针横穿穿过衬底的路径，并且当探针保持静止时，穿过衬底的路径包括多个 同心圆或多个基本上径向对齐的弧形段，以及基于基于多个光谱中的至少一些生成的一个或多个特征值来调整抛光系统的抛光端点或抛光参数。

    PATH FOR PROBE OF SPECTROGRAPHIC METROLOGY SYSTEM
    86.
    发明申请
    PATH FOR PROBE OF SPECTROGRAPHIC METROLOGY SYSTEM 有权
    光谱学系统探测方法

    公开(公告)号：US20140242879A1

    公开(公告)日：2014-08-28

    申请号：US13777829

    申请日：2013-02-26

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Jun Qian ,  Thomas Li ,  Doyle E. Bennett ,  David J. Lischka ,  Steven M. Zuniga

    IPC: B24B49/12

    CPC classification number: B24B49/12 ,  B24B37/013

    Abstract: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.

    Abstract translation: 一种操作抛光系统的方法包括在抛光台处抛光衬底，在抛光期间由衬底保持的衬底，将衬底传送到定位在抛光站与另一抛光站或转移站之间的顺序光学测量系统 测量由光学计量系统的探针从衬底反射的多个光谱，同时移动载体头以使探针横穿穿过衬底的路径，并且当探针保持静止时，穿过衬底的路径包括多个 同心圆或多个基本上径向对齐的弧形段，以及基于基于多个光谱中的至少一些生成的一个或多个特征值来调整抛光系统的抛光端点或抛光参数。

    REFLECTIVITY MEASUREMENTS DURING POLISHING USING A CAMERA
    87.
    发明申请
    REFLECTIVITY MEASUREMENTS DURING POLISHING USING A CAMERA 有权
    使用摄像机进行抛光时的反射率测量

    公开(公告)号：US20140206259A1

    公开(公告)日：2014-07-24

    申请号：US13794365

    申请日：2013-03-11

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek

    IPC: B24B37/013

    CPC classification number: B24B37/013 ,  B24B49/12

    Abstract: A substrate polishing system includes a platen to support a polishing surface, a carrier head configured to hold a substrate against the polishing surface during polishing, a light source configured to direct a light beam onto a surface of the substrate, a detector including an array of detection elements, and a controller. The detector is configured to detect reflections of the light beam from an area of the surface, and is configured to generate an image having pixels representing regions on the substrate having a length less than 0.1 mm. The controller is configured to receive the image and to detect clearance of a metal layer from an underlying layer on the substrate based on the image.

    Abstract translation: 衬底抛光系统包括用于支撑抛光表面的压板，构造成在抛光期间将衬底保持抵靠抛光表面的载体头，配置成将光束引导到衬底的表面上的光源;检测器，包括： 检测元件和控制器。 检测器被配置为检测来自表面的区域的光束的反射，并且被配置为产生具有表示具有小于0.1mm的长度的衬底上的区域的像素的图像。 控制器被配置为基于图像接收图像并从基底上的下层检测金属层的间隙。

    SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES
    88.
    发明申请
    SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES 有权
    使用指数值处理过程中基板的光谱监测

    公开(公告)号：US20140039660A1

    公开(公告)日：2014-02-06

    申请号：US14046237

    申请日：2013-10-04

    Applicant: Applied Materials, Inc.

    Inventor： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    IPC: G05B15/02

    CPC classification number: G05B15/02 ,  B24B37/013 ,  B24B49/12

    Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

    Abstract translation: 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

    THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS
    89.
    发明申请
    THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS 有权
    具有窗口和成型工艺的薄型抛光垫

    公开(公告)号：US20130309951A1

    公开(公告)日：2013-11-21

    申请号：US13948547

    申请日：2013-07-23

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Jimin Zhang ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

    IPC: B24B37/20

    CPC classification number: B24B37/205 ,  B24B37/013

    Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.

    Abstract translation: 描述了具有抛光层的抛光垫，抛光层具有抛光表面，在抛光层的与抛光层相对的一侧上的粘合剂层以及延伸穿过模制到抛光层的固体透光窗。 窗口具有与抛光表面共面的顶表面和与粘合剂层的下表面共面的底表面。 制造抛光垫的方法包括通过抛光层和粘合剂层形成孔，将背衬片固定在与抛光层的抛光表面相对的一侧上的粘合剂层上，将液体聚合物分配到孔中，并固化 液体聚合物形成窗口。

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