Structure for bonding pad and method for its fabrication
    81.
    发明授权
    Structure for bonding pad and method for its fabrication 有权
    焊接结构及其制造方法

    公开(公告)号:US06740985B1

    公开(公告)日:2004-05-25

    申请号:US09716350

    申请日:2000-11-20

    Applicant: Bin Zhao

    Inventor: Bin Zhao

    Abstract: A copper bonding pad is directly supported by a copper via pad structure, the copper via pad structure having substantially the same geometry and dimensions as the copper bonding pad. The combination of the copper bonding pad and the copper via pad structure results in an increase in effective thickness of the copper bonding pad. Due to this effective increase in the bonding pad thickness, the bonding pad is more tolerant to the potential dishing problem caused by the CMP process. Additional metal pad structures and via pad structures are used below the bonding pad. The additional metal pad structures and via pad structures comprise alternating segments of interconnect metal and dielectric fillers, and alternating segments of via metal and dielectric fillers, respectively. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers prevent or reduce the potential dishing problem that otherwise exists in damascene and CMP processing. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers are arranged such that there are a number of columns of solid metal support under the bonding pad. The columns of solid metal support significantly improve the poor mechanical support otherwise provided by the low dielectric constant materials that are presently used in fabrication of modern copper integrated circuits. The columns of solid metal support also improve thermal conductivity of the bonding pad.

    Abstract translation: 铜焊盘由铜通孔焊盘结构直接支撑,铜通孔焊盘结构具有与铜焊盘基本上相同的几何形状和尺寸。 铜焊盘和铜通孔焊盘结构的组合导致铜焊盘的有效厚度的增加。 由于焊盘厚度的这种有效增加,焊盘更能承受由CMP工艺引起的潜在的凹陷问题。 在焊盘下面使用附加的金属焊盘结构和通孔焊盘结构。 附加的金属焊盘结构和通孔焊盘结构分别包括互连金属和介电填料的交替段,以及通孔金属和电介质填料的交替段。 互连金属和电介质填料的交替段和通孔金属和电介质填料的交替段防止或减少在镶嵌和CMP加工中存在的潜在凹陷问题。 互连金属和电介质填料的交替段和通孔金属和电介质填料的交替段布置成使得在接合焊盘下方有许多固体金属支撑柱。 固体金属载体的柱显着地改善了目前用于制造现代铜集成电路的低介电常数材料提供的差的机械支撑。 固体金属载体的柱也提高了焊盘的导热性。

    Apparatus and method for wavelength division multiplexing
    82.
    发明授权
    Apparatus and method for wavelength division multiplexing 失效
    用于波分复用的装置和方法

    公开(公告)号:US06684006B2

    公开(公告)日:2004-01-27

    申请号:US10021472

    申请日:2001-12-07

    Applicant: Bin Zhao

    Inventor: Bin Zhao

    Abstract: A dispersion mitigating interleaver assembly has a first unbalanced Mach-Zehnder interferometer (MZI) assembly which includes first and second output ports and which has first transmission vs. wavelength curve and a first dispersion vs. wavelength curve. The dispersion mitigating interleaver assembly also includes a second unbalanced MZI assembly which has a second transmission vs. wavelength curve and a second dispersion vs. wavelength curve. The second unbalanced MZI assembly receives an output from one of the first and second output ports of the first unbalanced MZI assembly. The second transmission vs. wavelength curve is substantially the same as the first transmission vs. wavelength curve and the second dispersion vs. wavelength curve is substantially opposite with respect to the first dispersion vs. wavelength curve, such that dispersion is substantially cancelled by the cooperation of the first and second unbalanced MZI assemblies.

