Abstract:
A copper bonding pad is directly supported by a copper via pad structure, the copper via pad structure having substantially the same geometry and dimensions as the copper bonding pad. The combination of the copper bonding pad and the copper via pad structure results in an increase in effective thickness of the copper bonding pad. Due to this effective increase in the bonding pad thickness, the bonding pad is more tolerant to the potential dishing problem caused by the CMP process. Additional metal pad structures and via pad structures are used below the bonding pad. The additional metal pad structures and via pad structures comprise alternating segments of interconnect metal and dielectric fillers, and alternating segments of via metal and dielectric fillers, respectively. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers prevent or reduce the potential dishing problem that otherwise exists in damascene and CMP processing. The alternating segments of interconnect metal and dielectric fillers and the alternating segments of via metal and dielectric fillers are arranged such that there are a number of columns of solid metal support under the bonding pad. The columns of solid metal support significantly improve the poor mechanical support otherwise provided by the low dielectric constant materials that are presently used in fabrication of modern copper integrated circuits. The columns of solid metal support also improve thermal conductivity of the bonding pad.
Abstract:
A dispersion mitigating interleaver assembly has a first unbalanced Mach-Zehnder interferometer (MZI) assembly which includes first and second output ports and which has first transmission vs. wavelength curve and a first dispersion vs. wavelength curve. The dispersion mitigating interleaver assembly also includes a second unbalanced MZI assembly which has a second transmission vs. wavelength curve and a second dispersion vs. wavelength curve. The second unbalanced MZI assembly receives an output from one of the first and second output ports of the first unbalanced MZI assembly. The second transmission vs. wavelength curve is substantially the same as the first transmission vs. wavelength curve and the second dispersion vs. wavelength curve is substantially opposite with respect to the first dispersion vs. wavelength curve, such that dispersion is substantially cancelled by the cooperation of the first and second unbalanced MZI assemblies.
Abstract:
A low dispersion comb filter or interleaver comprises a first birefringent element assembly having at least one birefringent element and a second birefringent element assembly having at least one other birefringent element. The first birefringent element assembly and the second birefringent element assembly are configured so as to cooperate with one another in a manner which mitigates dispersion of the interleaver. By aligning the polarization directions of the odd channels and the even channels so as to be parallel with respect to one another prior to entering the second birefringent element assembly, zero or nearly zero dispersion is obtained simultaneously for both the odd and even channels.
Abstract:
According to various disclosed embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for example, copper, aluminum, or copper-aluminum alloy. The dielectric can be, for example, silicon oxide or a low-k dielectric. A spin-on matrix containing high permeability particles is then deposited adjacent to the patterned conductor. The high permeability particles comprise material having a permeability substantially higher than the permeability of the dielectric. The high permeability particles can comprise, for example, nickel, iron, nickel-iron alloy, or magnetic oxide. As a result, an inductor having a high inductance value is achieved without lowering the quality factor of the inductor.
Abstract:
Systems and methods for improving quality of a call over network (CON) are provided. Call quality may be improved via buffer length modulation based upon the call scenario type. Scenario detection may be based upon who speaks, and the duration of the speaking, as well as contextual analysis. Further, the call over network quality may further be improved by deploying modules over the network. The modules are intermediary vehicles between each communicator and backend servers. The modules intercept audio packets from the communicator to detect packet loss, and perform recovery of lost packets, thereby accelerating real-time audio conversations.
Abstract:
Systems and methods for improving quality of a call over network (CON) are provided. Call quality may be improved via buffer length modulation based upon the call scenario type. Scenario detection may be based upon who speaks, and the duration of the speaking, as well as contextual analysis. Further, the call over network quality may further be improved by deploying modules over the network. The modules are intermediary vehicles between each communicator and backend servers. The modules intercept audio packets from the communicator to detect packet loss, and perform recovery of lost packets, thereby accelerating real-time audio conversations.
Abstract:
Systems and methods for improving quality of a call over network (CON) are provided. Call quality may be improved via pathway testing to determine data path quality. This may be utilized to inform buffering lengths, and also may be utilized to choose the data pathway utilized for transmitting the data. Pathway testing may employ collecting microphone data on one device, transmitting it across the various pathways, and then comparing the quality at the endpoint compared to the initial data.
Abstract:
Systems and methods for a call over network (CON) with a visualized summary are provided. In some embodiments, after the call concludes, a visualized summary of the call can be generated. The summary includes any of the recording of the call, transcriptions, scenario information, speaker information and the duration each speaker was talking, etc. Scenario may be generated by comparing the call speaking pattern to known templates of call types. Additionally, participant features employed in the call may be summarized in chronological relation to the calls progression in a visual format.
Abstract:
A photoluminescent or electroluminescent system and method of making a non-luminescent nanostructured material into such a luminescent system is presented. The method of preparing the luminescent system, generally, comprises the steps of modifying the surface of a nanostructured material to create isolated regions to act as luminescent centers and to create a charge imbalance on the surface; applying more than one polar molecule to the charged surface of the nanostructured material; and orienting the polar molecules to compensate for the charge imbalance on the surface of the nanostructured material. The compensation of the surface charge imbalance by the polar molecules allows the isolated regions to exhibit luminescence.
Abstract:
An electrocardiogram signal processing system is provided which includes: a wavelet transformation unit comprising a plurality of outputs, each output being connected to one of a plurality of scales, wherein the wavelet transformation unit is adapted to transform an input electrocardiogram signal into a set of wavelets, each wavelet being output to one of the scales; a plurality of signal processing blocks, each of the signal processing blocks coupled to a respective output of the wavelet transformation unit and configured to receive and process the wavelet from the respective output, wherein the signal processing blocks provide processing functions which differ from one another.