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公开(公告)号：US20220324202A1
公开(公告)日：2022-10-13
申请号：US17838757
申请日：2022-06-13
Applicant: CORNING INCORPORATED
Inventor： Theresa Chang , Polly Wanda Chu , Patrick Joseph Cimo , Adam James Ellison , Timothy Michael Gross , Guangli Hu , Nicholas James Smith , Butchi Reddy Vaddi , Natesan Venkataraman
IPC: B32B17/10 , C03C21/00 , H05K1/02 , H05K1/03 , C03C17/32 , B32B27/36 , C03C17/30 , C03C15/00 , G06F1/16 , B32B17/06 , C03C3/091 , B32B7/12 , B32B37/12 , B32B37/16 , H05K3/46
Abstract: A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.
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公开(公告)号：US20220234947A1
公开(公告)日：2022-07-28
申请号：US17610048
申请日：2020-05-13
Applicant: Corning Incorporated
Inventor： Kaveh Adib , Theresa Chang , Sean Patrick Coleman , Jiangwei Fei , Ying Wei , Christine Coulter Wolcott , Shu Yuan , Binwei Zhang , Chunhe Zhang
IPC: C03C17/30 , C09D183/06
Abstract: Various embodiments provide an article including a substrate and a coating thereon including a functionalized fluorine containing compound crosslinked with a multifunctional siloxane resin. A method of forming the article includes applying a multifunctional siloxane resin to a substrate, applying a functionalized fluorine containing compound to the substrate, and annealing the multifunctional siloxane resin and the functionalized fluorine containing compound.
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公开(公告)号：US11123954B2
公开(公告)日：2021-09-21
申请号：US15921034
申请日：2018-03-14
Applicant: Corning Incorporated
Inventor： Kaveh Adib , Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Shiwen Liu , Robert George Manley , Prantik Mazumder
Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.
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公开(公告)号：US11007117B2
公开(公告)日：2021-05-18
申请号：US16185493
申请日：2018-11-09
Applicant: CORNING INCORPORATED
Inventor： Andrei Gennadyevich Fadeev , Theresa Chang , Dana Craig Bookbinder , Santona Pal , Chandan Kumar Saha , Steven Edward DeMartino , Christopher Lee Timmons , John Stephen Peanasky
Abstract: Coated glass pharmaceutical packages are disclosed. According to embodiments, a coated glass pharmaceutical package may include a glass container formed from one of a borosilicate glass composition that meets Type 1 criteria according to USP or an alkali aluminosilicate glass having a Class HGA 1 hydrolytic resistance when tested according to the ISO 720-1985 testing standard. A low-friction coating may be bonded to the exterior surface of the glass container. The low-friction coating may include a polymer. The exterior surface of the glass container with the low-friction coating may have a coefficient of friction of less than or equal to 0.7. The coated glass pharmaceutical package may be thermally stable after depyrogenation in air at a temperature of at least about 260° C. for 30 minutes.
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公开(公告)号：US10737973B2
公开(公告)日：2020-08-11
申请号：US15153295
申请日：2016-05-12
Applicant: CORNING INCORPORATED
Inventor： John Frederick Bayne , Dana Craig Bookbinder , Theresa Chang , Steven Edward DeMartino , Andrei Gennadyevich Fadeev , Kyle Christopher Hoff , Jamie Lynne Morley , Santona Pal , John Stephen Peanasky , Chandan Kumar Saha , Christopher Lee Timmons
IPC: A61J1/14 , C03C17/30 , B65D1/09 , B65D23/08 , A61J1/00 , B65D65/42 , B65D25/14 , C03C17/00 , C03C17/32 , C03C17/42 , C03C21/00 , C09D179/08 , C09D183/08 , C08L77/02 , C08G73/10 , C08G77/26 , C09D4/00
Abstract: Embodiments of the present disclosure are directed to coated glass articles which reduce glass particle formation caused by glass to glass contact in pharmaceutical glass filling lines.
