HIGH ENERGY DENSITY STORAGE MATERIAL DEVICE USING NANOCHANNEL STRUCTURE
    81.
    发明申请
    HIGH ENERGY DENSITY STORAGE MATERIAL DEVICE USING NANOCHANNEL STRUCTURE 有权
    使用纳米通道结构的高能量密度存储材料设备

    公开(公告)号:US20110188172A1

    公开(公告)日:2011-08-04

    申请号:US12699411

    申请日:2010-02-03

    IPC分类号: H01G9/00

    摘要: A capacitor includes a plurality of nanochannels formed in a dielectric material. A conductive film is formed over interior surfaces of the nanochannels, and a charge barrier is formed over the conductive film. An electrolytic solution is disposed in the nanochannels. An electrode is coupled to the electrolytic solution in the nanochannels to form the capacitor.

    摘要翻译: 电容器包括形成在电介质材料中的多个纳米通道。 在纳米通道的内表面上形成导电膜,并且在导电膜上形成电荷势垒。 在纳米通道中设置电解液。 电极与纳米通道中的电解液结合形成电容器。

    Mobility Enhanced FET Devices
    84.
    发明申请
    Mobility Enhanced FET Devices 审中-公开
    移动增强型FET器件

    公开(公告)号:US20080217700A1

    公开(公告)日:2008-09-11

    申请号:US11684619

    申请日:2007-03-11

    IPC分类号: H01L29/76 H01L21/336

    摘要: NFET and PFET devices with separately stressed channel regions, and methods of their fabrication is disclosed. A FET is disclosed which includes a gate, which gate includes a metal in a first state of stress. The FET also includes a channel region hosted in a single crystal Si based material, which channel region is overlaid by the gate and is in a second state of stress. The second state of stress of the channel region is of an opposite sign than the first state of stress of the metal included in the gate. The NFET channel is usually in a tensile state of stress, while the PFET channel is usually in a compressive state of stress. The methods of fabrication include the deposition of metal layers by physical vapor deposition (PVD), in such manner that the layers are in stressed states.

    摘要翻译: 具有单独应力通道区域的NFET和PFET器件及其制造方法。 公开了一种FET,其包括栅极,该栅极包括处于第一应力状态的金属。 FET还包括托管在单晶Si基材料中的沟道区域,该沟道区域被栅极覆盖并处于第二应力状态。 沟道区域的第二应力状态与包括在栅极中的金属的第一应力状态相反。 NFET通道通常处于应力的拉伸状态,而PFET通道通常处于应力的压缩状态。 制造方法包括通过物理气相沉积(PVD)沉积金属层,使得层处于应力状态。

    PE-ALD of TaN diffusion barrier region on low-k materials
    85.
    发明授权
    PE-ALD of TaN diffusion barrier region on low-k materials 有权
    低k材料的TaN扩散阻挡区的PE-ALD

    公开(公告)号:US07211507B2

    公开(公告)日:2007-05-01

    申请号:US10709865

    申请日:2004-06-02

    IPC分类号: H01L21/285

    摘要: Methods of depositing a tantalum-nitride (TaN) diffusion barrier region on low-k materials. The methods include forming a protective layer on the low-k material substrate by performing plasma-enhanced atomic layer deposition (PE-ALD) from tantalum-based precursor and a nitrogen plasma in a chamber. The protective layer has a nitrogen content greater than its tantalum content. A substantially stoichiometric tantalum-nitride layer is then formed by performing PE-ALD from the tantalum-based precursor and a plasma including hydrogen and nitrogen. The invention also includes the tantalum-nitride diffusion barrier region so formed. In one embodiment, the metal precursor includes tantalum penta-chloride (TaCl5). The invention generates a sharp interface between low-k materials and liner materials.

