公开(公告)号：US20080073662A1

公开(公告)日：2008-03-27

申请号：US11524462

申请日：2006-09-21

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/642 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages.

摘要翻译： 一种制造大功率发光器件封装的方法及其结构，其方法包括以下步骤：（a）形成多个引线框架，每个引线框架包括散热元件和多个引线 ; （b）电镀每个引线框架的外表面; （c）在散热表面上涂覆导电凝胶; （d）在所述导电性凝胶上配置至少一个发光芯片; （e）在每个引线框架上形成密封剂; （f）将所述发光芯片的至少一个顶部电极与所述引线中的一个连接; （g）涂覆硅胶以覆盖一个发光芯片，并且在硅凝胶的顶表面上一体地形成聚焦光凸面; 和（h）切断连接杆以将引线框架彼此分离，从而形成多个高功率发光器件封装。

公开(公告)号：US20070297177A1

公开(公告)日：2007-12-27

申请号：US11475146

申请日：2006-06-27

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： F21V29/00

CPC分类号： F21V23/02 ,  F21V14/02 ,  F21V29/773 ,  F21Y2115/10

摘要： A modular lamp structure includes a housing, a base, an illumination module, and a control module. The housing has a receiving space. The base is disposed in the receiving space, the base including one end and other end. The illumination module is disposed on the one end of the base, and the control module is disposed on the other end of the base, the control module is connected electrically to the illumination module; Thereby the housing is dissipated heat from the lamp module.

摘要翻译： 模块化灯结构包括壳体，基座，照明模块和控制模块。 外壳有接收空间。 基座设置在接收空间中，底座包括一端和另一端。 照明模块设置在基座的一端，并且控制模块设置在基座的另一端，控制模块电连接到照明模块; 从而壳体从灯模块散热。

公开(公告)号：US07237938B2

公开(公告)日：2007-07-03

申请号：US11088791

申请日：2005-03-25

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

IPC分类号： F21V8/00

CPC分类号： G02B6/0018 ,  G02B6/005 ,  G02B6/0083 ,  G02F1/133615

摘要： A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.

摘要翻译： 布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光 板平行于印刷电路板。 反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。 引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

公开(公告)号：US20060261488A1

公开(公告)日：2006-11-23

申请号：US11492816

申请日：2006-07-26

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC分类号： H01L23/48

CPC分类号： H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

摘要翻译： 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上完成。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060261455A1

公开(公告)日：2006-11-23

申请号：US11488852

申请日：2006-07-19

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC分类号： H01L23/02

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

摘要翻译： 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US20060082994A1

公开(公告)日：2006-04-20

申请号：US10965852

申请日：2004-10-18

申请人： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

发明人： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC分类号： B60Q1/26

CPC分类号： F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K3/0058

摘要： An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.

摘要翻译： LED灯使用多个LED作为光源。 LED灯具有壳体，导电层，PCB，多个LED和驱动电子器件。 导电层被放置在壳体的内部。 导电层是金属，铜或铝，或非金属，硅胶或云母，用于传导由当前的加热效应引起的PCB的热量。 放置在导电层上表面的PCB用于安装LED。 每个LED通过并联绕组或串联电连接到PCB，以提供光源。 驱动电路与PCB电连接，用于驱动显色。

公开(公告)号：US20060035407A1

公开(公告)日：2006-02-16

申请号：US11081527

申请日：2005-03-17

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H05K1/02 ,  H01L21/30 ,  H05K1/00

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.

摘要翻译： 半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。 此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。 因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

公开(公告)号：US20060034071A1

公开(公告)日：2006-02-16

申请号：US10915537

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

发明人： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC分类号： F21L4/00

CPC分类号： F21S8/00 ,  F21W2111/02 ,  F21Y2115/10

摘要： An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.

摘要翻译： LED灯能够均匀地发光，并且设置有单组指示器以提供不同颜色的光，并且至少包括管状外壳，电路板和至少LED。 管状壳体的内壁具有设置在其上的粗糙的轻质均质层。 电路板与管状外壳底部的控制单元一起提供。 混色LED设在电路板上。

公开(公告)号：US20050207156A1

公开(公告)日：2005-09-22

申请号：US10805346

申请日：2004-03-22

申请人： Bily Wang ,  Jonnie Chuang

发明人： Bily Wang ,  Jonnie Chuang

IPC分类号： F21K99/00 ,  F21S4/00 ,  F21V1/00 ,  H05K1/18

CPC分类号： F21K9/90 ,  F21K9/00 ,  F21S4/20 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/90 ,  F21Y2115/10 ,  H05K1/189

摘要： A flexible light array is constructed to have a flexible substrate with conducting circuits therein, a LED array formed of longitudinally and transversely aligned light emitting diodes respectively electrically connected to the conducting circuits and controllable by a driving circuit to produce a video display, and a flexible plastic member packed on the flexible substrate and the LED array.

摘要翻译： 柔性光阵列被构造成具有其中具有导电电路的柔性基板，由纵向和横向对准的发光二极管形成的LED阵列，其分别电连接到导电电路并且可由驱动电路控制以产生视频显示器，以及柔性光阵列 塑料构件包装在柔性基板和LED阵列上。

公开(公告)号：USD507544S1

公开(公告)日：2005-07-19

申请号：US29180484

申请日：2003-04-25

申请人： Bily Wang ,  Jonnie Chuang

设计人： Bily Wang ,  Jonnie Chuang