公开(公告)号：US20210217805A1

公开(公告)日：2021-07-15

申请号：US17055383

申请日：2019-04-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Koji KUSUNOKI ,  Shingo EGUCHI ,  Yosuke TSUKAMOTO ,  Kazunori WATANABE ,  Kouhei TOYOTAKA

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/00

Abstract: A display device with high resolution is provided. Manufacturing cost of a display device using a micro LED as a display element is reduced. The display device includes a substrate, a plurality of transistors, and a plurality of light-emitting diodes. The plurality of light-emitting diodes are provided in a matrix over the substrate. Each of the plurality of transistors are electrically connected to at least one of the plurality of light-emitting diodes. The plurality of light-emitting diodes are positioned closer to the substrate than the plurality of transistors are. The plurality of light-emitting diodes emit light to the opposite side of the substrate.

公开(公告)号：US20200243371A1

公开(公告)日：2020-07-30

申请号：US16850185

申请日：2020-04-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Seiji YASUMOTO ,  Masataka SATO ,  Shingo EGUCHI ,  Kunihiko SUZUKI

IPC: H01L21/683 ,  H01L51/00 ,  H01L21/67 ,  H01L51/50 ,  B32B38/10

Abstract: To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.

公开(公告)号：US20200035949A1

公开(公告)日：2020-01-30

申请号：US16536609

申请日：2019-08-09

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Shingo EGUCHI

IPC: H01L51/52 ,  H01L27/32

Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

公开(公告)号：US20190179196A1

公开(公告)日：2019-06-13

申请号：US16324649

申请日：2017-08-03

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shingo EGUCHI ,  Hideaki KUWABARA ,  Kazune YOKOMIZO

IPC: G02F1/1333 ,  G09F9/30 ,  H01L29/786 ,  H01L51/50 ,  H05B33/02

Abstract: A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side. The first substrate and part of the second resin layer are bonded to each other with the adhesive layer.

公开(公告)号：US20180145277A1

公开(公告)日：2018-05-24

申请号：US15861899

申请日：2018-01-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Yasuhiro JINBO ,  Shingo EGUCHI

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5246 ,  H01L27/323 ,  H01L27/3244 ,  H01L33/56 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5256 ,  H01L2251/5338 ,  H01L2251/5361 ,  Y02E10/549

Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.

公开(公告)号：US20170177116A1

公开(公告)日：2017-06-22

申请号：US15378120

申请日：2016-12-14

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yasuhiro JINBO ,  Shingo EGUCHI ,  Hisao IKEDA ,  Tetsuji ISHITANI ,  Taisuke KAMADA

IPC: G06F3/044 ,  G09G3/36

CPC classification number: G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G09G3/3225 ,  G09G3/3648 ,  G09G2300/0426 ,  G09G2300/046 ,  G09G2360/144

Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.

公开(公告)号：US20150325631A1

公开(公告)日：2015-11-12

申请号：US14705774

申请日：2015-05-06

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Shingo EGUCHI ,  Toshiyuki ISA ,  Sayaka KAGA

IPC: H01L27/32 ,  H01L29/24 ,  H01L51/52 ,  H01L29/786

CPC classification number: H01L27/3244 ,  H01L27/323 ,  H01L27/3248 ,  H01L27/3258 ,  H01L29/24 ,  H01L29/786 ,  H01L29/7869 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253

Abstract: A highly reliable display device or electronic appliance is provided. The display device or a light-emitting device includes a substrate; a light-emitting element including a first electrode, an EL layer, and a second electrode; an organic resin film in contact with the light-emitting element; and an oxide semiconductor film in contact with the light-emitting element and the organic resin film. The oxide semiconductor film is in contact with the first electrode or the second electrode included in the light-emitting element. The oxide semiconductor film is in contact with an exposed portion of the organic resin film, typically, a side surface of the organic resin film. The light-emitting element and the organic resin film are positioned between the substrate and the oxide semiconductor film.

Abstract translation: 提供了高度可靠的显示装置或电子设备。 显示装置或发光装置包括：基板; 包括第一电极，EL层和第二电极的发光元件; 与发光元件接触的有机树脂膜; 以及与发光元件和有机树脂膜接触的氧化物半导体膜。 氧化物半导体膜与包含在发光元件中的第一电极或第二电极接触。 氧化物半导体膜与有机树脂膜的露出部分（通常为有机树脂膜的侧面）接触。 发光元件和有机树脂膜位于基板和氧化物半导体膜之间。

公开(公告)号：US20150059987A1

公开(公告)日：2015-03-05

申请号：US14468662

申请日：2014-08-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kayo KUMAKURA ,  Tomoya AOYAMA ,  Akihiro CHIDA ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract translation: 提供堆叠的处理装置。 堆叠包括彼此附接的两个基板，其间隙设置在它们的端部之间。 处理装置包括：固定机构，其固定堆叠的一部分;多个吸附夹具，其固定堆叠的一个基板的外周边缘;以及楔形夹具，其插入到堆叠的角部。 多个吸附夹具包括允许吸附夹具在垂直方向和水平方向上分开移动的机构。 处理装置还包括传感器，其感测堆叠中的端部之间的间隙的位置。 楔形夹具的尖端沿着形成在堆叠的端表面上的倒角移动。 楔形夹具插入到堆叠中的端部之间的间隙中。