摘要:
A metal gate transistor may include a metal layer over a high dielectric constant dielectric layer. The dielectric layer abstracts electronegativity from said metal layer, altering its workfunction. The workfunction of the metal layer may be set to compensate for the dielectric layer abstraction.
摘要:
A method for making a semiconductor device is described. That method comprises forming a dielectric layer on a substrate, and forming a first metal layer on a first part of the dielectric layer, leaving a second part of the dielectric layer exposed. After a second metal layer is formed on both the first metal layer and the second part of the dielectric layer, a masking layer is formed on the second metal layer.
摘要:
The present invention relates to a Tunnel Field Effect Transistor (TFET), which utilizes angle implantation and amorphization to form asymmetric source and drain regions. The TFET further includes a silicon germanium alloy epitaxial source region with a conductivity opposite that of the drain.
摘要:
A method is described for providing a nanostructure suspended above a substrate surface. The method includes providing a nanostructure encased in an oxide shell on a substrate and depositing a sacrificial material and a support material over the oxide encased nanostructure. Then, the sacrificial material is removed to expose the oxide encased nanostructure. Once the oxide encased nanostructure has been exposed, the oxide shell is removed from the oxide encased nanostructure such that the nanostructure is suspended above the substrate surface.
摘要:
The present invention relates to a Tunnel Field Effect Transistor (TFET), which utilizes angle implantation and amorphization to form asymmetric source and drain regions. The TFET further comprises a silicon germanium alloy epitaxial source region with a conductivity opposite that of the drain.
摘要:
The present invention relates to a Tunnel Field Effect Transistor (TFET). which utilizes angle implantation and amorphization to form asymmetric source and drain regions. The IFET further includes a silicon germanium alloy epitaxial source region with a conductivity opposite that of the drain.
摘要:
Methods and associated structures of forming a microelectronic device are described. Those methods may include forming at least one metal source/drain on a gate dielectric, wherein the at least one metal source/drain is adjacent to a channel region, wherein the channel region comprises at least one carbon nanotube.
摘要:
Complementary metal oxide semiconductor metal gate transistors may be formed by depositing a metal layer in trenches formerly inhabited by patterned gate structures. The patterned gate structures may have been formed of polysilicon in one embodiment. The metal layer may have a workfunction most suitable for forming one type of transistor, but is used to form both the n and p-type transistors. The workfunction of the metal layer may be converted, for example, by ion implantation to make it more suitable for use in forming transistors of the opposite type.
摘要:
A dielectric deposited on a substrate may be exposed to a salt solution. While exposed to the salt solution, an oxide is deposited on the dielectric.
摘要:
Complementary metal oxide semiconductor metal gate transistors may be formed by depositing a metal layer in trenches formerly inhabited by patterned gate structures. The patterned gate structures may have been formed of polysilicon in one embodiment. The trenches may be filled with metal by surface activating using a catalytic metal, followed by electroless deposition of a seed layer followed by superconformal filling bottom up.