    摘要翻译: 在低k材料上沉积氮化钽(TaN)扩散阻挡区域的方法。 所述方法包括通过从钽基前体和室中的氮等离子体进行等离子体增强原子层沉积(PE-ALD)在低k材料衬底上形成保护层。 保护层的氮含量大于其钽含量。 然后通过从钽基前体和包括氢和氮的等离子体中进行PE-ALD形成基本上化学计量的氮化钽层。 本发明还包括如此形成的氮化钽 - 氮化物扩散阻挡区域。 在一个实施方案中,金属前体包括五氯化钽(TaCl 5 N 5)。 本发明在低k材料和衬垫材料之间产生尖锐的界面。

    Plasma enhanced ALD of tantalum nitride and bilayer
    86.
    发明授权
    Plasma enhanced ALD of tantalum nitride and bilayer 有权
    氮化钽和双层的等离子体增强ALD

    公开(公告)号:US07186446B2

    公开(公告)日:2007-03-06

    申请号:US10699226

    申请日:2003-10-31

    IPC分类号: H05H1/24

    摘要: A method to deposit TaN by plasma enhanced layer with various nitrogen content. Using a mixture of hydrogen and nitrogen plasma, the nitrogen content in the film can be controlled from 0 to N/Ta=1.7. By turning off the nitrogen flow during deposition of TaN, a TaN/Ta bilayer is easily grown, which has copper diffusion barrier properties superior to those of a single Ta layer or a single TaN layer.

    摘要翻译: 一种用各种氮含量的等离子体增强层沉积TaN的方法。 使用氢和氮等离子体的混合物,膜中的氮含量可以从0到N / Ta = 1.7。 通过在TaN沉积期间关闭氮气流,容易生长TaN / Ta双层,其具有优于单个Ta层或单个TaN层的铜扩散阻挡性能。

    Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target
    87.
    发明授权
    Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target 失效
    使用具有完全氧化的钙钛矿靶的溅射法形成钙钛矿薄膜的方法

    公开(公告)号:US06210545B1

    公开(公告)日:2001-04-03

    申请号:US09447626

    申请日:1999-11-23

    IPC分类号: C23C1434

    摘要: An inventive method for forming a thin film comprises the steps of preparing a sputter-target of a material which is fully oxidized and crystallized to a perovskite structure, sputter-depositing a thin film on top of a sample with the target in an inert gas atmosphere, and annealing the thin film in non-oxygen ambient. With the use of such a target, it is possible to reduce the negative ion effect during the sputter deposition and to eliminate the presence of oxygen during the annealing process.

    摘要翻译: 用于形成薄膜的本发明的方法包括以下步骤:制备完全氧化并结晶成钙钛矿结构的材料的溅射靶,在惰性气体气氛中用靶溅射沉积样品顶部的薄膜 ,并在非氧环境中退火薄膜。 通过使用这样的靶,可以减少在溅射沉积期间的负离子效应,并且消除退火过程中氧的存在。

    Hollow cathode
    88.
    发明授权
    Hollow cathode 失效
    空心阴极

    公开(公告)号:US4633129A

    公开(公告)日:1986-12-30

    申请号:US729028

    申请日:1985-04-30

    IPC分类号: H01J37/077 H01J1/02 H01J43/08

    CPC分类号: H01J1/025

    摘要: A long life high current density hollow cathode electron beam source for use in various E-beam apparatus which uses an ionizable gas within the hollow cathode. Bombardment of an electron emissive surface within the hollow cathode by energetic gas ions causes electrons to be emitted by secondary emission rather than thermionic emission effects. Once initialized by an external ionization voltage the device is essentially self sustaining and operates near room temperature, rather than at thermionic emission temperatures, and with reduced voltages.

    摘要翻译: 一种长寿命的高电流密度中空阴极电子束源,用于各种电子束装置,其使用空心阴极内的可电离气体。 通过能量气体离子轰击空心阴极内的电子发射表面,可以通过二次发射而不是热离子发射效应来发射电子。 一旦通过外部电离电压初始化,器件基本上是自我维持的,并且在室温附近操作,而不是在热离子发射温度下并且具有降低的电压。