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Patent Agency Ranking
公开(公告)号：US10538452B2
公开(公告)日：2020-01-21
申请号：US15094477
申请日：2016-04-08
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Jeffrey John Domey , Robert George Manley , Prantik Mazumder , Alan Thomas Stephens, II
IPC: B32B7/06 , C03B25/02 , B32B17/06 , C03B40/00 , C03B35/14 , C03C1/00 , B05D1/00 , C03C17/32 , G02F1/1333
Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
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公开(公告)号：US20190210768A1
公开(公告)日：2019-07-11
申请号：US16355797
申请日：2019-03-17
Applicant: CORNING INCORPORATED
Inventor： Kaveh Adib , Dana Craig Bookbinder , Theresa Chang , Paul Stephen Danielson , Steven Edward DeMartino , Melinda Ann Drake , Andrei Gennadyevich Fadeev , James Patrick Hamilton , Robert Michael Morena , Santona Pal , John Stephen Peanasky , Chandan Kumar Saha , Robert Anthony Schaut , Susan Lee Schiefelbein , Christopher Lee Timmons
IPC: B65D23/08 , B65D1/40 , A61J1/14 , C03C3/087 , B65D25/14 , B32B17/06 , C03C17/34 , C03C17/00 , C03C17/32 , C03C17/30 , C08G73/10 , C09D179/08 , C03C21/00 , C03C17/42
CPC classification number: B65D23/0814 , A61J1/1468 , B32B17/06 , B65D1/40 , B65D25/14 , C03C3/087 , C03C17/005 , C03C17/30 , C03C17/32 , C03C17/3405 , C03C17/42 , C03C21/002 , C03C2217/78 , C03C2218/111 , C08G73/105 , C08G73/1071 , C09D179/08 , C08K5/544
Abstract: Disclosed herein are delamination resistant glass pharmaceutical containers which may include a glass body having a Class HGA1 hydrolytic resistance when tested according to the ISO 720:1985 testing standard. The glass body may have an interior surface and an exterior surface. The interior surface of the glass body does not comprise a boron-rich layer when the glass body is in an as-formed condition. A heat-tolerant coating may be bonded to at least a portion of the exterior surface of the glass body. The heat-tolerant coating may have a coefficient of friction of less than about 0.7 and is thermally stable at a temperature of at least 250° C. for 30 minutes.
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公开(公告)号：US10034816B2
公开(公告)日：2018-07-31
申请号：US15374338
申请日：2016-12-09
Applicant: Corning Incorporated
Inventor： Andrei Gennadyevich Fadeev , Theresa Chang , Dana Craig Bookbinder , Santona Pal , Chandan Kumar Saha , Steven Edward DeMartino , Christopher Lee Timmons , John Stephen Peanasky
IPC: A61J1/14 , C03C17/00 , C03C17/42 , C03C17/30 , C03C17/32 , C03C21/00 , B65D25/34 , B65D65/42 , B65D23/08 , C09D179/08
CPC classification number: A61J1/1468 , A61J1/00 , B65D23/0814 , B65D23/0821 , B65D25/14 , B65D25/34 , B65D65/42 , C03C17/005 , C03C17/30 , C03C17/32 , C03C17/42 , C03C21/002 , C03C2217/78 , C03C2218/111 , C09D179/08 , Y10T428/1321 , Y10T428/24942
Abstract: A pharmaceutical package may include a glass body enclosing an inner volume and having an exterior surface. The glass body may be formed from a borosilicate glass that meets the Type 1 criteria according to USP or an alkali aluminosilicate glass having a Class HGA 1 hydrolytic resistance when tested according to the ISO 720-1985 testing standard. A coupling agent layer having a first thickness less than or equal to 100 nm may be disposed on the exterior surface of the glass body. A polymer layer having a second thickness of less than 50 nm may be positioned over the coupling agent layer. The exterior surface of the glass body with the coupling agent layer and the polymer layer may have a coefficient of friction less than or equal to 0.7.
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公开(公告)号：US10014177B2
公开(公告)日：2018-07-03
申请号：US14047514
申请日：2013-10-07
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Robert George Manley , Prantik Mazumder , Theresa Chang , Jeffrey John Domey , Darwin Gene Enicks , Vasudha Ravichandran , Alan Thomas Stephens, II , John Christopher Thomas
CPC classification number: H01L21/2007 , H01L51/003 , H01L51/0097 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521 , Y10T156/10 , Y10T156/1052
Abstract: Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
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公开(公告)号：US20180113490A1
公开(公告)日：2018-04-26
申请号：US15843346
申请日：2017-12-15
Applicant: CORNING INCORPORATED
Inventor： Theresa Chang , Polly Wanda Chu , Patrick Joseph Cimo , Adam James Ellison , Timothy Michael Gross , Guangli Hu , Nicholas James Smith , Butchi Reddy Vaddi , Natesan Venkataraman
Abstract: A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress σI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.
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