摘要:
An end-surface reflection type surface acoustic wave filter is capable of increasing an attenuation amount outside a pass band while insertion loss characteristics are not seriously deteriorated. The filter is a longitudinally coupled resonator type surface acoustic wave filter using an SH type surface acoustic wave, which has first and second grooves formed in a piezoelectric substrate at the top surface thereof so as to be substantially parallel to each other and spaced from each other by a predetermined distance. In addition, IDTs which are provided between the grooves for defining the longitudinally coupled resonator type surface acoustic wave filter, reflection end-surfaces disposed on side surfaces of the first and the second grooves at the IDT sides, and one of a resin-coating layer and a protective layer made of SiO2, are provided on the top surface of the piezoelectric substrate. The resin-coating layer is arranged to cover at least a region at which the IDTs are located and at least one of the first and the second grooves so as to intrude into one of them, and the protective layer is arranged so as to cover the IDTs.
摘要:
A SAW apparatus includes a plurality of IDTs disposed on a piezoelectric substrate, and an edge-reflection-type SAW device in which surface acoustic waves are reflected by the edge surfaces of the piezoelectric substrate. The SAW device is housed in a package. On the top of a first main surface of the piezoelectric substrate, first and second pyroelectric charge cancellation electrodes are disposed in the vicinity of the edges defined by the main surface and the side surfaces. The first and second pyroelectric charge cancellation electrodes are electrically connected to the electrodes on the package which are electrically connected to each other within the package, respectively. Therefore, the adverse effects of pyroelectric charge which is generated due to a rapid change in temperature is minimized.
摘要:
A method for forming a p-type semiconductor film comprises the steps of: providing on a substrate a group II-VI compound semiconductor film which is doped with a p-type impurity and comprises either MgXZn1−XO (0≦X≦1) or CdXZn1−XO (0≦X≦1) and activating the p-type impurity by annealing the doped semiconductor film.
摘要翻译:一种形成p型半导体膜的方法包括以下步骤:在衬底上提供掺杂有p型杂质的II-VI族化合物半导体膜,其包含MgXZn1-XO(0≤x≤1) )或CdXZn1-XO(0 <= X <= 1),并通过退火掺杂的半导体膜激活p型杂质。
摘要:
A surface acoustic wave device includes a piezoelectric substrate, and at least one interdigital transducer disposed thereon which is made of a metal or an alloy that is heavier than Al. The acoustic velocity distribution of surface acoustic waves in the extending direction of electrode fingers of the at least one interdigital transducer is not greater than about 276 ppm, thereby effectively suppressing considerable ripples, which are noticeably found in the group delay time characteristic in particular, within the bandpass area.
摘要:
A semiconductor photonic device includes a Z-cut quartz substrate and a compound semiconductor layer presented by InxGayAlzN (where x+y+z=1, 0≦x ≦1, 0≦y≦1, and 0≦z≦1) formed on the Z-cut quartz substrate.
摘要翻译:半导体光子器件包括Z切割石英衬底和由InxGayAlzN(其中x + y + z =1,0,0≤x≤1,0<= y <= 1且0≤z)呈现的化合物半导体层 <= 1)形成在Z切割石英基板上。
摘要:
An optical electronic integrated circuit comprises: a silicon substrate; an electronic circuit formed in the silicon substrate and processing an electric signal; a ZnO film formed on at least portion of the silicon substrate; and an optical circuit electrically connected to the electronic circuit. The optical circuit includes at least one GaN-based semiconductor compound layer which is provided on the ZnO film, and the GaN-based compound semiconductor layer either receives or emits an optical signal.
摘要:
A transversely coupled surface acoustic wave filter includes a surface acoustic wave substrate having opposing first and second end surfaces, and first and second interdigital transducers provided on the surface acoustic wave substrate. The first and second interdigital transducers define first and second surface acoustic wave resonators which use a wave including a shear horizontal wave as its main component. The first and second surface acoustic wave resonators are connected to define a transversally coupled resonator filter. The filter preferably has a relative dielectric constant E=∈s11/∈0 in the range of about 0 to about 3000 and the electromechanical coupling coefficient K is such that K2·∈s11/∈0 is in the range of about 0 to about 250. Also, the aperture length y is preferably within the range of: 0.945+5.49×exp(−E/366) ≧y≧2.46×exp(−E/219).
摘要:
A SAW resonator filter which generates Shear Horizontal type surface acoustic waves includes a piezoelectric substrate, and first and second resonators arranged on the piezoelectric substrate. The first and second resonators include first and second interdigital transducers having electrode fingers, respectively. The first and second interdigital transducers are acoustically coupled to form a filter, and are divided into a plurality of sub-interdigital transducer portions, respectively. By dividing the interdigital transducers to have multiple sub-IDT portions, the effective electromechanical coupling coefficient is reduced, thereby enabling the bandwidth to be made narrower. Further, the improvement in the electrode structure allows for the filter to use a piezoelectric substrate having excellent temperature characteristics, so that it is possible to achieve a SAW resonator filter having a narrow bandwidth and superior temperature characteristics. Moreover, when an edge reflection type SAW resonator filter using SH-type surface acoustic waves is made, it is possible to provide a compact bandpass filter having low insertion loss and excellent selectability.
摘要:
A method for forming a GaN-based semiconductor layer includes the steps of: forming a ZnO buffer layer on one of a glass substrate and a silicon substrate; and epitaxially growing a GaN-based semiconductor layer on the ZnO buffer layer by using an electron cyclotron resonance--molecular beam epitaxy (ECR-MBE) method.
摘要:
A surface acoustic wave device includes a surface acoustic wave substrate having first and second end surfaces, and a surface acoustic wave element provided on the surface acoustic wave substrate and operating using an SH-type surface acoustic wave. The surface acoustic wave element includes an interdigital transducer having a plurality of electrode fingers and a reflector having a plurality of electrode fingers. One of a pair of outermost electrode fingers is flush with one of the first and second end surfaces of the surface acoustic wave substrate, and the reflector is located at a side where the other of the pair of outermost electrode fingers is positioned, so that a SH-type surface acoustic wave excited by the IDT is confined between the reflector and the one of the first and second end surfaces.