摘要:
Memory devices and memory modules are disclosed. In one embodiment, a memory device includes a semiconductor substrate having a first edge and a second edge opposed to the first edge. A plurality of memory banks is disposed at a central portion of the semiconductor substrate, each memory bank including a plurality of memory cells. A plurality of input/output contacts is disposed between the first edge and the memory banks. Delay locked loop circuitry is disposed adjacent the first edge. A plurality of address and command contacts is disposed between the second edge and the memory banks.
摘要:
A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.
摘要:
The invention provides a memory circuit comprising a plurality of storage cells for storing data and redundant spare storage cells for replacing defective storage cells, and a memory access logic for accessing said storage cells connected to a replacement setting register which is writeable during operation of said memory circuit to store replacement settings.
摘要:
A memory apparatus includes at least two memory devices, each memory device including at least one memory bank. A method of operating the memory apparatus includes receiving a row activation command generated by a memory controller, wherein the row activation command includes a bank address. The method also includes activating a word line in a bank of one of the memory devices based on the row activation command, wherein the bank address is used to select the memory device.
摘要:
A buffer chip having a first data interface for receiving a data item which is to be written and for sending a data item which has been read, having a conversion unit for parallelizing the received data item and for serializing the data item which is to be sent, having a second data interface for writing the parallelized data item to a memory arrangement via a memory data bus and for receiving the data item read from the memory arrangement via the memory data bus; having a write buffer storage for buffer-storing the data item which is to be written, having a control unit in order, after reception of a data item which is to be written via the first data interface in line with a write command, to interrupt the data from being written from the write buffer storage via the second data interface upon a subsequent read command.
摘要:
A semiconductor memory arrangement for operation in a data memory system with at least one semiconductor memory chip for the storage of user data includes a memory controller for control of the at least one semiconductor memory chip, and at least one unidirectional signal line bus for control and address signals connected with the memory controller and branching at least once. The at least once branching bus directly connecting at least one semiconductor memory chip with the memory controller and connecting the semiconductor memory chips among each other.
摘要:
A semiconductor memory array for operation in a data storage system with at least one semiconductor memory chip for the storage of user data and one memory controller for control of the at least one semiconductor memory chip includes at least one unidirectional, serial signal line bus for control and address signals connected with the memory controller, directly connecting at least one semiconductor memory chip with the memory controller and serially connecting with each other the semiconductor memory chips among each other by 1-point-to-1-point connections.
摘要:
A method for setting an address of a rank in a memory module having a number of memory chips distributed along a byte lane includes setting the first memory chip of the byte lane to have a first rank address, generating a second rank address therein from the first rank address, and driving the second rank address to a second one of the memory chips. Alternatively, the first rank address may be driven to the second memory chip, and then, a second rank address is generated in that second memory chip. Further, the second memory chip is set to have the second rank address in response to the driving the second/first rank address. A power-up sequence after voltage supply, or command signals sent via a serial management bus or the command address bus can be used to initiate the setting of ranks. The rank addresses are re-driven to adjacent memory chips by DQ-lines along a byte lane.
摘要:
A semiconductor memory chip includes a re-drive unit for re-driving electrical signals to at least one semiconductor memory chip connected thereto. The re-drive unit includes a direct line connection between two connecting nodes, i.e., one input terminal and one output terminal of the semiconductor memory chip.
摘要:
A method for operating a semiconductor memory device system, and a semiconductor memory device system are disclosed. In one embodiment, the system includes a memory device and a control means connected with the memory device via a bus system, wherein a single signal line or a single signal line pair of the bus system is provided for the transmission of a status signal that signalizes that control data are to be transmitted from the memory device to the control means, or from the control means to the memory device.