    Abstract translation: 分散减轻交错器组件具有第一不平衡马赫 - 曾德干涉仪(MZI)组件,其包括第一和第二输出端口,并且具有第一透射与波长曲线以及第一色散与波长曲线。 色散减轻交错器组件还包括第二不平衡MZI组件,其具有第二透射与波长曲线和第二色散相对于波长曲线。 第二不平衡MZI组件从第一不平衡MZI组件的第一和第二输出端口之一接收输出。 第二透射率与波长曲线基本上与第一透射率相对于波长曲线相同,并且第二色散对波长曲线相对于第一色散相对于波长曲线基本相反,使得色散基本上被合作消除 的第一和第二不平衡MZI组件。

    Tandem interleaver
    83.
    发明授权
    Tandem interleaver 失效
    串联交织器

    公开(公告)号:US06639707B2

    公开(公告)日:2003-10-28

    申请号:US10016362

    申请日:2001-11-30

    Applicant: Bin Zhao

    Inventor: Bin Zhao

    Abstract: A low dispersion comb filter or interleaver comprises a first birefringent element assembly having at least one birefringent element and a second birefringent element assembly having at least one other birefringent element. The first birefringent element assembly and the second birefringent element assembly are configured so as to cooperate with one another in a manner which mitigates dispersion of the interleaver. By aligning the polarization directions of the odd channels and the even channels so as to be parallel with respect to one another prior to entering the second birefringent element assembly, zero or nearly zero dispersion is obtained simultaneously for both the odd and even channels.

    Abstract translation: 低色散梳状滤波器或交织器包括具有至少一个双折射元件的第一双折射元件组件和具有至少一个其它双折射元件的第二双折射元件组件。 第一双折射元件组件和第二双折射元件组件被配置为以减轻交错器的色散的方式彼此协作。 通过使奇数通道和偶数通道的偏振方向在进入第二双折射元件组件之前相对彼此平行对准,对奇数和偶数通道同时获得零或接近零的色散。

    Method for fabricating on-chip inductors and related structure
    84.
    发明授权
    Method for fabricating on-chip inductors and related structure 有权
    制造片上电感器及相关结构的方法

    公开(公告)号:US06396122B1

    公开(公告)日:2002-05-28

    申请号:US09658483

    申请日:2000-09-08

    CPC classification number: H01L28/10 H01L27/08

    Abstract: According to various disclosed embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for example, copper, aluminum, or copper-aluminum alloy. The dielectric can be, for example, silicon oxide or a low-k dielectric. A spin-on matrix containing high permeability particles is then deposited adjacent to the patterned conductor. The high permeability particles comprise material having a permeability substantially higher than the permeability of the dielectric. The high permeability particles can comprise, for example, nickel, iron, nickel-iron alloy, or magnetic oxide. As a result, an inductor having a high inductance value is achieved without lowering the quality factor of the inductor.

    Abstract translation: 根据各种公开的实施例,导体在电介质中图案化。 导体可以被图案化,例如,呈正方形螺旋形。 导体可以包括例如铜,铝或铜 - 铝合金。 电介质可以是例如氧化硅或低k电介质。 然后将包含高磁导率颗粒的旋涂基体沉积在图案化导体附近。 高磁导率颗粒包括具有比电介质的磁导率显着更高的磁导率的材料。 高磁导率颗粒可以包括例如镍,铁,镍 - 铁合金或磁性氧化物。 结果,实现了具有高电感值的电感器,而不降低电感器的品质因数。

    Electrocardiogram signal processing system
    90.
    发明授权
    Electrocardiogram signal processing system 有权
    心电图信号处理系统

    公开(公告)号:US08725238B2

    公开(公告)日:2014-05-13

    申请号:US12878800

    申请日:2010-09-09

    Abstract: An electrocardiogram signal processing system is provided which includes: a wavelet transformation unit comprising a plurality of outputs, each output being connected to one of a plurality of scales, wherein the wavelet transformation unit is adapted to transform an input electrocardiogram signal into a set of wavelets, each wavelet being output to one of the scales; a plurality of signal processing blocks, each of the signal processing blocks coupled to a respective output of the wavelet transformation unit and configured to receive and process the wavelet from the respective output, wherein the signal processing blocks provide processing functions which differ from one another.

    Abstract translation: 提供了一种心电图信号处理系统,其包括:小波变换单元,包括多个输出,每个输出连接到多个刻度中的一个,其中所述小波变换单元适于将输入的心电图信号变换成一组小波 每个小波输出到一个秤; 多个信号处理块,每个信号处理块耦合到小波变换单元的相应输出并且被配置为从相应的输出接收和处理小波,其中信号处理块提供彼此不同的处理功能。

Patent Agency Ranking